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公开(公告)号：US06323306B1
公开(公告)日：2001-11-27
申请号：US09149628
申请日：1998-09-08
IPC分类号： C08G6948
CPC分类号： C08F8/00 , C08F8/30 , C08F2800/20 , C08F2810/20 , C08F226/02 , C08F8/18
摘要： High molecular weight, water-soluble, cross-linked cationic polymers are prepared by reacting amine-functionalized cationic base polymers, in which the monomer units of the base polymer contain from about 0.05 to about 5.0% amine functionalized monomer units and from about 95 to about 99.95% additional monomer units, including cationic monomer units and optional non-cationic monomer units, with an amount of a cross-linking agent, reactive with the amines of the base polymer, providing between about 0.02 to about 3.0 equivalents of cross-linking agent reactive groups per each mole of amine. The polymers are useful as coagulants and as coatings.
摘要翻译： 高分子量的水溶性交联阳离子聚合物是通过使胺官能化的阳离子基础聚合物反应来制备的，其中基础聚合物的单体单元含有约0.05至约5.0％的胺官能化单体单元和约95至 约99.95％的另外的单体单元，包括阳离子单体单元和任选的非阳离子单体单元，具有一定量的与基础聚合物的胺反应的交联剂，提供约0.02至约3.0当量的交联 每个胺的反应活性基团。 聚合物可用作凝结剂和涂料。
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公开(公告)号：US06646060B1
公开(公告)日：2003-11-11
申请号：US09743408
申请日：2001-01-10
IPC分类号： C08G6948
CPC分类号： C08L67/02 , C08G73/1082 , C08L79/08 , Y10T428/31721
摘要： A resin composition containing a mixture produced by blending a crystalline polyamide expressed e.g. by formula (1) (in the formula, R1 is a bivalent organic aromatic group or aliphatic group having a carbon number of 2 to 30, optionally having substituent and optionally containing non-reactive groups such as ether group and aromatic group in the main chain, and Ar1 is an aromatic residue having a carbon number of 6 to 45 and optionally having substituent) with a thermoplastic polyester. The resin composition has excellent mechanical characteristics such as high elastic modulus, flow properties and heat-resistance and is suitable as a material for an electronic part for surface mounting.
摘要翻译： 一种树脂组合物，其含有通过将结晶聚酰胺共混而制得的混合物， 通式（1）（式中，R 1为二价有机芳香族基团或碳数为2〜30的脂肪族基，任选具有取代基且任选地含有非反应性基团，例如主链中的醚基和芳香族基团 ，Ar 1为碳原子数为6〜45，可以具有取代基的芳香族残基）与热塑性聚酯。 树脂组合物具有优异的机械特性，例如高弹性模量，流动性和耐热性，并且适合作为用于表面安装的电子部件的材料。
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公开(公告)号：US06465536B2
公开(公告)日：2002-10-15
申请号：US09921424
申请日：2001-08-02
IPC分类号： C08G6948
CPC分类号： C08J5/18 , C08G69/10 , C08G73/1092 , C08J2379/08 , D01F6/80 , Y10T428/2904 , Y10T428/2967 , Y10T428/2969 , Y10T428/31721
摘要： Superabsorbent fiber and film compositions comprising partially acidified, hydrolyzed, internally plasticized, crosslinked, superabsorbing fibers or film derived from polysuccinimide and processes for preparing same.
摘要翻译： 包含部分酸化的，水解的，内部增塑的，交联的超吸收纤维或衍生自聚琥珀酰亚胺的膜的超吸收性纤维和膜组合物及其制备方法。
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4.发明授权公开(公告)号：US06696529B1
公开(公告)日：2004-02-24
申请号：US09721666
申请日：2000-11-27
IPC分类号： C08G6948
CPC分类号： H05K1/056 , G03F7/037 , H05K1/024 , H05K1/0346 , H05K3/0023 , H05K3/28 , H05K3/4676 , H05K2201/0116 , H05K2201/0154 , Y10S522/903 , Y10S522/915 , Y10T428/31721
摘要： The present photosensitive resin composition 2 comprises a polyamic acid resin 4, a photosensitive agent, a dispersible compound 3 dispersible in the polyamic acid resin 4, and a solvent. The porous resin is obtained by removing the solvent from the photosensitive resin composition 2 to form a composition in which the dispersible compound 3 is dispersed in the polyamic acid resin 4, removing the dispersible compound to make the composition porous, and curing the porous photosensitive resin composition. The porous resin enables forming a fine circuit pattern and has a low dielectric constant and, when used as an insulating layer of a circuit board, brings about improved high frequency characteristics.
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5.发明授权公开(公告)号：US06403757B1
公开(公告)日：2002-06-11
申请号：US09462382
申请日：2000-01-07
IPC分类号： C08G6948
CPC分类号： C08G69/48 , C08G59/186 , C08G59/28 , C08L77/00 , H05K1/0346 , Y10T428/28
摘要： A reaction between epoxy-terminated polyamide and an acid anhydride compound can yield a modified polyamide resin, into resin skeleton of which carboxy groups to react with epoxy resin are introduced. An adhesive agent having excellent heat-resistance can be provided by the use of a composition of this modified polyamide resin and epoxy resin. Furthermore, an adhesive tape for a semiconductor device having excellent properties can be produced by laminating the adhesive agent and the protective layer on one surface of an organic insulated film.
摘要翻译： 环氧封端的聚酰胺与酸酐化合物之间的反应可以得到改性的聚酰胺树脂，引入其中与环氧树脂反应的羧基的树脂骨架。 通过使用该改性聚酰胺树脂和环氧树脂的组合物，可以提供耐热性优异的粘合剂。 此外，通过在有机绝缘膜的一个表面上层压粘合剂和保护层，可以制造具有优异性能的半导体器件用胶带。
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公开(公告)号：US06784257B2
公开(公告)日：2004-08-31
申请号：US09556977
申请日：2000-04-24
IPC分类号： C08G6948
CPC分类号： C08L77/06 , C08L77/00 , C08L77/12 , C08L101/00 , C08L2201/04 , C08L2666/02
摘要： The present invention relates to an antistatic polymer composition and more specifically to a composition comprising a thermoplastic polymer (A) and a copolymer (B) comprising polyamide blocks and polyether blocks comprising essentially ethylene oxide units —(C2H4—O)—, the copolymer (B) having a melting temperature of between 80 and 150° C. It is of use for the polymers (A) which are heat-sensitive or which are processed at low temperature.
摘要翻译： 本发明涉及抗静电聚合物组合物，更具体地说涉及包含热塑性聚合物（A）和共聚物（B）的组合物，该组合物包含聚酰胺嵌段和基本上包含环氧乙烷单元（C 2 H 4 O） - ，共聚物（ B）熔融温度在80-150℃之间。对于热敏性或在低温下加工的聚合物（A）是有用的。
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公开(公告)号：US06780963B2
公开(公告)日：2004-08-24
申请号：US10204319
申请日：2002-08-21
申请人： Masahiro Sawada , Kunihiro Ohuchi
发明人： Masahiro Sawada , Kunihiro Ohuchi
IPC分类号： C08G6948
CPC分类号： C08K3/2279 , C08G69/02 , C08G69/26 , C08G69/265 , C08K7/14 , C08L77/00
摘要： The polyamide resin composition of the invention is characterized by having a solder reflow heat-resistant temperature of not lower than 250° C. Since the polyamdie resin composition has low water absorption and is excellent in moldability, heat resistance, shape stability and mechanical strength, it can be suitably used for, for example, automobile parts and electric or electronic parts.
摘要翻译： 本发明的聚酰胺树脂组合物的特征在于其回焊耐热温度不低于250℃。由于聚酰胺树脂组合物的吸水性低，成型性，耐热性，形状稳定性和机械强度优异， 它可以适用于例如汽车部件和电气或电子部件。
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公开(公告)号：US06294645B1
公开(公告)日：2001-09-25
申请号：US08900805
申请日：1997-07-25
IPC分类号： C08G6948
CPC分类号： C08G73/028 , C08G73/0286 , D21H17/54 , D21H21/18
摘要： The invention relates to resin systems useful for imparting dry-strength to paper without substantially increasing the paper's wet-strength wherein the resin system comprises a cationic component and an anionic component. The invention also relates to the process for incorporating these resin systems into paper and the paper produced containing the resin systems.
摘要翻译： 本发明涉及可用于赋予纸张干强度而不显着提高纸的湿强度的树脂体系，其中树脂体系包含阳离子组分和阴离子组分。 本发明还涉及将这些树脂体系结合到纸中的方法以及含有树脂体系的纸。
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公开(公告)号：US06245874B1
公开(公告)日：2001-06-12
申请号：US09516484
申请日：2000-03-01
IPC分类号： C08G6948
CPC分类号： D21C5/02 , C08F8/44 , C08F220/56 , C08F2810/20 , D21H17/41 , D21H21/18 , D21H21/20 , Y02W30/648 , C08F8/28
摘要： A process for making paper with increased wet and dry strength by incorporating into the pulp suspension an ionic thermosettable resin which is the reaction product of dialdehyde and epihalohydrin, or epihalohydrin equivalent, with a copolymer containing monomer units derived by polymerization of monomers comprising acrylamide or alkyl-substituted acrylamide and diallylamine or an acid salt thereof. The paper has wet and dry strength greater than that of paper not containing the resin and has a higher repulpability index than wet strength paper that is essentially the same but contains conventional polyazetidinium ion containing wet strength resin instead of the ionic thermosettable resin.
摘要翻译： 通过向纸浆悬浮液中加入作为二醛和表卤代醇或表卤代醇当量的反应产物的离子可热固化树脂与含有由包含丙烯酰胺或烷基的单体聚合衍生的单体单元的共聚物制成具有增加的湿和干强度的方法 取代的丙烯酰胺和二烯丙基胺或其酸式盐。 该纸具有大于不含树脂的纸张的湿和干强度，并且具有比基本相同的湿强纸具有更高的再粘合指数，但包含含有常规的含有湿强度树脂的聚氮杂环丁烷离子代替离子可热固化树脂。
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