Abstract:
A device for measuring three dimensional shape is configured to perform one of a first imaging operation as imaging processing of a single operation among a multiplicity of imaging operations performed by irradiation of a first light pattern of multiply varied phases, and a second imaging operation as imaging processing of a single operation among a multiplicity of imaging operations performed by irradiation of a second light pattern of multiply varied phases. The device is configured to, simultaneous with completion of the first or second imaging operation, start shifting or switching operation of said first grating or a second grating relating to said first imaging operation. The device is configured to, without waiting for completion of the shifting or switching operation, perform the other imaging operation from among the first and second imaging operations.
Abstract:
A device for measuring three dimensional shape includes a first irradiation unit, a first grating control unit, a second irradiation unit, a second grating control unit, an imaging unit, and an image processing unit. After performance of a first imaging operation as imaging processing of a single operation among a multiplicity of imaging operations performed by irradiation of said first light pattern of multiply varied phases, a second imaging operation is performed as imaging processing of a single operation among a multiplicity of imaging operations performed by irradiation of said second light pattern of multiply varied phases. After completion of the first imaging operation and the second imaging operation, shifting or switching operation of the first grating and the second grating is performed simultaneously.
Abstract:
A board inspection apparatus includes an irradiation unit, an imaging unit, and an image processing unit. The image processing unit includes a three-dimensional measurement unit configured to perform three-dimensional measurement of the surfaces of the solder and the resist film by a certain three-dimensional measurement method based on the image data, a virtual standard surface setting unit configured to set a virtual standard surface corresponding to a contacting surface of a certain component mounted in a certain area of the printed board, a protrusion amount calculation unit configured to calculate a protrusion amount from the virtual standard surface for each solder printed and formed in the certain area, and a determination unit configured to determine whether the printed state of the solder passes or fails based on each of the protrusion amounts of the solder.
Abstract:
A rotary valve (1) includes a valve body (2) formed with a chamber communication passage (24) for flowing a main fluid and a vent communication passage (25) for discharging the main fluid and a cylindrical valve member (3) rotatably held in the valve body (2) and formed with a main passage (31) for flowing the main fluid. The cylindrical valve member (3) is rotated to switch the connection of the main passage (31) between the chamber communication passage (24) and the vent communication passage (25). The rotary switching valve (1) further includes a purge gas passage for passing purge gas in a clearance (11) between the valve body (2) and the cylindrical valve member (3), the purge gas being supplied to the clearance (11) to prevent the main fluid from leaking out of the main passage (31).
Abstract:
A seal structure for connection sections, which facilitates installation and removal of a seal member from the connection sections. The seal member is placed in the connection sections between a first part and a second part. A first groove-ridge section is formed at the connection section of the first part, and a second groove-ridge section is formed at the connection section of the second part. The seal member has, on one face, a first fitting section fitting to the first groove-ridge section, and also has, on the other face, a second fitting section fitting to the second groove-ridge section. Press-fitting interferences in the wall-thickness direction are provided at the first and second fitting sections. The seal member has an extended section protruding radially outward from an annular body section where the first and second fitting sections are provided. The extended section protrudes to a position outside the connection sections of the first and second parts.
Abstract:
A cover-equipped manual valve having a ratchet mechanism for preventing rotation of a knob, comprising: a rod formed with an external thread portion on an outer periphery thereof, the rod being unconnected to the knob and held against rotation; a sliding nut of a cylindrical shape, the sliding nut being rotatably held by a body and internally formed with an internal thread portion threadedly engaged with the external thread portion of the rod; an engagement member fixed to the knob, the engagement member being elastically deformable to be engaged with the sliding nut and to be disengaged from the sliding nut when larger torque than a predetermined value is applied to the engagement member; and a knob cover of a hollow shape for covering the knob.
Abstract:
A vacuum control system using a vacuum pump to control a vacuum pressure and a flow of a processing gas in a vacuum chamber. The vacuum control system includes: a plurality of vacuum control valves, each of the valves being connected between each of a plurality of gas discharge ports and the vacuum pump; a pressure measurement unit configured to measure the vacuum pressure of the processing gas supplied to the object; and a controller configured to manipulate respective openings of the valves in accordance with the measured vacuum pressure.
Abstract:
An apparatus for inspecting solder printing includes a memory medium, an ideal solder information generation unit, and an image processing unit. Design data are stored in the memory medium. The ideal solder information generation unit generates “ideal solder position information” and “ideal solder sizes” from the ideal solder regions in the design data. The image processing means extracts the actual solder regions of solder on the printed board K from image data imaged by the CCD camera and generates “actual solder position information” from the actual solder regions. The image processing unit generates “position misalignment amounts” between the “ideal solder position information” and “actual solder position information,” generates “print misalignment rates” indicating the extents of the “position misalignment amounts” relative to the “ideal solder sizes,” calculates a correction value relating to print position based on the “print misalignment rates,” and outputs a correction value signal to the solder printing machine.