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    Header embedded filter for implantable medical device
    103.
    发明授权
    Header embedded filter for implantable medical device 有权
    用于植入式医疗设备的头部嵌入式过滤器

    公开(公告)号：US08577453B1

    公开(公告)日：2013-11-05

    申请号：US13946595

    申请日：2013-07-19

    Applicant: Greatbatch Ltd.

    Inventor： Robert A. Stevenson ,  Warren S. Dabney ,  Christine A. Frysz ,  Richard L. Brendel

    IPC: A61N1/05

    CPC classification number: A61N1/05 ,  A61B5/04 ,  A61B5/0428 ,  A61B5/7203 ,  A61B2562/18 ,  A61M5/14276 ,  A61M5/172 ,  A61N1/086 ,  A61N1/37 ,  A61N1/3754

    Abstract: A header block is configured to be attachable to an implantable medical device. The header block includes a header block body and a connection port disposed in the header block body configured to receive an implantable lead. A conductor is disposed in the header block body electrically coupled to the connection port at a first end and connectable at a second end to the implantable medical device. An impeding device is electrically coupled in series along the length of the conductor and disposed within the header block body. The impeding device is configured to raise the high-frequency impedance of the conductor. The impeding device may include a bandstop filter or an L-C tank circuit.

    Abstract translation: 标题块被配置为可附接到可植入医疗装置。 标题块包括标题块主体和设置在头部块主体中的配置为接收可植入引线的连接端口。 导体被布置在头部块体中，第一端部电耦合到连接端口，并且在第二端处可连接到可植入医疗装置。 阻碍装置沿着导体的长度串联电耦合并设置在集管块体内。 阻碍装置被配置为提高导体的高频阻抗。 阻碍装置可以包括带阻滤波器或L-C槽电路。

    Single-Sided Or Single-Ended System Ground For A Rectangular Or Square AIMD EMI Filter Capacitor
    106.
    发明申请
    Single-Sided Or Single-Ended System Ground For A Rectangular Or Square AIMD EMI Filter Capacitor 有权

    公开(公告)号：US20250144431A1

    公开(公告)日：2025-05-08

    申请号：US18921348

    申请日：2024-10-21

    Applicant: Greatbatch Ltd.

    Inventor： Robert A. Stevenson

    IPC: A61N1/375

    Abstract: A filtered feedthrough comprises an insulator sealed in a ferrule opening. A terminal pin sealed in an insulator via hole has a first end that extends outwardly beyond an insulator device side. A filter capacitor adjacent to the insulator device side has a dielectric supporting interleaved active and ground electrode plates. A passageway extending through the dielectric has an internal metallization. An external metallization is on a terminated portion as opposed to an unterminated portion of the dielectric outer surface. The capacitor ground electrode plates extend to the external metallization at the terminated portion, but they do not extend to the unterminated outer surface portion. The outwardly extending terminal pin end is connected to the internal metallization in the dielectric passageway which in turn is connected to the active electrode plates. A conductive material connects the capacitor external metallization at the terminated dielectric outer surface portion to a system ground.

    Electrical connection for an AIMD utilizing an anisotropic conductive layer
    107.
    发明授权
    Electrical connection for an AIMD utilizing an anisotropic conductive layer 有权

    公开(公告)号：US12064639B2

    公开(公告)日：2024-08-20

    申请号：US17165500

    申请日：2021-02-02

    Applicant: Greatbatch Ltd.

    Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Keith W. Seitz ,  Brian P Hohl ,  Marc Gregory Martino

    IPC: A61N1/375 ,  H01G4/008 ,  H01G4/12 ,  H01G4/236 ,  H01G4/35

    CPC classification number: A61N1/3754 ,  H01G4/008 ,  H01G4/1209 ,  H01G4/236 ,  H01G4/35

    Abstract: A feedthrough for an AIMD includes a ferrule with an insulator hermetically sealing a ferrule opening, both cooperatively separating a body fluid side from a device side. A circuit board disposed adjacent to the insulator device side has a ground plate or ground trace electrically connected to a circuit board ground conductive pathway disposed in a circuit board ground via hole. An anisotropic conductive layer disposed between the circuit board and the insulator device side has an electrically insulative matrix supporting a plurality of electrically conductive particles. The anisotropic conductive layer has a first thickness where at least one first electrically conductive particle is longitudinally aligned and in electrical contact with the ferrule and the circuit board ground conductive pathway electrically connected to the at least one circuit board ground plate or ground trace. The anisotropic conductive layer has a second, greater thickness where the ferrule and the circuit board ground conductive pathway are not longitudinally aligned, and no electrically conductive particles are in electrical contact with the ferrule and the circuit board ground conductive pathway.

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