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    Cold worked metal housing for a portable electronic device
    151.
    发明授权
    Cold worked metal housing for a portable electronic device 有权

    公开(公告)号：US09826650B2

    公开(公告)日：2017-11-21

    申请号：US14313505

    申请日：2014-06-24

    Applicant: Apple Inc.

    Inventor： Stephen P. Zadesky ,  Phillip M. Hobson ,  Tang Yew Tan

    IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  H05K5/02 ,  H04M1/02

    Abstract: A cold worked stainless steel bezel for a portable electronic device. The bezel is secured flush to a housing to form part of the case of the portable electronic device. A brace that includes a slot for receiving a wall extending from the bezel is fixed to the housing. When the bezel engages the housing, the wall of the bezel is inserted in the slot of the brace and releasably held by a spring that engages both the brace and the wall. The bezel can be released by disengaging the spring. The bezel is hard and resistant to impacts. Cold worked steel also facilitates manufacturing within design constraints and tolerances, and requires very little machining after manufacturing to comply with those constraints. the portable electronic device may include a personal media device, a mobile telephone, or any other suitable device or combination thereof.

    Ejectable component assemblies in electronic devices
    152.
    发明授权
    Ejectable component assemblies in electronic devices 有权
    电子设备中的可弹性组件

    公开(公告)号：US09504179B2

    公开(公告)日：2016-11-22

    申请号：US14276610

    申请日：2014-05-13

    Applicant: Apple Inc.

    Inventor： Erik L. Wang ,  Robert Sean Murphy ,  Tang Yew Tan ,  Jeffrey Eugene Neaves ,  Lawrence E. Davis ,  Sung Kim

    IPC: H05K7/14 ,  H05K5/02 ,  H05K1/02 ,  H04M1/02

    CPC classification number: H04M1/026 ,  H04M2250/14 ,  H05K1/02 ,  H05K5/0295 ,  H05K7/1405 ,  H05K7/1427

    Abstract: Electronic devices are provided with ejectable component assemblies that can be substantially flush with the external surfaces of the housings of the devices, despite variations in their manufacture. The ejectable component assemblies may include connectors coupled to circuit boards of the devices, and trays that can be loaded with removable modules, inserted through openings in the housings of the devices, and into the connectors for functionally aligning the removable modules with the circuit boards. The ejectable component assemblies may also include ejectors coupled to the housings of the devices for ejecting the trays from the connectors and, thus, from the devices themselves.

    Abstract translation: 电子设备设置有可排出的部件组件，其可以与设备的壳体的外表面基本齐平，尽管其制造方面有变化。 可喷射部件组件可以包括连接到设备的电路板的连接器，以及可以装载有通过设备壳体中的开口插入的可移除模块的托盘，并且用于将可拆卸模块与电路板功能对准。 可喷射部件组件还可以包括联接到装置的壳体的喷射器，用于从连接器弹出托盘，并且因此从装置本身排出托盘。

    Wireless Handheld Electronic Device
    154.
    发明申请
    Wireless Handheld Electronic Device 审中-公开
    无线手持电子设备

    公开(公告)号：US20150214602A1

    公开(公告)日：2015-07-30

    申请号：US14612187

    申请日：2015-02-02

    Applicant: Apple Inc.

    Inventor： Phillip M. Hobson ,  Stephen P. Zadesky ,  Erik L. Wang ,  Tang Yew Tan ,  Richard Hung Minh Dinh ,  Adam D. Mittleman ,  Kenneth A. Jenks ,  Robert J. Hill ,  Robert W. Schlub

    IPC: H01Q1/24 ,  H01Q1/50

    CPC classification number: H01Q1/243 ,  H01Q1/24 ,  H01Q1/273 ,  H01Q1/38 ,  H01Q1/46 ,  H01Q1/48 ,  H01Q1/50 ,  H01Q5/371 ,  H01Q5/40 ,  H01Q7/00 ,  H01Q9/0421 ,  H01Q9/42 ,  H01Q13/10 ,  H01Q21/28

    Abstract: A handheld electronic device may be provided that contains a conductive housing and other conductive elements. The conductive elements may form an antenna ground plane. One or more antennas for the handheld electronic device may be formed from the ground plane and one or more associated antenna resonating elements. Transceiver circuitry may be connected to the resonating elements by transmission lines such as coaxial cables. Ferrules may be crimped to the coaxial cables. A bracket with extending members may be crimped over the ferrules to ground the coaxial cables to the housing and other conductive elements in the ground plane. The ground plane may contain an antenna slot. A dock connector and flex circuit may overlap the slot in a way that does not affect the resonant frequency of the slot. Electrical components may be isolated from the antenna using isolation elements such as inductors and resistors.

    Abstract translation: 可以提供包含导电外壳和其它导电元件的手持电子设备。 导电元件可形成天线接地平面。 用于手持电子设备的一个或多个天线可以由接地平面和一个或多个相关联的天线谐振元件形成。 收发器电路可以通过诸如同轴电缆的传输线连接到谐振元件。 套圈可以压接到同轴电缆。 具有延伸构件的托架可以压接在套圈上以将同轴电缆接地到壳体和接地平面中的其它导电元件。 接地平面可能包含天线槽。 坞站连接器和柔性电路可以以不影响槽的谐振频率的方式与槽重叠。 电气部件可以使用隔离元件例如电感器和电阻器与天线隔离。

    INSERT MOLDED DEVICE HOUSINGS FOR PORTABLE ELECTRONIC DEVICES
    158.
    发明申请
    INSERT MOLDED DEVICE HOUSINGS FOR PORTABLE ELECTRONIC DEVICES 审中-公开
    为便携式电子设备插入模制设备外壳

    公开(公告)号：US20140071601A1

    公开(公告)日：2014-03-13

    申请号：US14078368

    申请日：2013-11-12

    Applicant: Apple Inc.

    Inventor： Daniel W. Jarvis ,  Stephen P. Zadesky ,  Pinida J. Moolsintong ,  Tang Yew Tan

    IPC: H05K5/02 ,  H05K5/00

    CPC classification number: H05K5/0208 ,  B32B37/16 ,  H05K5/0017 ,  H05K5/02 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49158

    Abstract: Improved techniques for forming an electronic device housing in which an outer housing member can be assembled with one or more other housing members of the electronic device are disclosed. The one or more other housing members can together with a thin substrate layer (or thin substrate) form a frame to which the outer housing member can be secured. The thin substrate layer facilitates molding of the one or more other housing members adjacent to the outer housing member. In one embodiment, the outer housing member can be made of glass and the one or more other housing members can be made of a polymer, such as plastic. The substrate layer can, for example, be formed of a polymer or a metal. The resulting electronic device housing can be thin yet be sufficiently strong to be suitable for use in electronic devices, such as portable electronic devices.

    Abstract translation: 公开了用于形成电子设备外壳的改进技术，其中外壳构件可以与电子设备的一个或多个其它外壳构件组装。 一个或多个其它壳体构件可以与薄的衬底层（或薄衬底）一起形成框架，外壳构件可以固定到框架上。 薄的衬底层有助于模制与外部壳体构件相邻的一个或多个其它壳体构件。 在一个实施例中，外部壳体构件可以由玻璃制成，并且一个或多个其它壳体构件可以由诸如塑料的聚合物制成。 衬底层可以例如由聚合物或金属形成。 所得到的电子器件外壳可以是薄的，但足够坚固以适合用于诸如便携式电子设备的电子设备中。

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