Abstract:
A fastening device for mounting on a tube includes: a tubular sleeve member adapted to be sleeved around the tube, defining a reception space to snugly receiving the tube and a notch for access into the reception space and having an inner wall surface defining the reception space and formed with a press element; and a fixing element mounted on the sleeve member at the notch such that tightening of the fixing element relative to the sleeve member results in pressing of the press element against the tube to deform the tube to possess an outwardly minor protrusion for abutting against the fixing element, which creates an inwardly dented minor recess on its outer wall surface of the tube, thereby causing tight engagement of the inner wall surface defining the reception space and the tube to prevent untimely removal of the sleeve member from the tube.
Abstract:
The present invention relates to a lighting assembly used in photographing or video recording. The present invention disclosed is a light cover with X-shaped structure, which includes a main body and two elastic supporting rods. The main body has a light holder fitting opening at the center thereof. The two elastic supporting rods are fixed along four edges of the main body in such way that they intersect with each other at the center thereof at the light holder fitting opening. The light cover provided by the present invention is able to be folded from a tent-like form to an easy-to-carry flattened form.
Abstract:
A method of fabricating a hybrid orientation substrate is described. A silicon substrate with a first orientation having a silicon layer with a second orientation directly thereon is provided, and then a stress layer is formed on the silicon layer. A trench is formed between a first portion and a second portion of the silicon layer through the stress layer and into the substrate. The first portion of the silicon layer is amorphized. A SPE process is performed to recrystallize the amorphized first portion of the silicon layer to be a recrystallized layer with the first orientation. An annealing process is performed at a temperature lower than 1200° C. to convert a surface layer of the second portion of the silicon layer to a strained layer. The trench is filled with an insulating material after the SPE process or the annealing process, and the stress layer is removed.
Abstract:
The present invention provides a non-planar FET which includes a substrate, a fin structure, a sub spacer, a gate, a dielectric layer and a source/drain region. The fin structure is disposed on the substrate. The sub spacer is disposed only on a middle sidewall of the fin structure. The gate is disposed on the fin structure. The dielectric layer is disposed between the fin structure and the gate. The source/drain region is disposed in the fin structure. The present invention further provides a method of forming the same.
Abstract:
A method for manufacturing multi-gate transistor device includes providing a semiconductor substrate having a patterned semiconductor layer, a gate dielectric layer and a gate layer sequentially formed thereon, forming a multiple insulating layer sequentially having a first insulating layer and a second insulating layer and covering the patterned semiconductor layer and the gate layer, removing a portion of the multiple insulating layer to simultaneously form a first spacer around the gate layer and a second spacer around the patterned semiconductor layer, removing the second spacer to expose a portion of the first insulating layer covering the patterned semiconductor layer and simultaneously removing a portion of the first spacer to form a third spacer around the gate layer, and removing the exposed first insulating layer to expose the patterned semiconductor layer.
Abstract:
A manufacturing method for semiconductor device having metal gate includes providing a substrate having a first semiconductor device and a second semiconductor device formed thereon, the first semiconductor device having a first gate trench and the second semiconductor device having a second gate trench; sequentially forming a high dielectric constant (high-k) gate dielectric layer and a multiple metal layer on the substrate; forming a first work function metal layer in the first gate trench; performing a first pull back step to remove a portion of the first work function metal layer from the first gate trench; forming a second work function metal layer in the first gate trench and the second gate trench; and performing a second pull back step to remove a portion of the second work function metal layer from the first gate trench and the second gate trench.
Abstract:
A semiconductor structure and a method of fabricating the same comprising the steps of providing a substrate, forming at least one fin structure on said substrate, forming a gate covering said fin structure, forming a plurality of epitaxial structures covering said fin structures, performing a gate pullback process to reduce the critical dimension (CD) of said gate and separate said gate and said epitaxial structures, forming lightly doped drains (LDD) in said fin structures, and forming a spacer on said gate and said fin structures.
Abstract:
The present invention provides a method of manufacturing semiconductor device having metal gate. First, a substrate is provided. A first conductive type transistor having a first sacrifice gate and a second conductive type transistor having a second sacrifice gate are disposed on the substrate. The first sacrifice gate is removed to form a first trench and then a first metal layer and a first material layer are formed in the first trench. Next, the first metal layer and the first material layer are flattened. The second sacrifice gate is removed to form a second trench and then a second metal layer and a second material layer are formed in the second trench. Lastly, the second metal layer and the second material layer are flattened.
Abstract:
A retractable post with an alarm device includes a plurality of retractable pipes retractably sleeved with each other. A retractable air whistle is secured by a latch block at a proper location inside the retractable pipe. A plug piece is installed at a bottom of the retractable post. The plug piece and the latch block make an interior of the retractable pipe present a dummy seal state, wherein the retractable pipe is almost but not completely sealed. When an abnormal rapid falling displacement of the retractable pipes occurs, the latch block and the retractable air whistle compress the air inside the retractable pipe, and then a bellow of the retractable air whistle is further compressed, such that the air inside the bellow is rapidly discharged through a sounding valve disposed at a front end of the air whistle, thereby generating an alarm sound.