公开(公告)号：US07099065B2

公开(公告)日：2006-08-29

申请号：US10437776

申请日：2003-05-13

Applicant: Satyadev Patel ,  Andrew G. Huibers ,  Christopher J. Spindt ,  Peter J. Heureux

Inventor： Satyadev Patel ,  Andrew G. Huibers ,  Christopher J. Spindt ,  Peter J. Heureux

IPC: G02B26/00

CPC classification number: B81B3/0051 ,  B81B2201/042 ,  B81B2203/058 ,  C10L1/026 ,  G02B26/0841

Abstract: A spatial light modulator is disclosed, along with methods for making such a modulator that comprises an array of mirror devices each having at least a first electrode and a second electrode. The first electrode is designated for driving the mirror plate of the micromirror device to an ON state, and the second electrode is designated for driving the mirror plate to an OFF state. The two electrodes can be disposed on the same side of the mirror plate but on opposite sides of the rotation axis of the mirror plate for driving the mirror plate to rotate in opposite directions. Alternatively, the two electrodes can be disposed on the opposite sides of the mirror plate, but on the same side of the rotation axis of the mirror plate for driving the mirror plate to rotate in opposite directions. The ON state and OFF state of the mirror plate can be defined by stops. The stops may be formed on substrate(s), hinge structures holding the mirror plates of the micromirror device and/or a desired location within the micromirror device. Alternatively, the electrodes for the ON state and the OFF state can be used as stops, either individually or in combination, or in combination with other component(s), such as substrate(s) of the micromirror device. The OFF state angle and the ON state angle are preferably different.

公开(公告)号：US20050286112A1

公开(公告)日：2005-12-29

申请号：US10947005

申请日：2004-09-21

Applicant: Satyadev Patel

Inventor： Satyadev Patel

IPC: G02B26/00 ,  G02B26/08

CPC classification number: G02B26/0841

Abstract: The micromirror device of the present invention comprises a reflective deflectable mirror plate and an addressing electrode provided for deflecting the mirror plate, wherein the addressing electrode is displaced along a direction perpendicular to the length of the hinge such that a portion of the addressing electrode is extended beyond the mirror plate.

Abstract translation: 本发明的微反射镜装置包括反射偏转镜板和用于偏转镜板的寻址电极，其中寻址电极沿垂直于铰链长度的方向移位，使得寻址电极的一部分延伸 超越镜面板。

公开(公告)号：US07787170B2

公开(公告)日：2010-08-31

申请号：US10869539

申请日：2004-06-15

Applicant: Satyadev Patel ,  Andrew G. Huibers ,  Peter Richards ,  Terry Tarn ,  Dietrich Dehlinger

Inventor： Satyadev Patel ,  Andrew G. Huibers ,  Peter Richards ,  Terry Tarn ,  Dietrich Dehlinger

IPC: G02B26/00

CPC classification number: G02B26/0841 ,  B81C3/001 ,  Y10S359/90 ,  Y10T156/10

Abstract: The present invention provides a microstructure device comprising multiple substrates with the components of the device formed on the substrates. In order to maintain uniformity of the gap between the substrates, a plurality of pillars is provided and distributed in the gap so as to prevent decrease of the gap size. The increase of the gap size can be prevented by bonding the pillars to the components of the microstructure. Alternatively, the increase of the gap size can be prevented by maintaining the pressure inside the gap below the pressure under which the microstructure will be in operation. Electrical contact of the substrates on which the micromirrors and electrodes are formed can be made through many ways, such as electrical contact areas, electrical contact pads and electrical contact springs.

Abstract translation: 本发明提供了一种微结构器件，其包括多个衬底，其中器件的部件形成在衬底上。 为了保持基板之间的间隙的均匀性，提供并分布在间隙中的多个支柱以防止间隙尺寸的减小。 可以通过将支柱结合到微结构的部件来防止间隙尺寸的增加。 或者，可以通过将间隙内的压力维持在微结构将在其中操作的压力以下来防止间隙尺寸的增加。 形成微反射镜和电极的基板的电接触可以通过许多方式制成，例如电接触区域，电接触焊盘和电接触弹簧。

公开(公告)号：US07751114B2

公开(公告)日：2010-07-06

申请号：US11774533

申请日：2007-07-06

Applicant: Satyadev Patel ,  James Dunphy ,  Peter Richards ,  Michel Combes

Inventor： Satyadev Patel ,  James Dunphy ,  Peter Richards ,  Michel Combes

IPC: G02B26/00 ,  G02B26/08 ,  G02F1/29

CPC classification number: G02B26/0841

Abstract: Disclosed herein are a system and apparatus for operating a device that comprises an array of micromirrors. The system and apparatus are usable for repairing stuck micromirrors of the micromirror array during the operation. The reparation applies, at the ON state, two consecutive refresh voltages to the mirror plates of the micromirrors in the array with the pulses being separated in time longer than the characteristic oscillation time of the micromirrors. The reparation can be applied independently to the micromirrors. Alternatively, the reparation can be incorporated with a bias inversion process.

Abstract translation: 本文公开了一种用于操作包括微镜阵列的装置的系统和装置。 该系统和装置可用于在操作期间修复微镜阵列的卡滞微镜。 在ON状态下，对阵列中的微镜的镜面板进行两次连续刷新电压的修正，其中脉冲在时间上比微镜的特征振荡时间长。 可以独立地对微镜进行修补。 或者，可以用偏置反转处理来结合修补。

公开(公告)号：US20080218842A1

公开(公告)日：2008-09-11

申请号：US12103333

申请日：2008-04-15

Applicant: Satyadev Patel ,  James Dumphy ,  Peter Richards ,  Michel Combes

Inventor： Satyadev Patel ,  James Dumphy ,  Peter Richards ,  Michel Combes

IPC: G02B26/08

CPC classification number: G02B26/0841

Abstract: Disclosed herein is method of operating a device that comprises an array of micromirrors. The method comprises a process usable for repairing stuck micromirrors of the micromirror array during the operation. The reparation process applies, at the ON state, two consecutive refresh voltages to the mirror plates of the micromirrors in the array with the pulses being separated in time longer than the characteristic oscillation time of the micromirrors. The reparation process can be applied independently to the micromirrors. Alternatively, the reparation process can be incorporated with a bias inversion process.

Abstract translation: 这里公开的是操作包括微镜阵列的装置的方法。 该方法包括可用于在操作期间修复微镜阵列的粘性微镜的过程。 修复过程在ON状态下，对阵列中的微镜的镜板施加两个连续的刷新电压，其中脉冲在时间上比微镜的特征振荡时间长。 修复过程可独立应用于微镜。 或者，修复过程可以结合偏置反转过程。

公开(公告)号：US20070258129A1

公开(公告)日：2007-11-08

申请号：US11774533

申请日：2007-07-06

Applicant: Satyadev Patel ,  James Dunphy ,  Peter Richards ,  Michel Combes

Inventor： Satyadev Patel ,  James Dunphy ,  Peter Richards ,  Michel Combes

IPC: G02B26/00

CPC classification number: G02B26/0841

Abstract: Disclosed herein are a system and apparatus for operating a device that comprises an array of micromirrors. The system and apparatus are usable for repairing stuck micromirrors of the micromirror array during the operation. The reparation applies, at the ON state, two consecutive refresh voltages to the mirror plates of the micromirrors in the array with the pulses being separated in time longer than the characteristic oscillation time of the micromirrors. The reparation can be applied independently to the micromirrors. Alternatively, the reparation can be incorporated with a bias inversion process.

Abstract translation: 本文公开了一种用于操作包括微镜阵列的装置的系统和装置。 该系统和装置可用于在操作期间修复微镜阵列的卡滞微镜。 在ON状态下，对阵列中的微镜的镜面板进行两次连续刷新电压的修正，其中脉冲在时间上比微镜的特征振荡时间长。 可以独立地对微镜进行修补。 或者，可以用偏置反转处理来结合修补。

公开(公告)号：US20070119814A1

公开(公告)日：2007-05-31

申请号：US11627026

申请日：2007-01-25

Applicant: Satyadev Patel ,  Gregory Schaadt ,  Douglas MacDonald ,  Niles MacDonald ,  Hongqin Shi

Inventor： Satyadev Patel ,  Gregory Schaadt ,  Douglas MacDonald ,  Niles MacDonald ,  Hongqin Shi

IPC: C03C25/68 ,  G01L21/30 ,  H01L21/306 ,  H01L21/461 ,  B44C1/22

CPC classification number: H01J37/32963 ,  B81C1/00476 ,  B81C1/00587 ,  B81C99/0065 ,  B81C2201/0132 ,  B81C2201/0138 ,  H01J37/32449 ,  H01J37/32935

Abstract: Processes for the removal of a layer or region from a workpiece material by contact with a process gas in the manufacture of a microstructure are enhanced by the ability to accurately determine the endpoint of the removal step. A vapor phase etchant is used to remove a material that has been deposited on a substrate, with or without other deposited structure thereon. By creating an impedance at the exit of an etching chamber (or downstream thereof), as the vapor phase etchant passes from the etching chamber, a gaseous product of the etching reaction is monitored; and the endpoint of the removal process can be determined. The vapor phase etching process can be flow through, a combination of flow through and pulse, or recirculated back to the etching chamber

Abstract translation: 通过与制造微结构中的工艺气体接触从工件材料去除层或区域的工艺通过精确地确定去除步骤的终点的能力增强。 气相蚀刻剂用于去除已经沉积在基底上的材料，其上具有或不具有其它沉积结构。 通过在蚀刻室（或其下游）的出口处产生阻抗，当气相蚀刻剂从蚀刻室通过时，监测蚀刻反应的气态产物; 并且可以确定去除过程的终点。 气相蚀刻工艺可以流过，流过和脉冲的组合，或再循环回蚀刻室