公开(公告)号：US20230143672A1

公开(公告)日：2023-05-11

申请号：US17912873

申请日：2020-04-10

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Michael G. Groh

IPC: B01L3/00

CPC classification number: B01L3/502707 ,  B01L3/502715

Abstract: A molded microfluidic substrate includes a molding compound layer. The molded microfluidic substrate includes a microfluidic channel. The microfluidic channel of the molded microfluidic substrate is formed within the molding compound layer of the molded microfluidic substrate. The microfluidic channel of the molded microfluidic substrate corresponds to a sacrificial metal bond wire.

公开(公告)号：US11613117B2

公开(公告)日：2023-03-28

申请号：US16956331

申请日：2019-02-06

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： James Michael Gardner ,  Scott A. Linn ,  Michael W. Cumbie

IPC: B41J2/045

Abstract: An integrated circuit to drive a plurality of fluid actuation devices includes an interface, a first sensor, a second sensor, and control logic. The interface is to connect to a single contact pad of a host print apparatus. The first sensor is of a first type and is coupled to the interface. The second sensor is of a second type and is coupled to the interface. The second type is different from the first type. The control logic enables the first sensor or the second sensor to provide an enabled sensor. A voltage bias or a current bias applied to the interface generates a sensed current or a sensed voltage, respectively, on the interface indicating the state of the enabled sensor.

公开(公告)号：US20220348013A1

公开(公告)日：2022-11-03

申请号：US17859432

申请日：2022-07-07

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： James Michael Gardner ,  Scott A. Linn ,  Michael W. Cumbie ,  Anthony M. Fuller

IPC: B41J2/14 ,  B41J2/045

Abstract: A device includes a first column of contact pads. The device also includes a column of fluid actuation devices disposed longitudinally to the first column of contact pads.

公开(公告)号：US11479046B2

公开(公告)日：2022-10-25

申请号：US16772997

申请日：2019-04-05

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： James Michael Gardner ,  Sirena Chi Lu ,  Scott A. Linn ,  Stephen D. Panshin ,  David Owen Roethig ,  David N. Olsen ,  Anthony D. Studer ,  Michael W. Cumbie ,  Jefferson P. Ward

IPC: B41J2/175 ,  G06F13/42 ,  G06F21/44 ,  G06F9/30 ,  G06F21/62 ,  H04L9/08 ,  H04L9/32

Abstract: In an example, a method includes, by logic circuitry associated with a replaceable print apparatus component installed in a print apparatus, responding to a sensor data request received from the print apparatus by returning a first response; receiving a calibration parameter from the print apparatus; and returning a second response which is different from the first response.

公开(公告)号：US11427010B2

公开(公告)日：2022-08-30

申请号：US16965231

申请日：2019-04-05

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： James Michael Gardner ,  Scott A. Linn ,  Stephen D. Panshin ,  Jefferson P. Ward ,  David Owen Roethig ,  David N. Olsen ,  Anthony D. Studer ,  Michael W. Cumbie ,  Sirena Chi Lu

IPC: B41J2/175 ,  G06F13/42 ,  G03G15/08 ,  B41J29/393 ,  G01L23/08 ,  G06F21/44 ,  G06K15/00 ,  B33Y50/00 ,  G06K15/10

Abstract: A logic circuitry package for a replaceable print apparatus component comprises an interface to communicate with a print apparatus logic circuit, and at least one logic circuit. The logic circuit may be configured to identify, from a command stream received from the print apparatus, parameters including a class parameter, and/or identify, from the command stream, a read request, and output, via the interface, a count value in response to a read request, the count value based on identified received parameters.

公开(公告)号：US11426900B2

公开(公告)日：2022-08-30

申请号：US14770198

申请日：2013-03-20

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Arun K. Agarwal

IPC: B29C33/00 ,  B41J2/16 ,  B29C39/02 ,  B29C39/26 ,  B29C39/36 ,  B29L31/00

Abstract: In one example, a process for making a micro device structure includes molding a micro device in a monolithic body of material and forming a fluid flow passage in the body through which fluid can pass directly to the micro device.

公开(公告)号：US11407220B2

公开(公告)日：2022-08-09

申请号：US16956705

申请日：2019-02-06

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Michael W. Cumbie ,  Robert N. K. Browning ,  James Michael Gardner

IPC: B41J2/045 ,  G01K13/02 ,  B41J2/14

Abstract: A print component integrated circuitry package includes a number of temperature sensors where each of the plurality of the temperature sensors is disposed in a corresponding temperature region of an integrated circuitry. In an example, an analog sense bus conductively connects to all of the plurality of temperature sensors and an external sensor pad that is to connect to a corresponding print controller contact.

公开(公告)号：US11364719B2

公开(公告)日：2022-06-21

申请号：US16767914

申请日：2019-02-06

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： James Michael Gardner ,  Scott A. Linn ,  Michael W. Cumbie

IPC: B41J2/045

Abstract: A print component includes a plurality of data pads, a clock pad to receive an intermittent clock signal, and a plurality of actuator groups each corresponding to a different liquid type and to a different one of the data pads. Each actuator group includes a plurality of configuration functions, an array of fluid actuators, and an array of memory elements including a first portion corresponding to the plurality of configuration functions and a second portion corresponding to the array of fluid actuators. Each time the intermittent clock signal is present on the clock pad, the array of memory elements to serially load a segment of data bits from the corresponding data pad, including loading a first portion of data bits into the first portion of memory elements, and loading a second portion of data bits into the second portion of memory elements.

公开(公告)号：US11364492B2

公开(公告)日：2022-06-21

申请号：US16085342

申请日：2016-03-31

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Jeffrey A. Nielsen ,  Michael W. Cumbie ,  Devin Alexander Mourey ,  Silam J. Choy ,  Christie Dudenhoefer ,  Kenneth Ward

IPC: B41J2/14 ,  B01J19/00 ,  B41J2/145 ,  B41J2/155 ,  B41J2/16 ,  B01L3/02 ,  B41J2/175

Abstract: A digital dispense apparatus comprising a plurality of fluid dispense devices, at least one reservoir connected to the plurality of fluid dispense devices to deliver fluid to the plurality of fluid dispense devices, at least one contact pad array, and a single monolithic carrier structure.

公开(公告)号：US11351775B2

公开(公告)日：2022-06-07

申请号：US16957517

申请日：2019-02-06

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Scott A. Linn ,  James Michael Gardner ,  Michael W. Cumbie

IPC: B41J2/045

Abstract: An integrated circuit to drive a plurality of fluid actuation devices includes a plurality of first memory cells, a plurality of first storage elements, and control logic. Each first memory cell stores a customization bit. Each first storage element is coupled to a corresponding first memory cell. The control logic, in response to a reset signal, reads the customization bit stored in each first memory cell and latches each customization bit in a corresponding first storage element.