公开(公告)号：US12300424B2

公开(公告)日：2025-05-13

申请号：US18138148

申请日：2023-04-24

Applicant: CYNTEC CO., LTD.

Inventor： Wenyu Lin ,  TsungHao Lu ,  Hao Chun Chang

IPC: H01F27/32 ,  H01F27/02 ,  H01F27/22 ,  H01F27/24 ,  H01F27/28 ,  H01F27/29 ,  H01F41/04 ,  H05K1/18 ,  H01L25/07

Abstract: A stacked electronic structure, including a substrate, wherein electronic devices are disposed on the substrate, and a molding body encapsulates the electronic devices, wherein a first thermal conductive layer is disposed on a first electronic device, and a second thermal conductive layer is disposed on a second electronic device, wherein a magnetic device comprising a magnetic body is disposed over a top surface of the molding body, wherein at least one third thermal conductive layer is disposed on the magnetic body, and the first thermal conductive layer and the second thermal conductive layer are respectively connected with the at least one third thermal conductive layer for dissipating heat.

公开(公告)号：US20250088032A1

公开(公告)日：2025-03-13

申请号：US18463890

申请日：2023-09-08

Applicant: CYNTEC CO., LTD.

Inventor： KUAN-YU CHIU ,  YEN-MING LIU ,  CHIEN-HUI CHEN ,  YUNG-YU CHANG

IPC: H02J50/10 ,  H02J7/00 ,  H02J50/40 ,  H02J50/70 ,  H05K7/20

Abstract: A wireless charging module includes a module case, a fan, a coil assembly and a circuit board. The module case defines a first cavity and a second cavity and has a first side and a second side opposite to the first side. The second side defines an air outlet. The fan is disposed at the first side of the module case and configured to form an airflow S. The coil assembly is disposed in the first cavity, so that a first air channel is formed for the airflow S to pass through a first surface of the coil assembly. The circuit board is disposed in the second cavity and configured to form a second air channel allowing the airflow S to pass through a first surface of the circuit board and a third air channel allowing the airflow S to pass through a second surface of the circuit board. The airflow S passes through the first air channel, the second air channel and the third air channel and flows out of the wireless charging module from the air outlet.

公开(公告)号：US20240321498A1

公开(公告)日：2024-09-26

申请号：US18613093

申请日：2024-03-21

Applicant: CYNTEC CO., LTD.

Inventor： Yung-Shou Hsu ,  Chien-Lin Chen ,  Shao-Wei Chang ,  Chun-Ying Liao ,  Hsieh-Shen Hsieh ,  Ying-Teng Chang ,  Chia-Hao Yang

IPC: H01F27/02 ,  H01F27/28 ,  H01F27/32

CPC classification number: H01F27/025 ,  H01F27/2823 ,  H01F27/2847 ,  H01F27/325 ,  H01F27/327

Abstract: A magnetic component includes a core and at least one coil. The core includes at least one outer leg and an inner leg. The inner leg is separated from an upper inner surface of the core. The inner leg is at least partially divided into a plurality of separated portions along a length direction of the inner leg. The at least one coil is wound around the inner leg.

公开(公告)号：US20240204182A1

公开(公告)日：2024-06-20

申请号：US18221857

申请日：2023-07-13

Applicant: CYNTEC CO., LTD.

Inventor： Pei-I Wei ,  Kai-Pin Huang ,  Kai-Hsiang Liang

IPC: H01M4/525 ,  G01N23/2251 ,  H01M4/133 ,  H01M4/62

CPC classification number: H01M4/525 ,  G01N23/2251 ,  H01M4/133 ,  H01M4/623 ,  H01M2004/021

Abstract: An electrode plate having active substance of electrochemical energy storage device is provided in the present invention, including a current collector and an electrode formed of active substance on the current collector, wherein the active substance includes first particles in form of spherical powder and second particles in form of monocrystalline structure, and an average particle size of the first particles is larger than or equal to three times of an average particle size of the second particles, and a volume ratio of the first particles in the active substance is greater than a volume ratio of the second particles in the active substance, and a breakage rate of said electrode formed by mixed first particles and second particles in rolling pressing process is smaller than or equal to 40%.

公开(公告)号：US20240006116A1

公开(公告)日：2024-01-04

申请号：US18242554

申请日：2023-09-06

Applicant: CYNTEC CO., LTD.

Inventor： Pei-I Wei ,  Cheng-Hao Chang ,  Shing Tak Li

IPC: H01F27/29 ,  H01F27/02 ,  H01F27/28 ,  H01F41/00 ,  H05K1/18 ,  H01F17/02

CPC classification number: H01F27/292 ,  H01F27/022 ,  H01F27/2828 ,  H01F41/005 ,  H05K1/181 ,  H01F17/02 ,  H05K2201/1003

Abstract: A method to form an inductor, the method comprising: forming a metal structure by removing unwanted portions of the metal plate to form a first electrode, a second electrode, and a bare conductor wire between the first electrode and the second electrode, wherein a first thickness of the first electrode is greater than a thickness of the bare conductor wire, and a second thickness of the second electrode is greater than said thickness of the bare conductor wire; and forming a magnetic body to encapsulate the bare conductor wire, and a least one portion of the first electrode and a least one portion of the second electrode.

公开(公告)号：US11798735B2

公开(公告)日：2023-10-24

申请号：US17148537

申请日：2021-01-13

Applicant: CYNTEC CO., LTD.

Inventor： Kuan Yu Chiu ,  Ching Hsiang Yu ,  Min-Feng Chung

IPC: H01F27/28 ,  H01F38/14 ,  H02J7/02 ,  H02J50/10 ,  H02J50/40 ,  H01F27/32 ,  H02J7/00 ,  H01F27/34 ,  H04M1/02

CPC classification number: H01F38/14 ,  H01F27/288 ,  H01F27/327 ,  H01F27/346 ,  H02J7/0013 ,  H02J7/0042 ,  H02J7/02 ,  H02J50/10 ,  H02J50/402 ,  H04M1/0202

Abstract: A structure of coils for a wireless charger comprises a plurality of coils, wherein the plurality of coils are stacked into a plurality of layers of coils with each layer comprising at least two coils, wherein at least two electronic devices are capable of being placed over the plurality of coils for charging the at least two electronic devices.

公开(公告)号：US20230335327A1

公开(公告)日：2023-10-19

申请号：US18207670

申请日：2023-06-08

Applicant: CYNTEC CO., LTD.

Inventor： Yi-Ting Lai ,  Jen-Chuan Hsiao ,  Yuan-Ming Chang ,  Hsieh-Shen Hsieh

IPC: H01F27/22 ,  H01F27/24 ,  H01F27/28 ,  H01F27/02 ,  H01F41/04 ,  H01F1/147 ,  H01F1/34 ,  H01F41/02 ,  H01F27/32

CPC classification number: H01F27/22 ,  H01F27/24 ,  H01F27/28 ,  H01F27/02 ,  H01F41/04 ,  H01F1/14766 ,  H01F1/14708 ,  H01F1/344 ,  H01F41/0246 ,  H01F27/325

Abstract: A method of fabricating a magnetic component structure with thermal conductive filler, including steps of providing a mold with a coil mounted therein, potting the mold with a thermal conductive material to form a thermal conductive filler encapsulating at least a portion of said coil, releasing the thermal conductive filler and the coil from the mold, and combining the thermal conductive filler with magnetic cores to form a magnetic component structure.

公开(公告)号：US11783992B2

公开(公告)日：2023-10-10

申请号：US16936435

申请日：2020-07-23

Applicant: CYNTEC CO., LTD.

Inventor： Pei-I Wei ,  Cheng-Hao Chang ,  Shing Tak Li

IPC: H01F27/29 ,  H01F17/02 ,  H01F27/02 ,  H01F27/28 ,  H01F41/00 ,  H05K1/18

CPC classification number: H01F27/292 ,  H01F17/02 ,  H01F27/022 ,  H01F27/2828 ,  H01F41/005 ,  H05K1/181 ,  H05K2201/1003

Abstract: An inductive component is disclosed, the inductive component comprising a metal structure, comprising a bare conductor wire, a first electrode and a second electrode, wherein the first electrode and the second electrode are integrally formed with the bare conductor wire, wherein a first thickness of the first electrode is greater than that of the bare conductor wire and a second thickness of the second electrode is greater than that of the bare conductor wire; and a magnetic body encapsulating the bare conductor wire, at least one portion of the first electrode, and at least one portion of the second electrode, wherein the first lateral surface of the first electrode and the second lateral surface of the second electrode are embedded inside the magnetic body.

公开(公告)号：US20230260693A1

公开(公告)日：2023-08-17

申请号：US18138148

申请日：2023-04-24

Applicant: CYNTEC CO., LTD.

Inventor： Wenyu Lin ,  TsungHao Lu ,  Hao Chun Chang

IPC: H01F27/32 ,  H01F27/29 ,  H01F27/28 ,  H01F27/24 ,  H01F27/02 ,  H01F27/22 ,  H05K1/18

CPC classification number: H01F27/327 ,  H01F27/29 ,  H01F27/2852 ,  H01F27/24 ,  H01F27/2823 ,  H01F27/022 ,  H01F27/22 ,  H05K1/18 ,  H01L25/072

Abstract: A stacked electronic structure, comprising a substrate, wherein electronic devices are disposed on the substrate, and a molding body encapsulates the electronic devices, wherein a first thermal conductive layer is disposed on a first electronic device, and a second thermal conductive layer is disposed on a second electronic device, wherein a magnetic device comprising a magnetic body is disposed over a top surface of the molding body, wherein at least one third thermal conductive layer is disposed on the magnetic body, and the first thermal conductive layer and the second thermal conductive layer are respectively connected with the at least one third thermal conductive layer for dissipating heat.

公开(公告)号：US20230096266A1

公开(公告)日：2023-03-30

申请号：US17849735

申请日：2022-06-27

Applicant: CYNTEC CO., LTD.

Inventor： Chia-Cheng Chuang

IPC: H01F17/04 ,  H01F27/28

Abstract: A common mode filter includes a magnetic core, a first wire wound around the magnetic core and comprising N turns, and a second wire wound around the magnetic core and comprising N turns, N being an integer exceeding 1. An (S+1)th turn of the first wire is stacked on an inner turn of the first wire and an inner turn of the second wire, S being a positive integer less than (N−1).