公开(公告)号：US10927002B2

公开(公告)日：2021-02-23

申请号：US16402632

申请日：2019-05-03

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe

IPC: H01L29/82 ,  B81C1/00 ,  B81B3/00 ,  H04R19/04 ,  H04R7/10

Abstract: A membrane component comprises a membrane structure comprising an electrically conductive membrane layer. The electrically conductive membrane layer has a suspension region and a membrane region. In addition, the suspension region of the electrically conductive membrane layer is arranged on an insulation layer. Furthermore, the insulation layer is arranged on a carrier substrate. Moreover, the membrane component comprises a counterelectrode structure. A cavity is arranged vertically between the counterelectrode structure and the membrane region of the electrically conductive membrane layer. In addition, an edge of the electrically conductive membrane layer projects laterally beyond an edge of the insulation layer by more than half of a vertical distance between the electrically conductive membrane layer and the counterelectrode structure.

公开(公告)号：US10829368B2

公开(公告)日：2020-11-10

申请号：US16509145

申请日：2019-07-11

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Stephan Pindl ,  Bernhard Knott ,  Carsten Ahrens

IPC: B81C1/00 ,  H04R19/00 ,  H04R31/00 ,  H04R19/04

Abstract: A method for manufacturing a MEMS device is disclosed. Moreover a MEMS device and a module including a MEMS device are disclosed. An embodiment includes a method for manufacturing MEMS devices includes forming a MEMS stack over a first main surface of a substrate, forming a polymer layer over a second main surface of the substrate and forming a first opening in the polymer layer and the substrate such that the first opening abuts the MEMS stack.

公开(公告)号：US10602290B2

公开(公告)日：2020-03-24

申请号：US16200072

申请日：2018-11-26

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Stefan Barzen

IPC: H04R31/00 ,  B81B3/00 ,  H04R19/00 ,  H04R1/08 ,  B81C1/00

Abstract: A MEMS device includes a backplate electrode and a membrane disposed spaced apart from the backplate electrode. The membrane includes a displaceable portion and a fixed portion. The backplate electrode and the membrane are arranged such that an overlapping area of the fixed portion of the membrane with the backplate electrode is less than maximum overlapping.

公开(公告)号：US10451589B2

公开(公告)日：2019-10-22

申请号：US15603531

申请日：2017-05-24

Applicant: Infineon Technologies AG

Inventor： David Tumpold ,  Alfons Dehe ,  Christoph Glacer

IPC: G01N29/24 ,  G01N29/34 ,  G01N29/22

Abstract: An acoustic wave detector may include: an exterior housing with an exterior housing wall, a gas chamber located within the exterior housing and configured to receive a gas therein. The exterior housing wall may include an aperture providing a gas passage between the gas chamber and the exterior of the acoustic wave detector. The acoustic wave detector may further include an excitation element configured to selectively excite gas molecules of a specific type in the gas received in the gas chamber in a time-varying fashion, thereby generating acoustic waves in the gas, and an acoustic wave sensor configured to detect the acoustic waves generated in the gas and acoustic waves generated outside of the acoustic wave detector. The acoustic wave sensor may have an acoustic port overlapping with the aperture in the exterior housing wall. The acoustic wave sensor may include a mechanical structure displaceable by the acoustic waves to be detected, wherein a displacement of the mechanical structure is indicative of characteristics of the acoustic waves to be detected.

公开(公告)号：US10397709B2

公开(公告)日：2019-08-27

申请号：US15876239

申请日：2018-01-22

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe

IPC: H04R9/00 ,  H04R29/00 ,  H04R19/04 ,  H04R7/12 ,  H04R7/18 ,  H04R7/20 ,  B81B3/00 ,  H04R19/00 ,  H04R7/24

Abstract: A microelectromechanical microphone includes a planar first electrode that is formed, at least in portions, from an electrically conductive material, a planar second electrode that is formed, at least in portions, from an electrically conductive material and that is arranged at a distance from the first electrode, a spacer that is arranged between the first electrode and the second electrode, and a membrane that is arranged in a space defined between the first electrode and the second electrode and that is displaceable in the direction of at least one of the first electrode or the second electrode. The membrane has a membrane passage opening through which the spacer extends. The space defined between the first and the second electrode, in which the membrane is arranged, has a gas exchange connection with the surroundings of the microphone.

公开(公告)号：US20190112182A1

公开(公告)日：2019-04-18

申请号：US16162026

申请日：2018-10-16

Applicant: Infineon Technologies AG

Inventor： Gerhard Metzger-Brueckl ,  Alfons Dehe ,  Uwe Hoeckele ,  Johann Strasser ,  Arnaud Walther

IPC: B81B7/02 ,  B81C1/00

Abstract: A method for sealing an access opening to a cavity comprises the following steps: providing a layer arrangement having a first layer structure and a cavity arranged adjacent to the first layer structure, wherein the first layer structure has an access opening to the cavity, performing a CVD layer deposition for forming a first covering layer having a layer thickness on the first layer structure having the access opening, and performing an HDP layer deposition with a first and second substep for forming a second covering layer on the first covering layer, wherein the first substep comprises depositing a liner material layer on the first covering layer, wherein the second substep comprises partly backsputtering the liner material layer and furthermore the first covering layer in the region of the access opening, and wherein the first and second substeps are carried out alternately and repeatedly a number of times.

公开(公告)号：US20190084827A1

公开(公告)日：2019-03-21

申请号：US16134355

申请日：2018-09-18

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Ulrich Krumbein ,  Gerhard Metzger-Brueckl ,  Johann Strasser ,  Juergen Wagner ,  Arnaud Walther

IPC: B81B7/02 ,  H04R19/00 ,  H04R19/04

CPC classification number: B81B7/02 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2203/04 ,  H04R1/2807 ,  H04R19/005 ,  H04R19/04

Abstract: In accordance with an embodiment, a MEMS microphone includes a sound detection unit having a first membrane, a second membrane arranged at a distance from the first membrane, a low-pressure region arranged between the first membrane and the second membrane, a gas pressure that is reduced in relation to normal pressure being present in said low-pressure region, a counter electrode arranged in the low-pressure region, and a sound through-hole, which extends through the sound detection unit in a thickness direction of the sound detection unit; and a valve provided at the sound through-hole, said valve being configured to adopt a plurality of valve states, wherein a predetermined degree of transmission of the sound through-hole to sound is assigned to each valve state

公开(公告)号：US10237670B2

公开(公告)日：2019-03-19

申请号：US14864746

申请日：2015-09-24

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe

IPC: H04R31/00 ,  H04R1/00 ,  H04R19/00 ,  H04R9/06 ,  H04R17/00 ,  H04R19/02

Abstract: A digital loudspeaker includes a substrate, a first stator fixed with respect to the substrate, a second stator fixed with respect to the substrate and spaced at a distance from the first stator, and a membrane between the first stator and the second stator. The membrane is displaceable between a first position in which the membrane mechanically contacts the first stator and a second position in which the membrane mechanically contacts the second stator. The first stator and the second stator are arranged to electrostatically move the membrane from a rest position spaced apart from the first position and the second position to the first position and the second position, respectively.

公开(公告)号：US20190039882A1

公开(公告)日：2019-02-07

申请号：US16157142

申请日：2018-10-11

Applicant: Infineon Technologies AG

Inventor： Horst Theuss ,  Alfons Dehe

IPC: B81B7/00

Abstract: A transducer structure is disclosed. The transducer structure may include a substrate with a MEMS structure located on a first side of the substrate and a lid coupled to the first side of the substrate and covering the MEMS structure. The substrate may include an electric contact which is laterally displaced from the lid on the first side of the substrate and electrically coupled to the MEMS structure.

公开(公告)号：US20180279055A1

公开(公告)日：2018-09-27

申请号：US15928821

申请日：2018-03-22

Applicant: Infineon Technologies AG

Inventor： Alfons Dehe ,  Yauheni Belahurau ,  Manuel Dorfmeister ,  Christoph Glacer ,  Manfred Kaltenbacher ,  Ulrich Schmid ,  Michael Schneider ,  David Tumpold

IPC: H04R19/02

CPC classification number: H04R19/02 ,  H04R1/005 ,  H04R17/00 ,  H04R2201/003

Abstract: A microelectromechanical loudspeaker may include: a plurality of elementary loudspeakers each including a drive unit and a diaphragm deflectable by the drive unit, and a controller configured to respectively supply control signals to the drive units. The drive units may be respectively configured to deflect the corresponding diaphragms according to the respective control signals supplied by the controller to generate acoustic waves. The control signal supplied to at least one control unit may have at least one local extremum and a global extremum of a curvature of the control signal with a highest absolute value of the curvature may be located at a position of the control signal preceding a position of the at least one local extremum of the control signal.