Memory components and controllers that calibrate multiphase synchronous timing references

    公开(公告)号:US11289139B2

    公开(公告)日:2022-03-29

    申请号:US16793638

    申请日:2020-02-18

    Applicant: Rambus Inc.

    Abstract: A first timing reference signal and a second timing reference signal are sent to a memory device. The second timing reference signal has approximately a quadrature phase relationship with respect to the first timing reference signal. A plurality of serial data patterns are received from the memory device. The transitions of the first timing reference and the second timing reference determining when transitions occur between the bits of the plurality of data patterns. Timing indicators associated with when received transitions occur between the bits of the plurality of data patterns are received from the memory device. The timing indicators are each measured using a single sampler. Based on the timing indicators, a first duty cycle adjustment for the first timing reference signal, a second duty cycle adjustment for the second timing reference signal, and a quadrature phase adjustment are determined and applied.

    FOLDED MEMORY MODULES
    132.
    发明申请

    公开(公告)号:US20210124703A1

    公开(公告)日:2021-04-29

    申请号:US16950861

    申请日:2020-11-17

    Applicant: Rambus Inc.

    Abstract: A memory module comprises a data interface including a plurality of data lines and a plurality of configurable switches coupled between the data interface and a data path to one or more memories. The effective width of the memory module can be configured by enabling or disabling different subsets of the configurable switches. The configurable switches may be controlled by manual switches, by a buffer on the memory module, by an external memory controller, or by the memories on the memory module.

    Coordinating memory operations using memory-device-generated reference signals

    公开(公告)号:US10754799B2

    公开(公告)日:2020-08-25

    申请号:US16436368

    申请日:2019-06-10

    Applicant: Rambus Inc.

    Abstract: A memory system includes a memory controller coupled to multiple memory devices. Each memory device includes an oscillator that generates an internal reference signal that oscillates at a frequency that is a function of physical device structures within the memory device. The frequencies of the internal reference signals are thus device specific. Each memory device develops a shared reference signal from its internal reference signal and communicates the shared reference signal to the common memory controller. The memory controller uses the shared reference signals to recover device-specific frequency information from each memory device, and then communicates with each memory device at a frequency compatible with the corresponding internal reference signal.

    Memory System Topologies Including A Memory Die Stack

    公开(公告)号:US20200234756A1

    公开(公告)日:2020-07-23

    申请号:US16842368

    申请日:2020-04-07

    Applicant: Rambus Inc.

    Abstract: Systems, among other embodiments, include topologies (data and/or control/address information) between an integrated circuit buffer device (that may be coupled to a master, such as a memory controller) and a plurality of integrated circuit memory devices. For example, data may be provided between the plurality of integrated circuit memory devices and the integrated circuit buffer device using separate segmented (or point-to-point link) signal paths in response to control/address information provided from the integrated circuit buffer device to the plurality of integrated circuit buffer devices using a single fly-by (or bus) signal path. An integrated circuit buffer device enables configurable effective memory organization of the plurality of integrated circuit memory devices. The memory organization represented by the integrated circuit buffer device to a memory controller may be different than the actual memory organization behind or coupled to the integrated circuit buffer device. The buffer device segments and merges the data transferred between the memory controller that expects a particular memory organization and actual memory organization.

    Memory system topologies including a buffer device and an integrated circuit memory device

    公开(公告)号:US10672458B1

    公开(公告)日:2020-06-02

    申请号:US16692043

    申请日:2019-11-22

    Applicant: Rambus Inc.

    Abstract: Systems, among other embodiments, include topologies (data and/or control/address information) between an integrated circuit buffer device (that may be coupled to a master, such as a memory controller) and a plurality of integrated circuit memory devices. For example, data may be provided between the plurality of integrated circuit memory devices and the integrated circuit buffer device using separate segmented (or point-to-point link) signal paths in response to control/address information provided from the integrated circuit buffer device to the plurality of integrated circuit buffer devices using a single fly-by (or bus) signal path. An integrated circuit buffer device enables configurable effective memory organization of the plurality of integrated circuit memory devices. The memory organization represented by the integrated circuit buffer device to a memory controller may be different than the actual memory organization behind or coupled to the integrated circuit buffer device. The buffer device segments and merges the data transferred between the memory controller that expects a particular memory organization and actual memory organization.

    Memory Error Detection
    136.
    发明申请

    公开(公告)号:US20200073752A1

    公开(公告)日:2020-03-05

    申请号:US16678159

    申请日:2019-11-08

    Applicant: Rambus Inc.

    Abstract: Systems and methods are provided for detecting and correcting address errors in a memory system. In the memory system, a memory device generates an error-detection code based on an address transmitted via an address bus and transmits the error-detection code to a memory controller. The memory controller transmits an error indication to the memory device in response to the error-detection code. The error indication causes the memory device to remove the received address and prevent a memory operation

    MEMORY WITH ALTERNATIVE COMMAND INTERFACES
    137.
    发明申请

    公开(公告)号:US20200004714A1

    公开(公告)日:2020-01-02

    申请号:US16520137

    申请日:2019-07-23

    Applicant: Rambus Inc.

    Abstract: A memory device or module selects between alternative command ports. Memory systems with memory modules incorporating such memory devices support point-to-point connectivity and efficient interconnect usage for different numbers of modules. The memory devices and modules can be of programmable data widths. Devices on the same module can be configured select different command ports to facilitate memory threading. Modules can likewise be configured to select different command ports for the same purpose.

    On-Die Termination
    138.
    发明申请
    On-Die Termination 审中-公开

    公开(公告)号:US20190379378A1

    公开(公告)日:2019-12-12

    申请号:US16425406

    申请日:2019-05-29

    Applicant: Rambus Inc.

    Inventor: Ian Shaeffer

    Abstract: Local on-die termination controllers for effecting termination of a high-speed signaling links simultaneously engage on-die termination structures within multiple integrated-circuit memory devices disposed on the same memory module, and/or within the same integrated-circuit package, and coupled to the high-speed signaling link. A termination control bus is coupled to memory devices on a module, and provides for peer-to-peer communication of termination control signals.

    Memory system topologies including a buffer device and an integrated circuit memory device

    公开(公告)号:US10381067B2

    公开(公告)日:2019-08-13

    申请号:US15832468

    申请日:2017-12-05

    Applicant: Rambus Inc.

    Abstract: Systems, among other embodiments, include topologies (data and/or control/address information) between an integrated circuit buffer device (that may be coupled to a master, such as a memory controller) and a plurality of integrated circuit memory devices. For example, data may be provided between the plurality of integrated circuit memory devices and the integrated circuit buffer device using separate segmented (or point-to-point link) signal paths in response to control/address information provided from the integrated circuit buffer device to the plurality of integrated circuit buffer devices using a single fly-by (or bus) signal path. An integrated circuit buffer device enables configurable effective memory organization of the plurality of integrated circuit memory devices. The memory organization represented by the integrated circuit buffer device to a memory controller may be different than the actual memory organization behind or coupled to the integrated circuit buffer device. The buffer device segments and merges the data transferred between the memory controller that expects a particular memory organization and actual memory organization.

    Memory controller that uses a specific timing reference signal in connection with a data burst following a specified idle period

    公开(公告)号:US10331587B2

    公开(公告)日:2019-06-25

    申请号:US15498065

    申请日:2017-04-26

    Applicant: Rambus Inc.

    Abstract: Apparatus and methods for operation of a memory controller, memory device and system are described. During operation, the memory controller transmits a read command which specifies that a memory device output data accessed from a memory core. This read command contains information which specifies whether the memory device is to commence outputting of a timing reference signal prior to commencing outputting of the data. The memory controller receives the timing reference signal if the information specified that the memory device output the timing reference signal. The memory controller subsequently samples the data output from the memory device based on information provided by the timing reference signal output from the memory device.

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