公开(公告)号：US20210313116A1

公开(公告)日：2021-10-07

申请号：US16854887

申请日：2020-04-21

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Purakh Raj Verma ,  Ching-Yang Wen ,  XINGXING CHEN ,  CHAO JIN

IPC: H01G4/38 ,  H01L49/02 ,  H01L23/522 ,  H01L21/288 ,  H01L21/321 ,  H01L27/01 ,  H01L23/528 ,  H01G4/008

Abstract: A structure of capacitors connected in parallel includes a substrate. A trench embedded in the substrate. Numerous electrode layers respectively conformally fill in and cover the trench. The electrode layers are formed of numerous nth electrode layers, wherein n is a positive integer from 1 to M, and M is not less than 3. The nth electrode layer with smaller n is closer to the sidewall of the trench. When n equals to M, the Mth electrode layer fills in the center of the trench, and the top surface of the Mth electrode is aligned with the top surface of the substrate. A capacitor dielectric layer is disposed between the adjacent electrode layers. A first conductive plug contacts the nth electrode layer with odd-numbered n. A second conductive plug contacts the nth electrode layer with even-numbered n.

公开(公告)号：US20210296159A1

公开(公告)日：2021-09-23

申请号：US17340075

申请日：2021-06-06

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Purakh Raj Verma ,  Chia-Huei Lin ,  Kuo-Yuh Yang

IPC: H01L21/762 ,  H01L21/761 ,  H01L21/311 ,  H01L21/763 ,  H01L21/764 ,  H01L29/06 ,  H01L21/8234 ,  H01L29/66 ,  H01L27/088

Abstract: A semiconductor device includes: a metal-oxide semiconductor (MOS) transistor on a substrate; a deep trench isolation structure in the substrate and around the MOS transistor; and a trap rich isolation structure in the substrate and surrounding the deep trench isolation structure. Preferably, the deep trench isolation structure includes a liner in the substrate and an insulating layer on the liner, in which the top surfaces of the liner and the insulating layer are coplanar. The trap rich isolation structure is made of undoped polysilicon and the trap rich isolation structure includes a ring surrounding the deep trench isolation structure according to a top view.

公开(公告)号：US20210175371A1

公开(公告)日：2021-06-10

申请号：US16739022

申请日：2020-01-09

Applicant: United Microelectronics Corp.

Inventor： Purakh Raj Verma ,  Su Xing

IPC: H01L29/93 ,  H01L29/06 ,  H01L29/66

Abstract: A varactor structure includes a substrate. A first and second gate structure are disposed on the substrate. The first and second gate structures each include a base portion and a plurality of line portions connected thereto. The line portions of each of the first and second gate structures is alternately arranged. A meander diffusion region is formed in the substrate and surrounds the line portions. A first set of contact plugs is planned with at least two columns or rows and disposed on the base portions of the first and second gate structures. A second set of contact plugs is planned with at least two columns or rows and disposed on the meander diffusion region. A first conductive layer is disposed on a top end of the first set of contact plugs. A second conductive layer is disposed on a top end of the second set of contact plugs.

公开(公告)号：US20210013119A1

公开(公告)日：2021-01-14

申请号：US17037542

申请日：2020-09-29

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Purakh Raj Verma ,  Kuo-Yuh Yang ,  Chia-Huei Lin

IPC: H01L23/367 ,  H01L25/07 ,  H01L23/485 ,  H01L23/00 ,  H01L23/373 ,  H01L23/48 ,  H01L21/768 ,  H01L25/00

Abstract: A semiconductor structure with a heat dissipation structure includes a first device wafer includes a front side and a back side. A first transistor is disposed on the front side. The first transistor includes a first gate structure disposed on the front side. Two first source/drain doping regions are embedded within the first device wafer at two side of the first gate structure. A channel region is disposed between the two first source/drain doping regions and embedded within the first device wafer. A first dummy metal structure contacts the back side of the first device wafer, and overlaps the channel region.

公开(公告)号：US20200328311A1

公开(公告)日：2020-10-15

申请号：US16408415

申请日：2019-05-09

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Purakh Raj Verma ,  Ching-Yang Wen ,  Li Wang ,  Kai Cheng

IPC: H01L29/786 ,  H01L29/06 ,  H01L29/78 ,  H01L29/768

Abstract: A semiconductor device includes a buried dielectric layer, a first gate structure, a second gate structure, a first source/drain region, a second source/drain region, a first contact structure and a second contact structure. The first gate structure and the second gate structure disposed respectively in the front-side and backside of the dielectric layer, the first source/drain region and the second source/drain region are disposed between the first gate structure and the second gate structure, the first contact structure is disposed in the front-side of the dielectric layer and electrically coupled to the first source/drain region, the second contact structure is disposed in the backside of the dielectric layer and electrically coupled to the second source/drain region.

公开(公告)号：US20200098690A1

公开(公告)日：2020-03-26

申请号：US16167501

申请日：2018-10-22

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Purakh Raj Verma ,  Kuo-Yuh Yang ,  Chia-Huei Lin

IPC: H01L23/532 ,  H01L23/00 ,  H01L23/522 ,  H01L23/31 ,  H01L23/29

Abstract: A semiconductor structure with a high resistivity wafer includes a device wafer. The device wafer includes a front side and a back side. A semiconductor element is disposed on the front side. An interlayer dielectric covers the front side. A high resistivity wafer consists of an insulating material. A dielectric layer encapsulates the high resistivity wafer. The dielectric layer contacts the interlayer dielectric.

公开(公告)号：US20200098659A1

公开(公告)日：2020-03-26

申请号：US16170067

申请日：2018-10-25

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Purakh Raj Verma ,  Kuo-Yuh Yang ,  Chia-Huei Lin

IPC: H01L23/367 ,  H01L21/48

Abstract: A high resistivity wafer with a heat dissipation structure includes a high resistivity wafer and a metal structure. The high resistivity wafer includes a heat dissipation region and a device support region. The high resistivity wafer consists of an insulating material. The metal structure is only embedded within the heat dissipation region of the high resistivity wafer. The metal structure surrounds the device support region.

公开(公告)号：US10460980B2

公开(公告)日：2019-10-29

申请号：US15888072

申请日：2018-02-04

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Purakh Raj Verma ,  Chia-Huei Lin ,  Kuo-Yuh Yang

IPC: H01L21/762 ,  H01L21/761 ,  H01L21/311 ,  H01L21/763 ,  H01L21/764 ,  H01L29/06 ,  H01L21/8234 ,  H01L29/66

Abstract: A method for fabricating semiconductor device comprising the steps of: forming a first trench and a second trench in a substrate; forming a liner in the first trench and the second trench; forming a first patterned mask on the substrate to cover the second trench; removing the liner in the first trench; removing the first patterned mask; and forming an insulating layer in the first trench and the second trench to form a trap rich isolation structure in the first trench and a deep trench isolation structure in the second trench.

公开(公告)号：US20190206720A1

公开(公告)日：2019-07-04

申请号：US15888072

申请日：2018-02-04

Applicant: United Microelectronics Corp.

Inventor： Purakh Raj Verma ,  Chia-Huei Lin ,  Kuo-Yuh Yang

IPC: H01L21/762 ,  H01L21/764 ,  H01L21/311 ,  H01L21/763 ,  H01L21/761

Abstract: A method for fabricating semiconductor device comprising the steps of: forming a first trench and a second trench in a substrate; forming a liner in the first trench and the second trench; forming a first patterned mask on the substrate to cover the second trench; removing the liner in the first trench; removing the first patterned mask; and forming an insulating layer in the first trench and the second trench to form a trap rich isolation structure in the first trench and a deep trench isolation structure in the second trench.