Abstract:
A high-dielectric capacitor is formed by using a Ru lower electrode having a (002)-oriented principal surface, by depositing thereon a Ta2O5 film such that the Ta2O5 film has a (100)-principal surface.
Abstract translation:通过使用具有(002)取向主表面的Ru下电极,通过在其上沉积Ta 2 O 5膜使得Ta 2 O 5膜具有(100) - 主表面而形成高介电电容器。
Abstract:
A method of manufacturing a semiconductor device has the steps of: (a) forming a lower electrode made of rare metal above a semiconductor substrate; (b) depositing a capacitor dielectric film made of a high dielectric material or ferroelectric oxide on the lower electrode; (c) forming a laminated layer on the capacitor dielectric film, the laminated layer including an upper electrode layer made of rare metal and an adhesive layer with or without an SiO2 mask layer thereon; (d) patterning the laminated layer; (e) chemically processing the patterned, laminated layer to remove a surface layer of the laminated layer; and (f) forming an interlayer insulating film over the semiconductor substrate, covering the chemically processed, laminated layer. An adhesion force between the rare metal layer and insulating layer can be increased.
Abstract:
A method of manufacturing semiconductor device comprises the step of forming the transistor in the semiconductor substrate, the step of forming the capacitor conducting to the transistor, and the step of forming the insulating film to cover the transistor and the capacitor; and the step of sintering the semiconductor substrate in an atmosphere including the mixture of hydrogen, nitrogen and oxygen gases.
Abstract:
A new design for a high voltage bipolar transistor is disclosed. Instead of a buried subcollector (which would be N+ in an NPN device), a buried P+ layer is used. The presence of this P+ layer results in pinch-off between itself and the bipolar base. This allows much higher breakdown voltages to be achieved. In particular, the device will not break down at the bottom of the base-collector junction which is the weak spot for conventional devices. A process for manufacturing this device is described. A particular feature of this new process is that the N type epitaxial layer that is grown over the P+ layer is only about half the thickness of its counterpart in the conventional device. The process is fully compatible with conventional BiCMOS processes and has lower cost.
Abstract:
A new design for a high voltage bipolar transistor is disclosed. Instead of a buried subcollector (which would be N+ in an NPN device)d a buried P+ layer is used. The presence of this P+ layer results in pinch-off between itself and the bipolar base. This allows much higher breakdown voltages to be achieved. In particular, the device will not break down at the bottom of the base-collector junction which is the weak spot for conventional devices. A process for manufacturing this device is described. A particular feature of this new process is that the N type epitaxial layer that is grown over the P+ layer is only about half the thickness of its counterpart in the conventional device. The process is fully compatible with conventional BiCMOS processes and has lower cost.
Abstract:
A high-dielectric capacitor is formed by using a Ru lower electrode having a (002)-oriented principal surface, by depositing thereon a Ta2O5 film such that the Ta2O5 film has a (100)-principal surface.
Abstract translation:通过使用具有(002)取向主表面的Ru下电极,通过在其上沉积Ta 2 O 5膜使得Ta 2 O 5膜具有(100) - 主表面而形成高介电电容器。
Abstract:
A bipolar transistor is described whose I-V curve is such that it operates in two regions, one having low gain and low power consumption and another having higher gain and better current driving ability. Said transistor has a base region made up of two sub regions, the region closest to the emitter having a resistivity about an order a magnitude lower than the second region (which interfaces with the collector). A key feature of the invention is that the region closest to the collector is very uniformly doped, i.e. there is no gradient or built-in field present. In order to produce such a region, epitaxial growth along with boron doping is used rather than more conventional techniques such as ion implantation and/or diffusion.
Abstract:
An automatic pallet changer is composed of a pallet lifting mechanism and a revolving mechanism. The pallet lifting mechanism has a pallet platform and a lifting rod which is fastened with the bottom of the pallet platform. The pallet platform and the lifting rod are driven by oil pressure to move up and down in a linear manner. The body of the lifting rod is provided with a vertically-oriented first position confining portion. The revolving mechanism has a gear and a rack gear member. The gear is pivoted to the bottom of the pallet lifting mechanism at a fixed height and provided axially with a slide channel in which the lifting rod is slidably disposed. The slide channel is provided in the inside thereof with a vertically-oriented second position confining portion, which is complementary in shape to the first position confining portion of the lifting rod for enabling the lifting rod and the pallet platform to turn synchronously. The rack gear member is engaged with the gear so as to drive the gear to rotate.
Abstract:
A ceramic capacitor comprising at least a dielectric ceramic layer and at least a graphene electrode layer deposited on the ceramic layer, wherein the graphene electrode layer has a thickness no less than 2 nm and consists of a graphene material or a graphene composite material containing at least 0.1% by weight of a graphene material dispersed in a matrix material or bonded by a binder material, wherein the graphene material is selected from (a) a plurality of single-layer or multi-layer pristine graphene sheets having less than 0.01% by weight of non-carbon elements, or (b) one or a plurality of a non-pristine graphene material having at least 0.01% by weight of non-carbon elements, wherein the non-pristine graphene is selected from graphene oxide, reduced graphene oxide, graphene fluoride, graphene chloride, graphene bromide, graphene iodide, hydrogenated graphene, nitrogenated graphene, doped graphene, chemically functionalized graphene, or a combination thereof.
Abstract:
A flexible fingerprint sensor laminate comprising: a layer of flexible substrate having a front surface and a back surface, at least a domain of electrically conductive material deposited on the front surface, a protective hard coating layer that covers the domain of electrically conductive material, and a plurality of sensor electrodes deposited preferably on the back surface and related circuitry (e.g. integrated circuit for driving and sensing). Preferably, the layer of flexible substrate is no greater than 20 μm in thickness, the domain of electrically conductive material has a thickness no greater than 2 μm, the protective hard coating has a thickness no greater than 1 μm, and the laminate has a surface sheet resistance no greater than 200 Ohm per square and surface scratch resistance no less than 3 H. The laminate exhibits good scratch resistance, low sheet resistance, good flexibility and mechanical integrity. The invention also provides a biometric sensor, such as a fingerprint sensor. The invention further provides a process for producing such a sensor laminate.