Vehicle Loudspeaker Module
    121.
    发明申请
    Vehicle Loudspeaker Module 有权
    车载扬声器模块

    公开(公告)号:US20130259258A1

    公开(公告)日:2013-10-03

    申请号:US13437054

    申请日:2012-04-02

    Abstract: An audio module for use in a vehicle cabin. An elongated substantially sealed enclosure has two ends in the lengthwise direction. A first acoustic driver is mounted in the enclosure near one end of the enclosure for radiating acoustic energy from the end of the enclosure. A second acoustic driver is mounted in the enclosure near a second end of the enclosure for radiating acoustic energy from the second end of the enclosure. The audio module includes a bass augmenting device for radiating low frequency acoustic energy from the enclosure. The audio module is constructed and arranged to be pre-assembled so that the audio module can be installed in the vehicle as a single assembly. The audio module is configured to be mounted to the vehicle so that the lengthwise direction is substantially vertical with the first end of the enclosure higher than the second end of the enclosure.

    Abstract translation: 用于车厢的音频模块。 细长的基本上密封的外壳在长度方向上具有两个端部。 第一声​​学驱动器安装在壳体的靠近外壳的一端的外壳中,用于从外壳的端部辐射声能。 第二声学驱动器安装在靠近外壳的第二端的外壳中,用于从外壳的第二端辐射声能。 音频模块包括用于从外壳辐射低频声能的低音增强装置。 音频模块被构造和布置成预组装,使得音频模块可以作为单个组件安装在车辆中。 音频模块被配置为安装到车辆,使得纵向方向基本垂直,外壳的第一端高于外壳的第二端。

    Capacitive Microphone With Integrated Cavity
    122.
    发明申请
    Capacitive Microphone With Integrated Cavity 有权
    具有集成腔的电容麦克风

    公开(公告)号:US20100119088A1

    公开(公告)日:2010-05-13

    申请号:US12597572

    申请日:2008-04-25

    Abstract: A capacitive microphone and method of fabricating the same are provided. One or more holes can be formed in a first printed circuit board (PCB). A diaphragm can be surface micro-machined onto an interior surface of the first PCB at a region having the one or more holes. Interface electronics can also be interconnected to the interior surface of the PCB. One or more spacer PCBs can be attached to a second PCB to the first PCB, such that appropriate interconnections between interconnect vias are made. The second PCB and first PCB with spacers in between can be attached so as to create a cavity in which the diaphragm and interface electronics are located.

    Abstract translation: 提供一种电容麦克风及其制造方法。 可以在第一印刷电路板(PCB)中形成一个或多个孔。 膜片可以在具有一个或多个孔的区域上被表面微加工到第一PCB的内表面上。 接口电子元件也可以互连到PCB的内表面。 一个或多个间隔PCB可以连接到第二PCB到第一PCB,使得形成互连通孔之间的适当互连。 可以将第二PCB和间隔件之间的第一PCB连接起来,以便形成隔膜和接口电子设备所在的空腔。

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