Abstract:
The present invention provides that a gas discharge panel substrate assembly comprising: electrodes formed on a substrate, a dielectric layer covering the electrodes, and a protective layer covering the dielectric layer and in contact with a discharge space, wherein the protective layer includes MgO and at least one compound selected from the group consisting of an Al compound, a Ti compound, a Y compound, a Zn compound, a Zr compound, a Ta compound and SiC.
Abstract:
An elastic wave device formed by bonding at least two surface acoustic wave devices by filling a resin therebetween is disclosed. Each of surface acoustic wave (SAW) devices includes a substrate; a functioning portion configured on the substrate; a recess that forms a space portion necessary for operation of the functioning portion, and a package that covers the surface of the substrate, and side faces of the package of the at least two SAW devices, corresponding to a portion bonded by filling of the resin between at least two SAW devices, includes the at least one cutout, and a first resin covers a portion of each of the side faces, the back faces, and the front faces of the substrate of the at least two SAW devices, and the first resin is filled with in the at least one cutout on the side faces of the package.
Abstract:
A transparent conductive film substantially made from In2O3, SnO2 and ZnO, having a molar ratio In/(In+Sn+Zn) of 0.65 to 0.8 and also a molar ratio Sn/Zn of 1 or less: The transparent conductive film has a favorable electric contact property with an electrode or line made from Al or Al alloy film. Further, a semiconductor device having an electrode or line made from the transparent conductive film has high reliability and productivity.
Abstract translation:基本上由In 2 N 3 O 3,SnO 2和ZnO组成的透明导电膜,其具有In /(In + Sn + Zn )为0.65〜0.8,Sn / Zn的摩尔比为1以下:透明导电膜与由Al或Al合金膜形成的电极或线具有良好的电接触性。 此外,具有由透明导电膜制成的电极或线的半导体器件具有高的可靠性和生产率。
Abstract:
A semiconductor device includes a semiconductor layer, an Al alloy film electrically connected to the semiconductor layer, and a transparent electrode layer directly contacting with the Al alloy film at least over an insulating substrate. The Al alloy film includes one or more kinds of elements selected from Fe, Co and Ni in total of 0.5 to 10 mol %, and a remaining substantially comprises Al.
Abstract:
A fine wiring line profile with satisfactory precision is formed from a multilayer film containing a first layer made of an aluminum alloy and a second layer formed thereon made of a molybdenum-niobium alloy, by simultaneously etching the two layers constituting the multilayer film through only one etching operation while preventing the upper layer from forming overhangs. An etchant for etching a multilayer film containing an aluminum alloy layer formed over a substrate and a molybdenum-niobium alloy layer formed thereon having a niobium content of 2-19% by weight contains an aqueous solution of an acid mixture containing phosphoric acid, nitric acid, and an organic acid; and a method of etching is carried out with this etchant. The etchant preferably has a phosphoric acid concentration Np of 50-75% by weight, a nitric acid concentration Nn of 2-15% by weight, and an acid ingredient concentration defined by Np+(98/63)Nn of 55-85% by weight.
Abstract:
A thin film transistor array substrate including an insulating substrate, a first metallic pattern formed on the insulating substrate, and an insulating film provided on the first metallic pattern. A semiconductor pattern is provided on the insulating film, and a second metallic pattern is provided on the semiconductor pattern. The second metallic pattern is surrounded by the semiconductor pattern.
Abstract:
An etchant for patterning thin metal films by wet etching and in particular, an etchant for use in producing semiconductor devices, such as semiconductor elements and liquid-crystal display elements, is for application to a multilayer film having a first layer made of aluminum or an aluminum alloy having formed thereon a second layer made of aluminum or an aluminum alloy each containing at least one element selected from nitrogen, oxygen, silicon, and carbon, and has a phosphoric acid content of from 35 to 65% by weight and a nitric acid content of from 0.5 to 15% by weight; and an etching is performed using the etchant.
Abstract:
A plasma display panel and method of producing same, in which projections are formed in grooves between partitions and phosphor layers are provided on the projections so as to increase the area where phosphor adheres and thereby to increase the luminance. A pair of substrates, opposed to each other, form a discharge space. Band-like partitions partitioning the discharge space are arranged on one of the back and front substrates. Wall-like projections, lower than the partitions but high enough to increase the area where phosphor layers are formed, are provided in the region where the discharge space is formed in the long grooves between the partitions or around the discharge space. Phosphor layers are formed in the grooves between the partitions including the wall-like projections.
Abstract:
A PDP having a novel cell structure that is superior in light emission efficiency is provided. A conductive film to be display electrodes X and Y is formed on side portions of a wall so that a main surface that contributes to discharge in the display electrode X is disposed so as to be opposed to a main surface of the neighboring display electrode Y via a gas space. A power supplying portion straddling plural cells in the display electrodes X and Y is provided on the upper surface of the wall. The display electrodes X and Y are covered with a dielectric layer that is thin at the side portion and thick at the top portion of the wall.
Abstract:
The gas discharge panel according to the present invention includes a pair of substrates, a plurality of barrier ribs, a sealing member, and two gas flow barriers. One of the substrates has a first vent hole and a second vent hole provided in a peripheral portion thereof for intercommunication between the inside and outside of the panel. The at least two gas flow barriers are provided between the sealing member and the barrier ribs located on opposite sides of an arrangement of the barrier ribs so that a gas introduced from the first vent hole flows through inter-rib spaces defined between adjacent pairs of barrier ribs and is expelled from the second vent hole.