公开(公告)号：US07184269B2

公开(公告)日：2007-02-27

申请号：US11008359

申请日：2004-12-09

申请人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/2079 ,  H05K7/20781

摘要： A cooling apparatus for an electronics assembly having a substrate and one or more electronics devices includes an enclosure sealably engaging the substrate to form a cavity, with the electronics devices and a heat exchange assembly being disposed within the cavity. The heat exchange assembly defines a primary coolant flow path and a separate, secondary coolant flow path. The primary coolant flow path includes first and second chambers in fluid communication, and the secondary flow path includes a third chamber disposed between the first and second chambers. The heat exchange assembly provides a first thermal conduction path between primary coolant in the first chamber and secondary coolant in the third chamber, and a second thermal conduction path between primary coolant in the second chamber and secondary coolant in the third chamber. The heat exchange assembly further includes coolant nozzles to direct primary coolant towards the electronics devices.

摘要翻译： 一种用于具有衬底和一个或多个电子器件的电子组件的冷却装置，包括密封地接合衬底以形成空腔的外壳，电子设备和热交换组件设置在空腔内。 热交换组件限定了主冷却剂流动路径和单独的二次冷却剂流动路径。 主冷却剂流动路径包括流体连通的第一和第二腔室，并且二次流动路径包括设置在第一和第二腔室之间的第三腔室。 热交换组件提供在第一室中的主要冷却剂和第三室中的二次冷却剂之间的第一热传导路径，以及在第二室中的一次冷却剂和第三室中的二次冷却剂之间的第二热传导路径。 热交换组件还包括冷却剂喷嘴以将主冷却剂引向电子设备。

公开(公告)号：US07283358B2

公开(公告)日：2007-10-16

申请号：US11184524

申请日：2005-07-19

申请人： Levi A. Campbell ,  Ricahrd C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Levi A. Campbell ,  Ricahrd C. Chu ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/20745 ,  F24F13/04 ,  H05K7/20736

摘要： Apparatus and method are provided for facilitating cooling of an electronics rack employing an air delivery structure coupled to the electronics rack. The air delivery structure delivers air flow at a location external to the electronics rack and in a direction to facilitate mixing thereof with re-circulating exhausted inlet-to-outlet air flow from the air outlet side of the electronics rack to the air inlet side thereof. The delivered air flow is cooler than the re-circulating exhausted inlet-to-outlet air flow and when mixed with the re-circulating air flow facilitates lowering air inlet temperature at a portion of the air inlet side of the electronics rack, thereby enhancing cooling of the electronics rack.

摘要翻译： 提供了一种装置和方法，用于促进使用联接到电子机架的空气输送结构的电子机架的冷却。 空气输送结构在电子机架外部的位置处和在促进其混合的方向上传送空气流，并且从电子机架的空气出口侧到其进气侧再循环排出的入口到出口空气流 。 输送的空气流比再循环排出的入口到出口空气流更冷，并且当与再循环空气流混合时，有助于降低电子机架的空气入口侧的一部分处的进气温度，从而增强冷却 的电子机架。

公开(公告)号：US07918025B2

公开(公告)日：2011-04-05

申请号：US12252386

申请日：2008-10-16

申请人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Robert E. Simons

发明人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Robert E. Simons

IPC分类号： B23P15/26

CPC分类号： H01L23/373 ,  H01L23/433 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/15312 ,  Y10T29/4935 ,  Y10T29/49368 ,  Y10T428/30 ,  Y10T442/2738

摘要： A thermal spreading device disposable between electronic circuitry and a heat sink includes a substrate having parallel first and second faces and conduits extending through the substrate between the faces. The substrate material has a first thermal conductivity value in a direction parallel to the faces and a second thermal conductivity value in a direction normal to the faces, with the second thermal conductivity value being less than the first thermal conductivity value. The conduit material has a thermal conductivity value associated with it, with the thermal conductivity value being greater than the second thermal conductivity value of the substrate. One method of fabricating the thermal spreading device includes disposing a molding material radially about the rods and hardening the material. Other methods include press fitting and shrink fitting the rods into a substrate material.

公开(公告)号：US20090038154A1

公开(公告)日：2009-02-12

申请号：US12252387

申请日：2008-10-16

申请人： Richard C. Chu ,  Michael J. Ellsworth, JR. ,  Robert E. Simons

发明人： Richard C. Chu ,  Michael J. Ellsworth, JR. ,  Robert E. Simons

IPC分类号： B21D53/02

CPC分类号： H01L23/373 ,  H01L23/433 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/15312 ,  Y10T29/4935 ,  Y10T29/49368 ,  Y10T428/30 ,  Y10T442/2738

摘要： A thermal spreading device disposable between electronic circuitry and a heat sink includes a substrate having parallel first and second faces and conduits extending through the substrate between the faces. The substrate material has a first thermal conductivity value in a direction parallel to the faces and a second thermal conductivity value in a direction normal to the faces, with the second thermal conductivity value being less than the first thermal conductivity value. The conduit material has a thermal conductivity value associated with it, with the thermal conductivity value being greater than the second thermal conductivity value of the substrate. One method of fabricating the thermal spreading device includes disposing a molding material radially about the rods and hardening the material. Other methods include press fitting and shrink fitting the rods into a substrate material.

摘要翻译： 在电子电路和散热器之间一次使用的散热装置包括具有平行的第一和第二表面的基板以及在表面之间延伸通过基板的导管。 衬底材料在平行于面的方向上具有第一热导率值，并且在垂直于面的方向上具有第二热导率值，第二热导率值小于第一热导率值。 导管材料具有与其相关联的热导率值，其热导率值大于衬底的第二热导率值。 一种制造热扩散装置的方法包括：围绕棒径向地设置模制材料并硬化材料。 其他方法包括压配合并将棒收缩配合到基底材料中。

公开(公告)号：US20090038153A1

公开(公告)日：2009-02-12

申请号：US12252386

申请日：2008-10-16

申请人： Richard C. Chu ,  Michael J. Ellsworth, JR. ,  Robert E. Simons

发明人： Richard C. Chu ,  Michael J. Ellsworth, JR. ,  Robert E. Simons

IPC分类号： B21D53/02

CPC分类号： H01L23/373 ,  H01L23/433 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/15312 ,  Y10T29/4935 ,  Y10T29/49368 ,  Y10T428/30 ,  Y10T442/2738

摘要： A thermal spreading device disposable between electronic circuitry and a heat sink includes a substrate having parallel first and second faces and conduits extending through the substrate between the faces. The substrate material has a first thermal conductivity value in a direction parallel to the faces and a second thermal conductivity value in a direction normal to the faces, with the second thermal conductivity value being less than the first thermal conductivity value. The conduit material has a thermal conductivity value associated with it, with the thermal conductivity value being greater than the second thermal conductivity value of the substrate. One method of fabricating the thermal spreading device includes disposing a molding material radially about the rods and hardening the material. Other methods include press fitting and shrink fitting the rods into a substrate material.

公开(公告)号：US07106590B2

公开(公告)日：2006-09-12

申请号：US10726347

申请日：2003-12-03

申请人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Roger R. Schmidt ,  Robert E. Simons ,  Randy J. Zoodsma

发明人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Roger R. Schmidt ,  Robert E. Simons ,  Randy J. Zoodsma

IPC分类号： H05K7/20 ,  F28D15/00

CPC分类号： H05K7/2079

摘要： A cooling system is provided employing multiple coolant conditioning units (CCUs). Each CCU, which is coupled to a different, associated electronics rack of multiple electronics racks to be cooled, includes a heat exchanger, a first cooling loop with a control valve, and a second cooling loop. The first cooling loop receives chilled facility coolant from a source and passes at least a portion thereof via the control valve through the heat exchanger. The second cooling loop provides cooled system coolant to the associated electronics rack, and expels heat in the heat exchanger from the electronics rack to the chilled facility coolant in the first cooling loop. The control valve allows regulation of the facility coolant flow through the heat exchanger, thereby allowing independent control of temperature of the system coolant in the second cooling loop. Various CCU and associated component redundancies of the cooling system are also provided.

摘要翻译： 提供采用多个冷却剂调节单元（CCU）的冷却系统。 耦合到要冷却的多个电子机架的不同相关电子机架的每个CCU包括热交换器，具有控制阀的第一冷却回路和第二冷却回路。 第一冷却回路从源接收冷却设备冷却剂，并且经由控制阀将其至少一部分通过热交换器。 第二冷却回路将冷却的系统冷却剂提供给相关联的电子机架，并将热交换器中的热量从电子机架排出到第一冷却回路中的冷却设备冷却剂。 控制阀允许调节通过热交换器的设备冷却剂流，从而允许独立地控制第二冷却回路中的系统冷却剂的温度。 还提供了冷却系统的各种CCU和相关部件冗余。

公开(公告)号：US07012807B2

公开(公告)日：2006-03-14

申请号：US10675628

申请日：2003-09-30

申请人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Roger R. Schmidt ,  Robert E. Simons

发明人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Roger R. Schmidt ,  Robert E. Simons

IPC分类号： H05K7/20

CPC分类号： H05K7/20772 ,  G06F1/20 ,  G06F2200/201

摘要： A thermal dissipation assembly and method, and a cooled multi-drawer electronics rack are provided having a first cooling loop and a second cooling loop. The first cooling loop is disposed substantially within an electronics drawer and positioned to extract heat from an electronics module within the drawer. The first cooling loop further includes a first planar heat transfer surface. The second cooling loop is disposed substantially external to the electronics drawer and includes a second planar heat transfer surface. A biasing mechanism mechanically forces the first planar heat transfer surface and the second heat transfer surface coplanar when the electronics drawer is in a docked position in the electronics rack to facilitate the transfer of heat from the first cooling loop to the second cooling loop.

摘要翻译： 提供散热组件和方法以及冷却的多抽屉电子机架，其具有第一冷却回路和第二冷却回路。 第一冷却回路基本上设置在电子抽屉内并且定位成从抽屉内的电子模块提取热量。 第一冷却回路还包括第一平面传热表面。 第二冷却回路基本上设置在电子抽屉的外部，并且包括第二平面传热表面。 当电子抽屉处于电子机架中的对接位置时，偏置机构将第一平面传热表面和第二传热表面机械地迫使第一传热表面共面，以便于将热量从第一冷却回路传递到第二冷却回路。

公开(公告)号：US06591898B1

公开(公告)日：2003-07-15

申请号：US10176217

申请日：2002-06-20

申请人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Robert E. Simons

发明人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Robert E. Simons

IPC分类号： F28F700

CPC分类号： H01L23/473 ,  F28F1/32 ,  F28F3/12 ,  H01L2924/0002 ,  H01L2924/00

摘要： An integrated heat sink system is provided for internal cooling of a closed electronics container. The heat sink system includes a cold plate and a fin assembly thermally coupled to and extending from the cold plate. The cold plate has a surface for thermally coupling to one or more components within the container, such as a processor module. The heat sink system further includes at least one coolant carrier channel thermally coupled to and passing through the fins of the fin assembly. When the heat sink system is operational within the closed container, the cold plate thermally couples to and removes heat from the one or more components, the plurality of fins remove heat from air circulating within the closed container, and coolant within the coolant carrying channel(s) removes heat from the plurality of fins and from the cold plate thermally coupled thereto.

摘要翻译： 提供集成的散热器系统用于封闭的电子容器的内部冷却。 散热器系统包括热耦合到冷板并从冷板延伸的散热片组件。 冷板具有用于热耦合到容器内的一个或多个部件的表面，例如处理器模块。 散热器系统还包括至少一个与翅片组件的翅片热耦合并穿过翅片组件的翅片的冷却剂载体通道。 当散热器系统在密封容器内操作时，冷板热耦合到一个或多个部件热耦合并移除热量，多个散热片从密封容器内循环的空气和冷却剂携带通道内的冷却剂 s）从多个翅片和与其热耦合的冷板去除热量。

公开(公告)号：US06431260B1

公开(公告)日：2002-08-13

申请号：US09742919

申请日：2000-12-21

申请人： Dereje Agonafer ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Robert E. Simons

发明人： Dereje Agonafer ,  Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Robert E. Simons

IPC分类号： F28F700

CPC分类号： H01L23/4735 ,  H01L2924/0002 ,  Y10S165/908 ,  H01L2924/00

摘要： Cavity plate and jet nozzle assemblies are presented for use in cooling an electronic module. The assemblies include a cavity plate having one or more blind holes formed therein and one or more jet nozzles each configured to reside within a respective blind hole of the cavity plate. A lower surface of the blind hole and/or jet nozzle is curved to facilitate the flow of fluid from the blind hole after impinging upon the lower surface of the blind hole. Various jet nozzle configurations are also provided which employ pedestals or radially extending fins. Further, the radially extending fins may interdigitate with inwardly extending fins on the inner sidewall of a respective blind hole in the cavity plate. Methods of fabricating the cavity plate and jet nozzle assemblies are also presented.

摘要翻译： 提供腔板和喷嘴组件用于冷却电子模块。 组件包括一个具有形成在其中的一个或多个盲孔的空腔板，以及一个或多个喷嘴，各自被配置为位于空腔板的相应盲孔内。 盲孔和/或喷嘴的下表面是弯曲的，以便于在撞击到盲孔的下表面之后使流体从盲孔流出。 还提供了各种喷嘴构造，其采用基座或径向延伸的翅片。 此外，径向延伸的翅片可以与空腔板中的相应盲孔的内侧壁上的向内延伸的翅片相互交叉。 还提出了制造腔板和喷嘴组件的方法。

公开(公告)号：US06164076A

公开(公告)日：2000-12-26

申请号：US368803

申请日：1999-08-05

申请人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Robert E. Simons

发明人： Richard C. Chu ,  Michael J. Ellsworth, Jr. ,  Robert E. Simons

IPC分类号： F25B21/02 ,  H01L35/32

CPC分类号： H01L35/32 ,  F25B21/02 ,  F25B2321/0252

摘要： A thermoelectric cooling assembly is provided having at least a first thermoelectric stage thermally coupled to a heat source, such as an electronic device, and a second thermoelectric stage thermally coupled to the first thermoelectric stage across a "thermal space transformer". The first thermoelectric stage has a first surface area for thermal dissipation and the second thermoelectric stage has a second surface area for thermal absorption wherein the second surface area is greater than the first surface area. The thermal space transformer has a first thermal conductivity in a plane transverse to a direction of primary heat flow through the first thermoelectric stage and the second thermoelectric stage, and a second thermal conductivity in a direction parallel to the direction of primary heat flow, wherein the first thermal conductivity is greater than the second thermal conductivity. In one embodiment, the thermal space transformer can comprise a graphite composite material with diamond coating on both main surfaces thereof. The thermoelectric cooling assembly can further comprise: a cold plate; a refrigeration unit coupled to the cold plate; a dc power controller for controlling dc power through the first and second thermoelectric stages; and a temperature sensor for providing feedback information to the dc power controller on temperature of the electronic device being cooled.

摘要翻译： 提供了热电冷却组件，其具有至少热耦合到诸如电子设备的热源的第一热电台，以及通过“热空间变压器”热耦合到第一热电台的第二热电台。 第一热电段具有用于散热的第一表面区域，并且第二热电段具有用于热吸收的第二表面积，其中第二表面积大于第一表面积。 热空间变压器在垂直于通过第一热电段和第二热电台的初级热流的方向的平面中具有第一导热性，并且在平行于主热流方向的方向上具有第二导热系数，其中 第一导热率大于第二导热系数。 在一个实施例中，热空间变压器可以包括在其两个主表面上具有金刚石涂层的石墨复合材料。 热电冷却组件还可以包括：冷板; 联接到冷板的制冷单元; 直流电力控制器，用于通过第一和第二热电级控制直流电力; 以及温度传感器，用于在正在冷却的电子设备的温度上向dc功率控制器提供反馈信息。