公开(公告)号：US20190323785A1

公开(公告)日：2019-10-24

申请号：US15957431

申请日：2018-04-19

Applicant: Intel Corporation

Inventor： Feras Eid ,  Adel Elsherbini ,  Johanna Swan

IPC: F28F3/02 ,  F28F13/00 ,  H01L23/367 ,  H01L23/373

Abstract: A heat dissipation device may be formed having at least one isotropic thermally conductive section (uniformly high thermal conductivity in all directions) and at least one anisotropic thermally conductive section (high thermal conductivity in at least one direction and low thermal conductivity in at least one other direction). The heat dissipation device may be thermally coupled to a plurality of integrated circuit devices such that at least a portion of the isotropic thermally conductive section(s) and/or the anisotropic thermally conductive section(s) is positioned over at least one integrated circuit device. The isotropic thermally conductive section(s) allows heat spreading/removal from hotspots or areas with high-power density and the anisotropic thermally conductive section(s) transfers heat away from the at least one integrated circuit device predominately in a single direction with minimum conduction resistance in areas with uniform power density distribution, while reducing heat transfer in the other directions, thereby reducing thermal cross-talk.

公开(公告)号：US09915978B2

公开(公告)日：2018-03-13

申请号：US14859894

申请日：2015-09-21

Applicant: Intel Corporation

Inventor： Nadine L. Dabby ,  Lakshman Krishnamurthy ,  Braxton Lathrop ,  Aleksandar Aleksov ,  Adel Elsherbini ,  Sasha Oster ,  Tom L. Simmons

IPC: H05K3/30 ,  G06F1/16

CPC classification number: G06F1/1633 ,  H01L23/5385 ,  H01L23/5387 ,  H01L25/105 ,  H01L2225/1017 ,  H01L2225/1047 ,  H01L2924/00

Abstract: Some forms relate to a method of making a stretchable computing system. The method includes attaching a first set of conductive traces to a stretchable member; attaching a first electronic component to the first set of conductive traces; adding a first set of flexible conductors to the stretchable member such that the first set of flexible conductors is electrically connected to the first set of conductive traces; adding stretchable material to the stretchable member such that the first set of conductive traces is surrounded by the stretchable member; forming an opening in the stretchable member that exposes the first set of conductive traces; and attaching a second set of conductive traces to the stretchable member such that the second set of conductive traces fills the opening to form a via in the stretchable member that electrically connects the first set of conductive traces with the second set of conductive traces.

公开(公告)号：US09832863B2

公开(公告)日：2017-11-28

申请号：US14866614

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Adel Elsherbini ,  Aleksandar Aleksov ,  Shawna Liff

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/22 ,  H05K3/30 ,  H05K1/03

CPC classification number: H05K1/028 ,  H05K1/0283 ,  H05K1/0393 ,  H05K1/115 ,  H05K1/118 ,  H05K1/181 ,  H05K3/22 ,  H05K3/284 ,  H05K3/301 ,  H05K3/4691 ,  H05K2201/05 ,  H05K2201/057 ,  H05K2201/09263 ,  H05K2201/095 ,  H05K2203/1316

Abstract: Some forms relate to a stretchable computing device that includes a stretchable body; a first electronic component embedded within the stretchable body; a second electronic component embedded within the stretchable body; and wherein the first electronic component and the second electronic component are connected by stretchable electrical connectors that include vias. The stretchable electrical connectors are non-planar and/or may have a partial zig-zag shape and/or a partial coil shape. In some forms, the stretchable computing device further includes a textile attached to the stretchable body.