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公开(公告)号：US12199516B2
公开(公告)日：2025-01-14
申请号：US18486261
申请日：2023-10-13
Applicant: Richtek Technology Corporation
Inventor： Kuo-Chi Liu , Ta-Yung Yang
Abstract: A multi-phase switching converter, includes: plural sub-switching converters; and a control circuit. Plural switching signals operate a capacitor of one of the plural sub-switching converters and a capacitor of another one of the plural sub-switching converters, to conduct a switched capacitor switching on a first voltage, thus switching an inductor switching node in each sub-switching converter between a divided voltage of the first voltage and a reference potential and to thereby execute a power conversion between the first voltage and a second voltage. When the inductors of each of the plural sub-switching converters are coupled with one another in a non-electromagnetic fashion, the multi-phase switching converters operate in a non-resonant mode. When the inductors of at least two of the plural sub-switching converters are electromagnetically coupled with one another, the multi-phase switching converters operate in a resonant mode or in the non-resonant mode.
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132.发明授权公开(公告)号：US12184168B2
公开(公告)日：2024-12-31
申请号：US17838195
申请日：2022-06-11
Applicant: Richtek Technology Corporation
Inventor： Kuo-Chi Liu , Ta-Yung Yang , Chung-Lung Pai
Abstract: A switched capacitor voltage converter circuit includes: a switched capacitor converter and a control circuit; wherein the control circuit adjusts operation frequencies and/or duty ratios of operation signals which control switches of the switched capacitor converter, so as to adjust a ratio of a first voltage to a second voltage to a predetermined ratio. When the control circuit decreases the duty ratios of the operation signals, if a part of the switches of the switched capacitor converter are turned ON, an inductor current flowing toward the second voltage is in a first state; if the inductor current continues to flow via a current freewheeling path, the inductor current flowing toward the second voltage becomes in a second state. A corresponding inductor is thereby switched between the first state and the second state to perform inductive power conversion.
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133.发明授权公开(公告)号：US12176811B2
公开(公告)日：2024-12-24
申请号：US18300266
申请日：2023-04-13
Applicant: Richtek Technology Corporation
Inventor： Kuo-Chi Liu , Ta-Yung Yang
Abstract: A switched capacitor voltage converter circuit includes: a switched capacitor converter and a control circuit. The switched capacitor converter includes at least one resonant capacitor, switches and at least one inductor. The control circuit generates a pulse width modulation (PWM) signal according to a first voltage or a second voltage and generates a control signal according to the PWM signal and a zero current detection signal. The control signal controls the switched capacitor converter by operating the corresponding switches to switch electrical connection of the inductor, so as to convert the first voltage to the second voltage or convert the second voltage to the first voltage.
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公开(公告)号：US20240405683A1
公开(公告)日：2024-12-05
申请号：US18595467
申请日：2024-03-05
Applicant: Richtek Technology Corporation
Inventor： Kuo-Chi Liu , Ta-Yung Yang
Abstract: A multi-level switching converter circuit for converting a first voltage to a second voltage or convert the second voltage to the first voltage, includes: a power stage circuit and a control circuit. Through a valley current mode control, the conversion control circuit generates a first ramp signal to determine a first duty ratio of the first control signal, and generates a second ramp signal to determine a second duty ratio of the second control signal, thereby a switching node connected to one end of an inductor is switched between two of k levels of voltages, such that the first voltage or the second voltage is regulated to a predetermined target level, and a flying capacitor voltage across the flying capacitor is regulated and balanced at one (k-1)th of the first voltage.
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135.发明申请公开(公告)号：US20240388193A1
公开(公告)日：2024-11-21
申请号：US18494888
申请日：2023-10-26
Applicant: Richtek Technology Corporation
Inventor： Chun-Lien Chen , Yung-Jen Chen , Chong-Rong Lee
Abstract: A switching converter includes: a power stage circuit configured to switch at least one switch of the power stage circuit according to a control signal, to convert an input voltage to an output voltage; and a control circuit configured to execute modulation on a pulse width according to a feedback voltage related to the output voltage, to generate the control signal in a heavy load status. In a light load status, and when the switching converter operates at a discontinuous conduction mode (DCM), after an inductor current flowing through the power stage circuit has already become a zero current, the control circuit ceases executing modulation on the pulse width according to the feedback voltage and ceases keeping a compensation voltage correlated with the output voltage at a present level.
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Patent Agency Ranking
136.发明授权公开(公告)号：US12136885B2
公开(公告)日：2024-11-05
申请号：US18436023
申请日：2024-02-08
Applicant: Richtek Technology Corporation
Inventor： Ta-Yung Yang , Ying-Chieh Su , Yu-Chang Chen
Abstract: A resonant half-bridge flyback power converter includes: a first transistor and a second transistor which form a half-bridge circuit; a transformer and a resonant capacitor connected in series and coupled to the half-bridge circuit; and a switching control circuit configured to generate a first driving signal and a second driving signal to control the first transistor and the second transistor respectively for switching the transformer to generate an output voltage. The first driving signal is configured to magnetize the transformer. The second driving signal includes at most one pulse between two consecutive pulses of the first driving signal. The switching control circuit generates a skipping cycle period when an output power is lower than a predetermined threshold. A resonant pulse of the second driving signal is skipped during the skipping cycle period. The skipping cycle period is increased in response to the decrease of the output power.
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公开(公告)号：US12107586B2
公开(公告)日：2024-10-01
申请号：US17681728
申请日：2022-02-26
Applicant: RICHTEK TECHNOLOGY CORPORATION
Inventor： Yi-Kuang Chen , Ming-Jun Hsiao
CPC classification number: H03K7/08 , H03F3/217 , H03F2200/351 , H03K3/017
Abstract: A BD type pulse width modulation (PWM) circuit is configured to convert a pair of complementary input signals to a pair of output PWM signals. The BD PWM circuit modulates a basic modulation signal according to the pair of input signals, to generate a basic PWM signal. The common mode levels of the pair of input signals and the basic modulation signal are the same. The BD PWM circuit modulates an offset modulation signal according to the pair of input signals to generate an offset PWM signal. The offset modulation signal and the basic modulation signal have a non-zero offset in between. The BD PWM circuit selects the offset PWM signal or a heavy load PWM signal as the pair of output PWM signals. The heavy load PWM signal is correlated with the basic PWM signal.
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138.发明授权公开(公告)号：US12062974B2
公开(公告)日：2024-08-13
申请号：US17716933
申请日：2022-04-08
Applicant: Richtek Technology Corporation
Inventor： Ta-Yung Yang , Yu-Chang Chen
CPC classification number: H02M1/0006 , H02M3/07 , H02M3/33523
Abstract: A switched capacitor converter circuit includes: a conversion capacitor; an output capacitor; and switches configured to switch the coupling configurations of the conversion capacitor and the output capacitor according to a level of the first power supply voltage of the switched capacitor converter circuit, to generate the second power supply voltage at the output capacitor according to the first power supply voltage. The second power supply voltage provides power to control the power converter circuit. When the first power supply voltage is higher than a high threshold, the switched capacitor converter circuit controls the second power supply voltage to be lower than the first power supply voltage. When the first power supply voltage is lower than a low threshold, the switched capacitor converter circuit controls the second power supply voltage to be higher than the first power supply voltage.
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公开(公告)号：US20240235276A9
公开(公告)日：2024-07-11
申请号：US18150945
申请日：2023-01-06
Applicant: Richtek Technology Corporation
Inventor： Fu-Chi LIN , Po-Chang CHEN , Wen-Ti LO
Abstract: A wireless power transmission device includes a transmission device and a control device. The control device generates a driving signal to the transmission device in a first soft-start period, so as to drive the transmission device. The control device measures an energy message generated by the transmission device to generate a measurement result in a measurement period, and calculates a signal parameter according to the measurement result. The control device accordingly generates a carrier signal according to the signal parameter obtained by the measurement period in a second soft-start period. In a transmission period, the carrier signal is transmitted to the wireless power-receiving device through the transmission device. The energy message is generated by the transmission device in response to a distance between the transmission device and the wireless power-receiving device.
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公开(公告)号：US20240234264A1
公开(公告)日：2024-07-11
申请号：US18616275
申请日：2024-03-26
Applicant: Richtek Technology Corporation
Inventor： Hao-Lin Yen , Heng-Chi Huang , Yong-Zhong Hu
IPC: H01L23/495 , H01L21/48 , H01L21/56 , H01L21/78 , H01L23/31
CPC classification number: H01L23/49568 , H01L21/4825 , H01L21/565 , H01L21/78 , H01L23/3114 , H01L23/49503 , H01L23/4952
Abstract: A chip packaging method includes: providing a wafer, on which multiple bumps are formed; cutting the wafer into multiple chip units, wherein multiple vertical heat conduction elements are formed on the wafer or the chip units; disposing the chip units on a base material; and providing a package material to encapsulate lateral sides and a bottom surface of each of the chip units, to form a chip package unit, wherein the bottom surface of the chip unit faces the base material; wherein, in the chip package unit, the bumps on the chip units abut against the base material, and wherein the vertical heat conduction elements directly connect to the base material, or the base material includes multiple through-holes and the vertical heat conduction elements pass through the multiple through-holes in the base material.
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