摘要:
This invention teaches methods and apparatus for forming self-aligned photosensitive material spacers about protruding structures in semiconductor devices. One embodiment of the invention is a method for forming a LDD structure, utilizing disposable photosensitive material spacers. A second embodiment of the invention comprises a method for forming a transistor, having salicided source/drain regions, utilizing photosensitive polyimide spacers for forming the salicided source/drain regions, without disposing of the spacers. A third embodiment of the invention comprises a method for creating an offset from a protruding structure on a semiconductor substrate, using disposable photosensitive material spacers.
摘要:
This invention teaches methods and apparatus for forming self-aligned photosensitive material spacers about protruding structures in semiconductor devices. One embodiment of the invention is a method for forming a lightly doped drain (LDD) structure, utilizing disposable photosensitive material spacers. A second embodiment of the invention comprises a method for forming a transistor, having salicided source/drain regions, utilizing photosensitive polyimide spacers for forming the salicided source/drain regions, without disposing of the spacers. A third embodiment of the invention comprises a method for creating an offset from a protruding structure on a semiconductor substrate, using disposable photosensitive material spacers.
摘要:
A method for fabricating photomasks including forming a resist layer located over a substrate, and heating the substrate at a temperature greater than the glass transition temperature of the resist, such that the resist layer flows. In this manner, defects such as pinholes within the resist layer are reduced.
摘要:
An improved photolithographic method employs a pattern of subresolution openings to enhance the printability of clear-field patterns. Incorporating a subresolution opening along the edges of the transmission areas prevents the printing of side lobe light and enables incorporation of a positive bias in the clear-field pattern. This in turn increases the lithographic process latitudes. The photomask must be significantly overexposed as a result of using a positive bias. To compensate for the impact of increased exposure on large transmission areas and avoid degradation of the corresponding resist, a pattern of subresolution openings is incorporated in the large transmission areas. The size and orientation of the subresolution areas creates a diffraction grating effect, reducing the exposure of the area under each transmission area.
摘要:
A subresolution grating composed of approximately circular contacts is fabricated around the border of the primary pattern of a photomask. As a result, resolution at the edges of the photomask pattern is improved when the pattern is printed on a wafer surface. In addition, the reduced leakage enables a more efficient use of the glass plate on which the photomask is fabricated as well as a more efficient use of the wafer surface as a result of being able to place patterns closer together.
摘要:
A method and apparatus for inspection of masks is disclosed herein. The method comprises exposing a wafer at a large magnification, while maintaining the same intensity profile obtain at standard exposure magnifications. The enlargened image exposed on a wafer is then examined for defects. The apparatus for inspecting masks includes an illumination system, an optical imaging system, and a detecting device. During inspection of the wafer, the enlarged image on the wafer is examined for defects. In evaluating potential defects, an exposed die is compared with another exposed die to determine the location of the defect on the mask. Alternatively, the examination of the image can occur with respect to a pattern of the image on a design database.
摘要:
The present invention is a multi layer reflective mask, and a method of fabricating the same, wherein the mask comprises a planar substrate, and a plurality of polished optically reflective regions fabricated on the substrate in an alternating pattern such that the top surface of the reflective regions are substantially co-planar. Each region has a defined phase shift and reflectivity, such that the optical properties of each region are independent of the respective height/thickness of the reflective materials applied to the substrate. Thus, normal planarization procedures performed to the top surface of the reflective regions are sufficient to obtain the optical characteristics of the mask, instead of having to perform a controlled etching process on the substrate to establish specific thicknesses of the reflective materials for defining the desired optical characteristics.
摘要:
A method for fabricating photomasks including forming a resist layer located over a substrate, and heating the substrate at a temperature greater than the glass transition temperature of the resist, such that the resist layer flows. In this manner, defects such as pinholes within the resist layer are reduced.
摘要:
A binary mask layout design arranged hierarchically to include a plurality of levels is modified to include optical proximity effect corrections or phase shifting layers. This is accomplished by beginning at the lowest level of the hierarchy and modifying elements or cells in the design. Any modifications that are uniform to corresponding cells throughout the level are placed in the same level in the hierarchy. Any modifications that apply only to selected cells in the level are placed in a higher level in the hierarchy. The process is repeated for all levels in the hierarchy.
摘要:
The present invention provides a method and apparatus of fabricating photomasks. The photomasks may be fabricated from a photomask blank structure having multiple layers. Upon patterning of these multiple layers by standard photolithographic processes, a photomask is created which is capable of phase-shifting incident light by various degrees, which may be 0.degree., 60.degree., 120.degree., and 180.degree..