Antistatic resin composition
    101.
    发明授权
    Antistatic resin composition 有权
    抗静电树脂组合物

    公开(公告)号:US08859647B2

    公开(公告)日:2014-10-14

    申请号:US13384598

    申请日:2010-07-30

    Abstract: An antistatic resin composition is provided, from which a thermoplastic resin molded article having a sufficient permanent antistatic property without impairing an excellent mechanical property or a good appearance of the molded article, even in a case that the content of an antistatic agent contained in the composition is less than that in a conventional composition, is provided. The antistatic resin composition contains an antistatic agent (A) and a thermoplastic resin (B), in which a melt viscosity ratio of the thermoplastic resin (B) to the antistatic agent (A) at 220° C. is 0.5-5 and an absolute value of a difference between solubility parameters (SPs) of the antistatic agent (A) and the thermoplastic resin (B) is 1.0-3.0. The antistatic resin molded article is obtained by molding the antistatic resin composition.

    Abstract translation: 提供一种抗静电树脂组合物,即使在包含在组合物中的抗静电剂的含量的情况下,具有足够的永久抗静电性而不损害机械性能或模制品外观的热塑性树脂模塑制品 比常规组合物小。 抗静电性树脂组合物含有热塑性树脂(B)与抗静电剂(A)在220℃下的熔融粘度比为0.5-5的抗静电剂(A)和热塑性树脂(B),和 抗静电剂(A)和热塑性树脂(B)的溶解度参数(SP)之差的绝对值为1.0-3.0。 抗静电树脂成型体通过模制抗静电树脂组合物获得。

    ADHESIVE TAPE FOR PROCESSING SEMICONDUCTOR WAFER AND THE LIKE
    102.
    发明申请
    ADHESIVE TAPE FOR PROCESSING SEMICONDUCTOR WAFER AND THE LIKE 审中-公开
    用于加工半导体波形的粘合带和类似物

    公开(公告)号:US20140011026A1

    公开(公告)日:2014-01-09

    申请号:US14006190

    申请日:2012-03-22

    Abstract: An object of the present invention is to provide an adhesive tape for processing a semiconductor wafer or the like, which is capable of inhibiting electrical charging in a stable manner. The adhesive tape (dicing tape) (100) for processing a semiconductor wafer or the like includes a base layer (200) and an adhesive layer (300). The adhesive layer (300) is formed on the base layer (200). The adhesive layer (300) contains a curing component that cures the adhesive layer (300). The base layer (200) is composed mainly of a resin. A polymer-type antistatic agent is kneaded into the resin. The polymer-type antistatic agent has an MFR, measured under measurement conditions of 190° C. and 21.18 N in accordance with JIS K7210, of at least 10.0 g/10 min and not more than 15.0 g/10 min.

    Abstract translation: 本发明的目的是提供一种用于处理半导体晶片等的胶带,其能够以稳定的方式抑制充电。 用于处理半导体晶片等的胶带(切割带)(100)包括基层(200)和粘合剂层(300)。 粘合剂层(300)形成在基底层(200)上。 粘合剂层(300)含有固化粘合剂层(300)的固化成分。 基层(200)主要由树脂构成。 将聚合物型抗静电剂捏合到树脂中。 聚合物型抗静电剂的MFR在根据JIS K7210的190℃和21.18N的测量条件下测定为至少10.0g / 10min且不超过15.0g / 10min。

    POLYMERIC ANTI-STATIC AGENT
    104.
    发明申请
    POLYMERIC ANTI-STATIC AGENT 有权
    聚合物抗静电剂

    公开(公告)号:US20130109809A1

    公开(公告)日:2013-05-02

    申请号:US13642304

    申请日:2011-04-20

    Abstract: The application relates to polymeric antistatic agents for use in polymer moulding compositions, as well as moulding compositions containing these antistatic agents, the antistatic agents having good compounding properties and being inexpensive to produce, wherein the antistatic agent is an antistatic agent of the general formula (I) having a polymeric cationic polyelectrolyte constituent produced from diallyldialkylammonium compounds and an anionic counterion A−, in which R1 is uniformly or mutually independently C1-C18 alkyl, A− is an acid anion, and n is a whole number from 10 to 1000.

    Abstract translation: 本申请涉及用于聚合物模塑组合物的聚合抗静电剂,以及含有这些抗静电剂的成型组合物,抗静电剂具有良好的配混性能并且制备便宜,其中抗静电剂是通式的抗静电剂( I)具有由二烯丙基二烷基铵化合物和阴离子抗衡离子A产生的聚合物阳离子聚电解质组分,其中R 1均匀或相互独立地为C1-C18烷基,A-为酸性阴离子,n为10-1000的整数。

    ANTISTATIC RESIN COMPOSITION
    105.
    发明申请
    ANTISTATIC RESIN COMPOSITION 有权
    抗静电树脂组合物

    公开(公告)号:US20120128945A1

    公开(公告)日:2012-05-24

    申请号:US13384598

    申请日:2010-07-30

    Abstract: An antistatic resin composition is provided, from which a thermoplastic resin molded article having a sufficient permanent antistatic property without impairing an excellent mechanical property or a good appearance of the molded article, even in a case that the content of an antistatic agent contained in the composition is less than that in a conventional composition, is provided. The antistatic resin composition contains an antistatic agent (A) and a thermoplastic resin (B), in which a melt viscosity ratio of the thermoplastic resin (B) to the antistatic agent (A) at 220° C. is 0.5-5 and an absolute value of a difference between solubility parameters (SPs) of the antistatic agent (A) and the thermoplastic resin (B) is 1.0-3.0. The antistatic resin molded article is obtained by molding the antistatic resin composition.

    Abstract translation: 提供一种抗静电树脂组合物,即使在包含在组合物中的抗静电剂的含量的情况下,具有足够的永久抗静电性而不损害机械性能或模制品外观的热塑性树脂模塑制品 比常规组合物小。 抗静电性树脂组合物含有热塑性树脂(B)与抗静电剂(A)在220℃下的熔融粘度比为0.5-5的抗静电剂(A)和热塑性树脂(B),和 抗静电剂(A)和热塑性树脂(B)的溶解度参数(SP)之差的绝对值为1.0-3.0。 抗静电树脂成型体通过模制抗静电树脂组合物获得。

    Antistatic polymer compositions
    108.
    发明授权
    Antistatic polymer compositions 有权
    抗静电聚合物组合物

    公开(公告)号:US06784257B2

    公开(公告)日:2004-08-31

    申请号:US09556977

    申请日:2000-04-24

    Abstract: The present invention relates to an antistatic polymer composition and more specifically to a composition comprising a thermoplastic polymer (A) and a copolymer (B) comprising polyamide blocks and polyether blocks comprising essentially ethylene oxide units —(C2H4—O)—, the copolymer (B) having a melting temperature of between 80 and 150° C. It is of use for the polymers (A) which are heat-sensitive or which are processed at low temperature.

    Abstract translation: 本发明涉及抗静电聚合物组合物,更具体地说涉及包含热塑性聚合物(A)和共聚物(B)的组合物,该组合物包含聚酰胺嵌段和基本上包含环氧乙烷单元(C 2 H 4 O) - ,共聚物( B)熔融温度在80-150℃之间。对于热敏性或在低温下加工的聚合物(A)是有用的。

    ANTISTATIC POLYMER COMPOSITIONS
    109.
    发明申请
    ANTISTATIC POLYMER COMPOSITIONS 有权
    抗静电聚合物组合物

    公开(公告)号:US20030139539A1

    公开(公告)日:2003-07-24

    申请号:US09556977

    申请日:2000-04-24

    Abstract: The present invention relates to an antistatic polymer composition and more specifically to a composition comprising a thermoplastic polymer (A) and a copolymer (B) comprising polyamide blocks and polyether blocks comprising essentially ethylene oxide units null(C2H4nullO)null, the copolymer (B) having a melting temperature of between 80 and 150null C. It is of use for the polymers (A) which are heat-sensitive or which are processed at low temperature.

    Abstract translation: 本发明涉及抗静电聚合物组合物,更具体地说涉及包含热塑性聚合物(A)和共聚物(B)的组合物,该组合物包含聚酰胺嵌段和基本上包含环氧乙烷单元(C 2 H 4 O) - ,共聚物( B)熔融温度在80-150℃之间。对于热敏性或在低温下加工的聚合物(A)是有用的。

    Compositions of interpolymers of alpha-olefin monomers with one or more vinyl or vinylidene aromatic monomers and/or one or more hindered aliphatic or cycloaliphatic vinyl or vinylidene monomers blended with a conductive additive
    110.
    发明申请
    Compositions of interpolymers of alpha-olefin monomers with one or more vinyl or vinylidene aromatic monomers and/or one or more hindered aliphatic or cycloaliphatic vinyl or vinylidene monomers blended with a conductive additive 审中-公开
    α-烯烃单体与一种或多种乙烯基或亚乙烯基芳族单体和/或一种或多种受阻的脂族或脂环族乙烯基或亚乙烯基单体与导电添加剂共混的共聚体的组合物

    公开(公告)号:US20020132905A1

    公开(公告)日:2002-09-19

    申请号:US10090690

    申请日:2002-03-05

    Abstract: A blend of polymeric materials comprising (A) of from about 1 to about 99.99 weight percent based on the combined weights of Components A, B and C of at least one substantially random interpolymer; and wherein said interpolymer; (1) contains of from about 0.5 to about 65 mole percent of polymer units derived from; (a) at least one vinyl or vinylidene aromatic monomer, or (b) at least one hindered aliphatic or cycloaliphatic vinyl or vinylidene monomer, or (c) a combination of at least one vinyl or vinylidene aromatic monomer and at least one hindered aliphatic or cycloaliphatic vinyl or vinylidene monomer; (2) contains of from about 35 to about 99.5 mole percent of polymer units derived from at least one aliphatic null-olefin having from 2 to 20 carbon atoms; (3) has a molecular weight (Mn) greater than about 1,000; (4) has a melt index (I2) of from about 0.01 to about 1,000; (5) has a molecular weight distribution (Mw/Mn) of from about 1.5 to about 20; and (B) of from about 99 to about 0.01 weight percent based on the combined weights of Components A, B, and C of one or more conductive additives and/or one or more additives with high magnetic permeability; and (C) of from 0 to about 98.99 weight percent based on the combined weights of Components A, B, and C of one or more polymers other than A.

    Abstract translation: 聚合材料的混合物,其包含(A)约1至约99.99重量%,基于组分A,B和C的至少一种基本上无规的互聚物的组合重量; 并且其中所述互聚物; (1)含有约0.5至约65摩尔%的衍生自以下的聚合物单元: (a)至少一种乙烯基或亚乙烯基芳族单体,或(b)至少一种受阻脂族或脂环族乙烯基或亚乙烯基单体,或(c)至少一种乙烯基或亚乙烯基芳族单体和至少一种受阻脂族或 脂环族乙烯基或亚乙烯基单体; (2)含有约35-约99.5摩尔%的衍生自至少一种具有2-20个碳原子的脂肪族α-烯烃的聚合物单元; (3)的分子量(Mn)大于约1,000; (4)的熔体指数(I 2)为约0.01至约1,000; (5)的分子量分布(Mw / Mn)为约1.5至约20; 和(B)为约99至约0.01重量%,基于组分A,B和C的一种或多种导电添加剂和/或一种或多种具有高磁导率的添加剂的组合重量; 和(C)为0至约98.99重量%,基于除A以外的一种或多种聚合物的组分A,B和C的组合重量。

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