Abstract:
An antistatic resin composition is provided, from which a thermoplastic resin molded article having a sufficient permanent antistatic property without impairing an excellent mechanical property or a good appearance of the molded article, even in a case that the content of an antistatic agent contained in the composition is less than that in a conventional composition, is provided. The antistatic resin composition contains an antistatic agent (A) and a thermoplastic resin (B), in which a melt viscosity ratio of the thermoplastic resin (B) to the antistatic agent (A) at 220° C. is 0.5-5 and an absolute value of a difference between solubility parameters (SPs) of the antistatic agent (A) and the thermoplastic resin (B) is 1.0-3.0. The antistatic resin molded article is obtained by molding the antistatic resin composition.
Abstract:
An object of the present invention is to provide an adhesive tape for processing a semiconductor wafer or the like, which is capable of inhibiting electrical charging in a stable manner. The adhesive tape (dicing tape) (100) for processing a semiconductor wafer or the like includes a base layer (200) and an adhesive layer (300). The adhesive layer (300) is formed on the base layer (200). The adhesive layer (300) contains a curing component that cures the adhesive layer (300). The base layer (200) is composed mainly of a resin. A polymer-type antistatic agent is kneaded into the resin. The polymer-type antistatic agent has an MFR, measured under measurement conditions of 190° C. and 21.18 N in accordance with JIS K7210, of at least 10.0 g/10 min and not more than 15.0 g/10 min.
Abstract:
The present invention relates to a novel process for the manufacture of nonwoven surfaces.It relates more particularly to a process for the manufacture of nonwoven surfaces by the process of direct melt spinning of continuous filaments arranged in the form of a sheet. This process employs a composition based on a thermoplastic polymer exhibiting an electrical conductivity sufficient to prevent the formation of electrostatic charges or to allow their removal during the spinning process.
Abstract:
The application relates to polymeric antistatic agents for use in polymer moulding compositions, as well as moulding compositions containing these antistatic agents, the antistatic agents having good compounding properties and being inexpensive to produce, wherein the antistatic agent is an antistatic agent of the general formula (I) having a polymeric cationic polyelectrolyte constituent produced from diallyldialkylammonium compounds and an anionic counterion A−, in which R1 is uniformly or mutually independently C1-C18 alkyl, A− is an acid anion, and n is a whole number from 10 to 1000.
Abstract:
An antistatic resin composition is provided, from which a thermoplastic resin molded article having a sufficient permanent antistatic property without impairing an excellent mechanical property or a good appearance of the molded article, even in a case that the content of an antistatic agent contained in the composition is less than that in a conventional composition, is provided. The antistatic resin composition contains an antistatic agent (A) and a thermoplastic resin (B), in which a melt viscosity ratio of the thermoplastic resin (B) to the antistatic agent (A) at 220° C. is 0.5-5 and an absolute value of a difference between solubility parameters (SPs) of the antistatic agent (A) and the thermoplastic resin (B) is 1.0-3.0. The antistatic resin molded article is obtained by molding the antistatic resin composition.
Abstract:
The invention relates to a novel method for the production of non-woven surfaces, in particular, a method for the production of non-woven surfaces by the process of direct spinning of molten filaments arranged in the form of a mat. Said method makes use of a composition of thermoplastic polymers with an electrical conductivity sufficient to either avoid the build-up of electrostatic charges, or to permit the removal thereof during the spinning process.
Abstract:
The present invention relates to an antistatic polymer composition and more specifically to a composition comprising a thermoplastic polymer (A) and a copolymer (B) comprising polyamide blocks and polyether blocks comprising essentially ethylene oxide units —(C2H4—O)—, the copolymer (B) having a melting temperature of between 80 and 150° C. It is of use for the polymers (A) which are heat-sensitive or which are processed at low temperature.
Abstract translation:本发明涉及抗静电聚合物组合物,更具体地说涉及包含热塑性聚合物(A)和共聚物(B)的组合物,该组合物包含聚酰胺嵌段和基本上包含环氧乙烷单元(C 2 H 4 O) - ,共聚物( B)熔融温度在80-150℃之间。对于热敏性或在低温下加工的聚合物(A)是有用的。
Abstract:
The present invention relates to an antistatic polymer composition and more specifically to a composition comprising a thermoplastic polymer (A) and a copolymer (B) comprising polyamide blocks and polyether blocks comprising essentially ethylene oxide units null(C2H4nullO)null, the copolymer (B) having a melting temperature of between 80 and 150null C. It is of use for the polymers (A) which are heat-sensitive or which are processed at low temperature.
Abstract translation:本发明涉及抗静电聚合物组合物,更具体地说涉及包含热塑性聚合物(A)和共聚物(B)的组合物,该组合物包含聚酰胺嵌段和基本上包含环氧乙烷单元(C 2 H 4 O) - ,共聚物( B)熔融温度在80-150℃之间。对于热敏性或在低温下加工的聚合物(A)是有用的。
Abstract:
A blend of polymeric materials comprising (A) of from about 1 to about 99.99 weight percent based on the combined weights of Components A, B and C of at least one substantially random interpolymer; and wherein said interpolymer; (1) contains of from about 0.5 to about 65 mole percent of polymer units derived from; (a) at least one vinyl or vinylidene aromatic monomer, or (b) at least one hindered aliphatic or cycloaliphatic vinyl or vinylidene monomer, or (c) a combination of at least one vinyl or vinylidene aromatic monomer and at least one hindered aliphatic or cycloaliphatic vinyl or vinylidene monomer; (2) contains of from about 35 to about 99.5 mole percent of polymer units derived from at least one aliphatic null-olefin having from 2 to 20 carbon atoms; (3) has a molecular weight (Mn) greater than about 1,000; (4) has a melt index (I2) of from about 0.01 to about 1,000; (5) has a molecular weight distribution (Mw/Mn) of from about 1.5 to about 20; and (B) of from about 99 to about 0.01 weight percent based on the combined weights of Components A, B, and C of one or more conductive additives and/or one or more additives with high magnetic permeability; and (C) of from 0 to about 98.99 weight percent based on the combined weights of Components A, B, and C of one or more polymers other than A.