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    All-polyethylene laminate film structures having barrier adhesive layer
    105.
    发明授权
    All-polyethylene laminate film structures having barrier adhesive layer 有权

    公开(公告)号：US11858242B2

    公开(公告)日：2024-01-02

    申请号：US17852446

    申请日：2022-06-29

    申请人： Dow Global Technologies LLC

    发明人： Kalyan Sehanobish ,  Amira A. Marine ,  Daniele Vinci

    IPC分类号： B32B27/32 ,  B32B7/12 ,  B32B27/08

    CPC分类号： B32B27/32 ,  B32B7/12 ,  B32B27/08 ,  B32B2250/242 ,  B32B2307/72 ,  B32B2307/7244 ,  B32B2553/00

    摘要： Recyclable, all-polyethylene laminate film structures suitable for use in a flexible packaging are disclosed. The structures comprise a film layer consisting essentially of an ethylene-based polymer and a barrier adhesive layer disposed on a surface of the film layer, wherein the structure has an oxygen transmission rate not greater than 100 O2/m2/day, measured according to ASTM Method D3985. Recyclable, all-polyethylene laminate film structures suitable for use in a flexible packaging are disclosed comprising (A) a sealant film layer consisting essentially of an ethylene-based polymer, (B) an intermediate film layer consisting essentially of an ethylene-based polymer, (C) a structural film layer consisting essentially of an ethylene-based polymer, and (D) a barrier adhesive layer, wherein the recyclable, all-polyethylene laminate film structure has an oxygen transmission rate not greater than 100 O2/m2/day, measured according to ASTM Method D3985. Articles comprising the disclosed laminate film structures, such as flexible packaging and stand-up pouches, are also disclosed.

    POLYETHYLENE COMPOSITIONS FOR CLOSURE APPLICATIONS
    109.
    发明公开
    POLYETHYLENE COMPOSITIONS FOR CLOSURE APPLICATIONS 审中-公开

    公开(公告)号：US20230407067A1

    公开(公告)日：2023-12-21

    申请号：US18251005

    申请日：2021-12-16

    申请人： Dow Global Technologies LLC

    发明人： Keran Lu ,  Russell T. Cooper ,  Mubashir Qamar Ansari ,  Fengyi Zhang

    IPC分类号： C08L23/08 ,  C08L23/06 ,  B29C45/00

    CPC分类号： C08L23/0815 ,  C08L23/06 ,  B29C45/0001 ,  C08L2205/025 ,  C08L2205/06 ,  B29K2023/0658

    摘要： A polyethylene composition comprising suitable for use in injection molding, the polyethylene composition comprising: from 2 wt. % to 25 wt. % of a high molecular weight component consisting of an ethylene/alpha-olefin copolymer, wherein the high molecular weight component has a density of from 0.910 g/cc to 0.971 g/cc, a melt index (12.16) of greater than 0.5 g/10 min to less than 1.5 g/10 min, a molecular weight distribution (Mw/Mn) of 6.0 to 20.0; from 75 wt. % to 98 wt. % a low molecular weight component consisting of an ethylene homopolymer or an ethylene/alpha-olefin copolymer, wherein the ethylene homopolymer or an and a molecular weight distribution (Mw/Mn) of less than 6.0; wherein the polyethylene composition has a shrinkage anisotropy that is less than the shrinkage anisotropy of the low molecular weight component.