公开(公告)号：US07408330B2

公开(公告)日：2008-08-05

申请号：US11448651

申请日：2006-06-06

Applicant: Bin Zhao

Inventor： Bin Zhao

IPC: G05F1/00

CPC classification number: H02M3/07

Abstract: According to one exemplary embodiment, a voltage up-conversion circuit includes a modulated voltage generator circuit, where the modulated voltage generator circuit is configured to receive an input voltage and generate a modulated voltage, and where the modulated voltage generator circuit includes at least one transistor. The voltage up-conversion circuit further includes a switching circuit coupled to the modulated voltage generator circuit, where the switching circuit is configured to couple the modulated voltage to a load capacitor when the modulated voltage is at a high level and decouple the modulated voltage to the load capacitor when the modulated voltage is at a low level. In the voltage up-conversion circuit, the load capacitor reaches a voltage greater a breakdown voltage of the at least one transistor in the modulated voltage generator circuit. The breakdown voltage can be a reliability breakdown voltage.

Abstract translation: 根据一个示例性实施例，电压上变换电路包括调制电压发生器电路，其中调制电压发生器电路被配置为接收输入电压并产生调制电压，并且其中调制电压发生器电路包括至少一个晶体管 。 电压上变换电路还包括耦合到调制电压发生器电路的开关电路，其中开关电路被配置为当调制电压处于高电平时将调制电压耦合到负载电容器，并将调制电压去耦到 当调制电压处于低电平时加载电容。 在电压上变换电路中，负载电容器达到调制电压发生器电路中至少一个晶体管的击穿电压更大的电压。 击穿电压可以是可靠性击穿电压。

公开(公告)号：US07130883B2

公开(公告)日：2006-10-31

申请号：US09751424

申请日：2000-12-29

Applicant: Min Zhu ,  Jian Shen ,  Steven Li ,  Guanghong Yang ,  Bin Zhao ,  Shi Yan ,  Zheng Yuan

Inventor： Min Zhu ,  Jian Shen ,  Steven Li ,  Guanghong Yang ,  Bin Zhao ,  Shi Yan ,  Zheng Yuan

IPC: G06F13/00

CPC classification number: H04L12/1827 ,  H04L67/1095 ,  H04L69/329 ,  H04L69/40

Abstract: A distributed collaborative computer system is provided that comprises a plurality of server computers interconnected via a high-speed link. Client computers can connect to any available server computer and start or join a conference hosted on either the server computer to which the client computer is connected or any other server in the system. As a result, the system and method of the present invention is easily scalable to support an arbitrary number of participants to a conference by merely adding the appropriate number of server computers to the system. In addition, by replicating the conference information on more than one server computer, the single point of failure limitation is eliminated. In fact, if a server hosting or participating in a conference malfunctions, the failure is detected by other server computers and the client computer is able to reconnect to the conference through a new server computer.

公开(公告)号：US07073127B2

公开(公告)日：2006-07-04

申请号：US10188463

申请日：2002-07-01

Applicant: Bin Zhao ,  Rusong Fang ,  Lihong Wang

Inventor： Bin Zhao ,  Rusong Fang ,  Lihong Wang

IPC: G09G5/00

CPC classification number: G11B27/34 ,  G11B27/034

Abstract: A graphical user interface for editing a video story includes a storyboard pane, a timeline pane, and a layer pane. The storyboard pane displays video clips of the video story and their transitions. The timeline pane displays tracks including a video track, a video overlay track, a text track, an effect track, and at least one audio track. The layer pane displays layers of a selected video clip from the video track. Each layer displays one layer clip. The layer clip can be a video layer clip, a text layer clip, or an audio layer clip. The layers in the layer pane show how the layer clips overlay each other (or not) in time to compose the selected video clip. A user uses the storyboard pane and the timeline pane to layout the video story, and the layer pane to layout the video clips in the video story.

Abstract translation: 用于编辑视频故事的图形用户界面包括故事板窗格，时间轴窗格和图层窗格。 故事板窗格显示视频故事及其过渡的视频剪辑。 时间轴窗格显示包括视频轨道，视频覆盖轨道，文本轨道，效果轨道和至少一个音频轨道的轨道。 图层窗格从视频轨道显示所选视频剪辑的图层。 每层显示一层剪辑。 层剪辑可以是视频层剪辑，文本层剪辑或音频层剪辑。 图层窗格中的图层显示了层次剪辑如何及时叠加（或不及时）组合所选视频剪辑。 用户使用故事板窗格和时间轴窗格布局视频故事，以及图层窗格，以在视频故事中布局视频剪辑。

公开(公告)号：US07069298B2

公开(公告)日：2006-06-27

申请号：US09751807

申请日：2000-12-29

Applicant: Min Zhu ,  Jian Shen ,  Shi Yan ,  Bin Zhao

Inventor： Min Zhu ,  Jian Shen ,  Shi Yan ,  Bin Zhao

IPC: G06F13/00

CPC classification number: H04L12/1827 ,  H04L12/1868 ,  Y10S707/99953

Abstract: A fault-tolerant distributed collaborative computer system is provided that comprises a plurality of server computers interconnected via a high-speed link. By replicating the conference information on more than one server computer, the single point of failure limitation is eliminated. In fact, if a server hosting or participating in a conference malfunctions, the failure is detected by other server computers and the client computer is able to reconnect to the conference through a new server computer. In addition, the state of processes executed by the server computers is periodically replicated, so that when failure of a process is detected a new processes can be spawned and the replicated state information loaded onto the new process, allowing the on-line conference to continue.

公开(公告)号：US07049246B1

公开(公告)日：2006-05-23

申请号：US09575055

申请日：2000-05-19

Applicant: Q. Z. Liu ,  David Feiler ,  Bin Zhao ,  Phil N. Sherman ,  Maureen Brongo

Inventor： Q. Z. Liu ,  David Feiler ,  Bin Zhao ,  Phil N. Sherman ,  Maureen Brongo

IPC: H01L21/302 ,  H01L21/461 ,  H01L21/20 ,  H01L21/8242

CPC classification number: H01L28/86 ,  H01L23/5223 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Method for selective fabrication of high capacitance density areas in a low dielectric constant material and related structure are disclosed. In one embodiment, a first area of a dielectric layer is covered while a second area of the dielectric layer is exposed to a dielectric conversion source. The exposure causes the dielectric constant of the dielectric layer in the second area to increase. A number of interconnect trenches are etched in the first area of the dielectric and a number of capacitor trenches are etched in the second area of the dielectric. The interconnect trenches and the capacitor trenches are then filled with an appropriate metal, such as copper, and a chemical mechanical polish is performed. The second area in which the capacitor trenches have been etched and filled has a higher capacitance density relative to the first area.

Abstract translation: 公开了用于选择性地制造低介电常数材料和相关结构中的高电容密度区域的方法。 在一个实施例中，电介质层的第一区域被覆盖，同时介电层的第二区域暴露于电介质转换源。 曝光导致第二区域中介电层的介电常数增加。 在电介质的第一区域中蚀刻多个互连沟槽，并且在电介质的第二区域中蚀刻多个电容器沟槽。 然后用适当的金属（例如铜）填充互连沟槽和电容器沟槽，并进行化学机械抛光。 其中电容器沟槽被蚀刻和填充的第二区域相对于第一区域具有较高的电容密度。

公开(公告)号：US20050203915A1

公开(公告)日：2005-09-15

申请号：US11058078

申请日：2005-02-15

Applicant: Min Zhu ,  Bin Zhao

Inventor： Min Zhu ,  Bin Zhao

IPC: G06F9/445 ,  G06F9/46 ,  H04L12/18 ,  H04L29/06 ,  G06F7/00

CPC classification number: H04L65/403 ,  G06F9/547 ,  H04L12/1827 ,  H04L29/06027 ,  H04L65/80

Abstract: A distributed collaborative computer system is provided that comprises a plurality of server computers interconnected via a high-speed link. Client computers can connect to any available server computer and start or join a conference hosted on either the server computer to which the client computer is connected or any other server in the system. As a result, the system and method of the present invention is easily scalable to support an arbitrary number of participants to a conference by merely adding the appropriate number of server computers to the system. In addition, by replicating the conference information on more than one server computer, the single point of failure limitation is eliminated. In fact, if a server hosting or participating in a conference malfunctions, the failure is detected by other server computers and the client computer is able to reconnect to the conference through a new server computer.

Abstract translation: 提供了一种分布式协同计算机系统，其包括通过高速链路互连的多个服务器计算机。 客户端计算机可以连接到任何可用的服务器计算机，并启动或加入在与客户端计算机连接的服务器计算机或系统中的任何其他服务器上托管的会议。 结果，本发明的系统和方法可以容易地扩展，以通过仅仅将适当数量的服务器计算机添加到系统来支持会议的任意数量的参与者。 另外，通过在多台服务器计算机上复制会议信息，消除了单点故障限制。 事实上，如果托管或参与会议的服务器发生故障，则其他服务器计算机检测到故障，客户端计算机能够通过新的服务器计算机重新连接到会议。

公开(公告)号：US06925645B2

公开(公告)日：2005-08-02

申请号：US09752376

申请日：2000-12-29

Applicant: Min Zhu ,  Bin Zhao

Inventor： Min Zhu ,  Bin Zhao

IPC: G06F9/445 ,  G06F9/46 ,  H04L12/18 ,  H04L29/06 ,  G06F9/00

CPC classification number: H04L65/403 ,  G06F9/547 ,  H04L12/1827 ,  H04L29/06027 ,  H04L65/80

Abstract: A distributed collaborative computer system is provided that comprises a plurality of server computers interconnected via a high-speed link. Client computers can connect to any available server computer and start or join a conference hosted on either the server computer to which the client computer is connected or any other server in the system. As a result, the system and method of the present invention is easily scalable to support an arbitrary number of participants to a conference by merely adding the appropriate number of server computers to the system. In addition, by replicating the conference information on more than one server computer, the single point of failure limitation is eliminated. In fact, if a server hosting or participating in a conference malfunctions, the failure is detected by other server computers and the client computer is able to reconnect to the conference through a new server computer.

公开(公告)号：US06838352B1

公开(公告)日：2005-01-04

申请号：US10190459

申请日：2002-07-05

Applicant: Bin Zhao

Inventor： Bin Zhao

IPC: H01L21/02 ,  H01L21/768 ,  H01L21/20

CPC classification number: H01L28/75 ,  H01L21/76807 ,  H01L23/5223

Abstract: A method for fabricating a capacitor on a semiconductor substrate is disclosed. The method may include simultaneously forming at least one via and at least one upper capacitor plate opening in a first dielectric layer having an underlying cap dielectric layer deposited over a first material region having a first conductive material within a conductive region and forming a trench above the via. The method may also include filling the via, trench, and upper capacitor plate opening with a second conductive material resulting in an integrated circuit structure and employing CMP to remove any excess second conductive material from the integrated circuit structure.

Abstract translation: 公开了一种在半导体衬底上制造电容器的方法。 该方法可以包括同时形成至少一个通孔和至少一个上电容器板开口，该第一电介质层具有沉积在具有导电区域内的第一导电材料的第一材料区域上的底层盖电介质层，并且形成在 通过。 该方法还可以包括用第二导电材料填充通孔，沟槽和上电容器板开口，得到集成电路结构，并采用CMP从集成电路结构中去除任何多余的第二导电材料。

公开(公告)号：US06809863B2

公开(公告)日：2004-10-26

申请号：US10016166

申请日：2001-11-30

Applicant: Bin Zhao

Inventor： Bin Zhao

IPC: G02B530

CPC classification number: G02B5/3083 ,  Y10S359/90

Abstract: A low dispersion comb filter or interleaver assembly has a first interleaver element and a second interleaver element. The first interleaver element is configured so as to provide a dispersion vs. wavelength curve wherein each dispersion value thereof is approximately opposite in value to a dispersion value at the same wavelength for the second interleaver element, so as to mitigate net or total dispersion in the interleaver assembly.

Abstract translation: 低色散梳状滤波器或交织器组件具有第一交织器元件和第二交织器元件。 第一交织器元件被配置为提供色散相对于波长曲线，其中其每个色散值与第二交织器元件的相同波长处的色散值几乎相反，以便减轻第二交织器元件中的净色散或总色散 交织器装配。

公开(公告)号：US06787911B1

公开(公告)日：2004-09-07

申请号：US09317536

申请日：1999-05-24

Applicant: Bin Zhao ,  Maureen R. Brongo

Inventor： Bin Zhao ,  Maureen R. Brongo

IPC: H01L2348

CPC classification number: H01L21/76802 ,  H01L21/76801 ,  H01L21/76819 ,  H01L21/76834

Abstract: A method is provided for forming an improved interconnect structure on a semiconductor body. A first metal layer is deposited on the semiconductor body. A sacrificial layer having a height is deposited on the first metal layer. The sacrificial layer and the metal layer are patterned to form separate metal lines with the sacrificial layer remaining on said metal lines. A look material is then deposited to fill the gaps bet n metal lines and to cover the sacrificial layer. The low-k material is then removed to a level within the height of the sacrificial layer. The sacrificial layer is then removed. A prove layer is deposited on top of the metal lines and the look material. A dielectric layer is deposited over the protective layer. The protective layer protects the low-k material from attack by chemicals utilized by subsequent process steps to etch vias in the dielectric layer, to strip photoresist, and to clean the vias. The protective layer is then selectively etched away to make contact between a via plug and the metal lines.

Abstract translation: 提供了一种用于在半导体本体上形成改进的互连结构的方法。 第一金属层沉积在半导体本体上。 具有高度的牺牲层沉积在第一金属层上。 牺牲层和金属层被图案化以形成分离的金属线，牺牲层保留在所述金属线上。 然后沉积外观材料以填充金属线上的间隙并覆盖牺牲层。 然后将低k材料去除到牺牲层的高度内的水平。 然后去除牺牲层。 证明层沉积在金属线和外观材料的顶部。 介电层沉积在保护层上。 保护层保护低k材料免受后续工艺步骤所用化学品的侵蚀，以蚀刻电介质层中的通孔，剥离光致抗蚀剂，并清洁通孔。 然后选择性地蚀刻保护层以使通孔塞和金属线之间的接触。