公开(公告)号：US20140072204A1

公开(公告)日：2014-03-13

申请号：US14112105

申请日：2012-04-16

申请人： Yohei Minekawa ,  Yuji Takagi ,  Minoru Harada ,  Takehiro Hirai ,  Ryo Nakagaki

发明人： Yohei Minekawa ,  Yuji Takagi ,  Minoru Harada ,  Takehiro Hirai ,  Ryo Nakagaki

IPC分类号： G06T7/00 ,  G06K9/62

CPC分类号： G06T7/001 ,  G01N21/9501 ,  G01N23/225 ,  G01N2223/421 ,  G01N2223/611 ,  G01N2223/646 ,  G06K9/6267 ,  G06T5/00 ,  G06T2207/10061 ,  G06T2207/30148 ,  H01L22/12 ,  H01L22/20 ,  H01L2924/0002 ,  H01L2924/00

摘要： In automatic defect classification, a classification recipe must be set for each defect observation device. If a plurality of devices operate at the same stage, the classification class in the classification recipes must be the same. Problems have arisen whereby differences occur in the classification class in different devices when a new classification recipe is created. This defect classification system has a classification recipe storage unit; an information specification unit, the stage of a stored image, and device information. A corresponding defect specification unit specifies images of the same type of defect from images obtained from different image pickup devices at the same stage. An image conversion unit converts the images obtained from the different image pickup devices at the same stage into comparable similar images; and a recipe update unit records the classification classes in the classification recipes corresponding to the specified images of the same type of defect.

摘要翻译： 在自动缺陷分类中，必须为每个缺陷观察装置设定分类处方。 如果多个设备在同一阶段进行操作，则分类配方中的分类等级必须相同。 当创建新的分类配方时，出现了在不同装置中的分类等级中发生差异的问题。 该缺陷分类系统具有分类配方存储单元; 信息指定单元，存储图像的级和设备信息。 相应的缺陷指定单元从在相同阶段从不同图像拾取装置获得的图像中指定相同类型的缺陷的图像。 图像转换单元将从相同阶段的不同图像拾取装置获得的图像转换成可比较的相似图像; 并且配方更新单元将分类类别记录在与相同类型的缺陷的指定图像相对应的分类配方中。

公开(公告)号：US08595666B2

公开(公告)日：2013-11-26

申请号：US13382437

申请日：2010-05-14

申请人： Koichi Hayakawa ,  Takehiro Hirai ,  Yutaka Tandai ,  Tamao Ishikawa ,  Tsunehiro Sakai ,  Kazuhisa Hasumi ,  Kazunori Nemoto ,  Katsuhiko Ichinose ,  Yuji Takagi

发明人： Koichi Hayakawa ,  Takehiro Hirai ,  Yutaka Tandai ,  Tamao Ishikawa ,  Tsunehiro Sakai ,  Kazuhisa Hasumi ,  Kazunori Nemoto ,  Katsuhiko Ichinose ,  Yuji Takagi

IPC分类号： G06F17/50

CPC分类号： G01N21/8851 ,  G01N21/95607

摘要： A defect is efficiently and effectively classified by accurately determining the state of overlap between a design layout pattern and the defect. This leads to simple identification of a systematic defect. A defective image obtained through defect inspection or review of a semiconductor device is automatically pattern-matched with design layout data. A defect is superimposed on a design layout pattern for at least one layer of a target layer, a layer immediately above the target layer, and a layer immediately below the target layer. The state of overlap of the defect is determined as within the pattern, over the pattern, or outside the pattern, and the defect is automatically classified.

摘要翻译： 通过精确地确定设计布局图案和缺陷之间的重叠状态，有效地和有效地分类缺陷。 这导致系统缺陷的简单识别。 通过半导体器件的缺陷检查或检查获得的缺陷图像与设计布局数据自动匹配。 缺陷叠加在目标层的至少一层，目标层上方的层和目标层正下方的层的设计布局图案上。 缺陷的重叠状态被确定为图案内，图案上或图案之外，并且缺陷被自动分类。

公开(公告)号：US20120148352A1

公开(公告)日：2012-06-14

申请号：US12672921

申请日：2008-08-12

申请人： Takashi Miki ,  Yuji Takagi

发明人： Takashi Miki ,  Yuji Takagi

IPC分类号： B23C5/10

CPC分类号： B24B3/06 ,  B23C5/10

摘要： An end mill including multiple spiral flutes in a helical shape around an axis that are formed in a periphery of the top portion of an end mill body which rotates on the axis. Cutting edges are formed at peripheral side ridge portions of wall surfaces of the flutes facing a front side in an end mill rotating direction. Honing is applied along each peripheral cutting edge such that the cutting edge has a variable honing width in the direction of the axis.

摘要翻译： 一种端铣刀，其包括围绕轴线形成螺旋形的多个螺旋槽纹，所述螺旋槽形成在端轴铣刀主体的顶部的周边上，所述端部在轴线上旋转。 在端铣刀旋转方向上面向前侧的凹槽的壁面的周边侧脊部形成切削刃。 沿着每个周边切削刃施加珩磨，使得切削刃在轴线方向上具有可变的珩磨宽度。

公开(公告)号：US20120131529A1

公开(公告)日：2012-05-24

申请号：US13382437

申请日：2010-05-14

申请人： Koichi Hayakawa ,  Takehiro Hirai ,  Yutaka Tandai ,  Tamao Ishikawa ,  Tsunehiro Sakai ,  Kazuhisa Hasumi ,  Kazunori Nemoto ,  Katsuhiko Ichinose ,  Yuji Takagi

发明人： Koichi Hayakawa ,  Takehiro Hirai ,  Yutaka Tandai ,  Tamao Ishikawa ,  Tsunehiro Sakai ,  Kazuhisa Hasumi ,  Kazunori Nemoto ,  Katsuhiko Ichinose ,  Yuji Takagi

IPC分类号： G06F17/50

CPC分类号： G01N21/8851 ,  G01N21/95607

摘要： A defect is efficiently and effectively classified by accurately determining the state of overlap between a design layout pattern and the defect. This leads to simple identification of a systematic defect. A defective image obtained through defect inspection or review of a semiconductor device is automatically pattern-matched with design layout data. A defect is superimposed on a design layout pattern for at least one layer of a target layer, a layer immediately above the target layer, and a layer immediately below the target layer. The state of overlap of the defect is determined as within the pattern, over the pattern, or outside the pattern, and the defect is automatically classified.

摘要翻译： 通过精确地确定设计布局图案和缺陷之间的重叠状态，有效地和有效地分类缺陷。 这导致系统缺陷的简单识别。 通过半导体器件的缺陷检查或检查获得的缺陷图像与设计布局数据自动匹配。 缺陷叠加在目标层的至少一层，目标层上方的层和目标层正下方的层的设计布局图案上。 缺陷的重叠状态被确定为图案内，图案上或图案之外，并且缺陷被自动分类。

公开(公告)号：US08116556B2

公开(公告)日：2012-02-14

申请号：US12888286

申请日：2010-09-22

申请人： Hisae Shibuya ,  Yuji Takagi

发明人： Hisae Shibuya ,  Yuji Takagi

IPC分类号： G06K9/00

CPC分类号： G06T7/0004 ,  G06T2207/30148

摘要： In a process for manufacturing a semiconductor wafer, defect distribution state analysis is performed so as to facilitate identification of the defect cause including a device cause and a process cause by classifying the defect distribution state according to the defect position coordinates detected by the inspection device, into one of the distribution characteristic categories: repeated defects, clustered defects, arc-shaped regional defects, radial regional defects, line type regional defects, ring and blob type regional defects, and random defects.

摘要翻译： 在制造半导体晶片的过程中，进行缺陷分布状态分析，以便根据由检查装置检测到的缺陷位置坐标来分类缺陷分布状态，便于识别包括装置原因和处理原因的缺陷原因， 成为分布特征类别之一：反复缺陷，聚类缺陷，弧形区域缺陷，径向区域缺陷，线型区域缺陷，环型和Blob型区域缺陷以及随机缺陷。

公开(公告)号：US08027527B2

公开(公告)日：2011-09-27

申请号：US11472368

申请日：2006-06-22

申请人： Hisae Shibuya ,  Yuji Takagi

发明人： Hisae Shibuya ,  Yuji Takagi

IPC分类号： G06K9/00

CPC分类号： G01N21/956 ,  G01N21/9501 ,  G06T7/0006 ,  G06T7/001 ,  G06T2207/30148

摘要： The distribution states of defects are analyzed on the basis of the coordinates of defects detected by an inspection apparatus to classify them into a distribution feature category, or any one of repetitive defect, congestion defect, linear distribution defect, ring/lump distribution defect and random defect. In the manufacturing process for semiconductor substrates, defect distribution states are analyzed on the basis of defect data detected by an inspection apparatus, thereby specifying the cause of defect in apparatus or process.

公开(公告)号：US07934890B2

公开(公告)日：2011-05-03

申请号：US12400098

申请日：2009-03-09

申请人： Yuji Takagi ,  Seiichiro Kitaura

发明人： Yuji Takagi ,  Seiichiro Kitaura

IPC分类号： B23C5/10 ,  B26D1/12

CPC分类号： B23C5/10 ,  B23C2210/0485 ,  B23C2210/282 ,  B23C2210/40 ,  Y10T407/1946 ,  Y10T407/1948 ,  Y10T407/1966

摘要： A plurality of chip discharge flutes are located on an outer periphery of a tip portion of the end mill body which rotates on its axis. Helix angles between the axis and the cutting edges in the chip discharge flutes, of which are at least one or more; are different from others. A cross-section perpendicular to the axis shows that a flute bottom face in a main flute portion forms a concavely curved shape from the rake face to a point where the flute bottom face, touches a web thickness circle of the end mill body, forms a linear shape, and goes toward the end mill rotating direction; and a flute bottom face in a sub-flute portion forms a linear shape, intersects with the flute bottom face in the main flute portion at an obtuse angle, goes further toward the end mill rotating direction.

摘要翻译： 多个排屑槽位于端铣刀本体的其轴线旋转的末端部分的外周上。 芯片排出槽之间的轴与切削刃之间的螺旋角度至少为一个以上; 与其他人不同 垂直于轴线的横截面示出了主凹槽部分中的凹槽底面从前刀面形成凹形弯曲形状，其中凹槽底面接触端铣刀体的腹板厚度圆形形成 线性形状，朝向立铣刀旋转方向; 并且子槽部分中的凹槽底面形成直线形状，与主凹槽部分中的凹槽底面以钝角相交，进一步朝向端铣刀旋转方向。

公开(公告)号：US07813539B2

公开(公告)日：2010-10-12

申请号：US10672010

申请日：2003-09-25

申请人： Hisae Shibuya ,  Yuji Takagi

发明人： Hisae Shibuya ,  Yuji Takagi

IPC分类号： G06K9/00

CPC分类号： G06T7/0004 ,  G06T2207/30148

摘要： In a process for manufacturing a semiconductor wafer, defect distribution state analysis is performed so as to facilitate identification of the defect cause including a device cause and a process cause by classifying the defect distribution state according to the defect position coordinates detected by the inspection device, into one of the distribution characteristic categories: repeated defects, clustered defects, arc-shaped regional defects, radial regional defects, line type regional defects, ring and blob type regional defects, and random defects.

摘要翻译： 在制造半导体晶片的过程中，进行缺陷分布状态分析，以便根据由检查装置检测到的缺陷位置坐标来分类缺陷分布状态，便于识别包括装置原因和处理原因的缺陷原因， 成为分布特征类别之一：反复缺陷，聚类缺陷，弧形区域缺陷，径向区域缺陷，线型区域缺陷，环型和Blob型区域缺陷以及随机缺陷。

公开(公告)号：US07602962B2

公开(公告)日：2009-10-13

申请号：US10762091

申请日：2004-01-20

申请人： Atsushi Miyamoto ,  Hirohito Okuda ,  Toshifumi Honda ,  Yuji Takagi ,  Takashi Hiroi

发明人： Atsushi Miyamoto ,  Hirohito Okuda ,  Toshifumi Honda ,  Yuji Takagi ,  Takashi Hiroi

IPC分类号： G06K9/00

CPC分类号： G06T7/0004 ,  G06K9/6253 ,  G06T2207/30148

摘要： The present invention provides a method of classifying defects wherein defects are detected in a first inspection machine. The detected defects are then reviewed by a second inspection machine. A sampling rate for review by the second inspection machine is determined by a defect classifier in the first inspection machine.

摘要翻译： 本发明提供了在第一检查机中检测到缺陷的缺陷分类方法。 然后检测到的缺陷由第二台检查机检查。 由第二检查机检查的采样率由第一检查机中的缺陷分类器确定。

公开(公告)号：US20090105990A1

公开(公告)日：2009-04-23

申请号：US12341657

申请日：2008-12-22

申请人： Hisae SHIBUYA ,  Yuji Takagi

发明人： Hisae SHIBUYA ,  Yuji Takagi

IPC分类号： G06F15/00

CPC分类号： G01N21/956 ,  G06T7/0006 ,  G06T7/001 ,  G06T2207/30148

摘要： The distribution states of defects are analyzed on the basis of the coordinates of defects detected by an inspection apparatus to classify them into a distribution feature category, or any one of repetitive defect, congestion defect, linear distribution defect, ring/lump distribution defect and random defect. In the manufacturing process for semiconductor substrates, defect distribution states are analyzed on the basis of defect data detected by an inspection apparatus, thereby specifying the cause of defect in apparatus or process.

摘要翻译： 基于由检查装置检测到的缺陷坐标来分析缺陷的分布状态，将其分类为分布特征类别，或重复缺陷，拥塞缺陷，线性分布缺陷，环/块分布缺陷和随机 缺陷。 在半导体基板的制造工序中，基于由检查装置检测出的缺陷数据来分析缺陷分布状态，从而指定装置或处理中的缺陷的原因。