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公开(公告)号：US10536065B2
公开(公告)日：2020-01-14
申请号：US15776009
申请日：2016-05-31
Applicant: GOERTEK INC.
Inventor： Chunfa Liu , Fenglei Zu
Abstract: A linear vibration motor comprises a vibrator and a stator disposed parallel to the vibrator, the vibrator comprising a weight block and a vibration block embedded in the weight block, and the stator comprises stator coils and a magnetic conductive cores disposed in the stator coil, wherein the vibration block comprises at least two magnetic members arranged in a row and magnetic reinforcement members disposed between adjacent magnetic members, and the magnetic members and the magnetic reinforcement members are permanent magnets; adjacent ends of each two adjacent magnetic members have the same polarity; and the magnetization direction of the magnetic reinforcement member is perpendicular to that of the magnetic member. The linear vibration motor can increase the magnetic lines of force passing through the stator coil, thereby intensifying the vibration effect of the product.
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公开(公告)号：US20190386454A1
公开(公告)日：2019-12-19
申请号：US16465745
申请日：2016-12-05
Applicant: Goertek, Inc.
Inventor： Quanbo Zou , Zhe Wang
Abstract: A micro laser diode transfer method and a manufacturing method comprise: forming a bonding layer (515) on a receiving substrate (513), wherein first type electrodes (514) are connected to the bonding layer (515); bringing a first side of the micro laser diodes (500r) on a carrier substrate (520) into contact with the bonding layer (515), wherein the carrier substrate (520) is laser-transparent; and irradiating selected micro laser diodes (500r) with laser from the side of the carrier substrate (520) to lift-off the selected micro laser diodes (500r) from the carrier substrate (520). This method may improve yield.
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公开(公告)号：US20190342672A1
公开(公告)日：2019-11-07
申请号：US16475328
申请日：2017-10-25
Applicant: GOERTEK INC.
Inventor： Mengjin CAI , Junkai ZHAN
Abstract: The present invention provides a condenser microphone, comprising a substrate, and a back plate and a vibrating diaphragm which are arranged on the substrate; the back plate is arranged on the upper side and/or the lower side of the vibrating diaphragm; and the vibrating diaphragm is provided with a protruding layer or a corrugated membrane structure layer. With the above invention, the area of the vibrating diaphragm and the capacitance at the lateral side of the condenser microphone can be increased, so as to achieve the effect of improving the sensitivity of the condenser microphone.
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公开(公告)号：US10458953B2
公开(公告)日：2019-10-29
申请号：US15306467
申请日：2015-04-01
Applicant: GOERTEK INC.
Inventor： Dong Qiu , Chao Jiang
Abstract: A method and a system for acquiring the natural frequency of a diaphragm, wherein, the method comprises: selecting test frequency points in a closed space, converting an electric signal into an acoustic signal, directing sound into the closed space, and acquiring the acoustic pressure of each test frequency point; adjusting the electric signal until the acoustic pressure of each test frequency point is the same; converting the adjusted electric signal into an acoustic signal; acquiring the displacement generated by the vibration of the diaphragm; and taking the frequency corresponding to the maximum displacement of the diaphragm as the natural frequency of the diaphragm. By adopting the method and system, the natural frequency of the diaphragm is determined by acquiring the maximum displacement of the diaphragm. Moreover, the process of acquiring the natural frequency of the diaphragm is not affected by surrounding environment, and therefore the acquired result is more accurate.
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公开(公告)号：US20190293700A1
公开(公告)日：2019-09-26
申请号：US16304597
申请日：2016-12-16
Applicant: GOERTEK INC.
Inventor： Jianbo WANG , Xinfang CAO , Yongjiang LU
Abstract: An impedance detection apparatus for a headset plug, comprising: a headset socket unit (101), a headset socket (J1) of which is provided with a socket-end ground wire contact (GND) connected to a ground wire contact of a corresponding headset plug, and socket-end connecting contacts (L, R, MIC) correspondingly connected to other contacts of the headset plug; a voltage acquisition unit (103), comprising a first resistor (R1) connected between a positive electrode of a power supply (BT) and a contact access point (IN), a negative electrode of the power supply (BT) being connected to the socket-end ground wire contact (GND); a contact selection unit (102), comprising selection switches (LS1, LS2, LS3) which have one-to-one correspondence to the socket-end connecting contacts (L, R, MIC), each of the selection switches (LS1, LS2, LS3) being connected between the respective connecting contact and the contact access point (IN); a processing unit (104), used for calculating an impedance value of equivalent impedance between a selected connecting contact and the socket-end ground wire contact (GND) according to the voltage of the contact access point (IN) with respect to the socket-end ground wire contact (GND); and a display unit (105), used for displaying the calculated impedance value.
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Patent Agency Ranking
公开(公告)号：US20190281390A1
公开(公告)日：2019-09-12
申请号：US16319005
申请日：2016-12-20
Applicant: GOERTEK INC.
Inventor： Xiaodong GUO , Guangtao TIAN
Abstract: A speaker diaphragm and a molding method therefor are provided. The speaker diaphragm comprises: a lead wire; a lead wire enclosure portion, wherein the lead wire enclosure portion has a membrane part and support protrusions, the support protrusions are distributed on a surface of the membrane part, the thickness of the membrane part is larger than or equal to the diameter of the lead wire, the thickness of the overall lead wire enclosure portion is larger than the diameter of the lead wire, and a part of the lead wire is injection-molded in the lead wire enclosure portion; and a diaphragm layer, wherein the diaphragm layer is configured to form an overall structure of the speaker diaphragm, the thickness of the diaphragm layer is larger than or equal to the thickness of the overall lead wire enclosure portion, and the lead wire enclosure portion is injection-molded in the diaphragm layer.
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公开(公告)号：US10369587B2
公开(公告)日：2019-08-06
申请号：US15541837
申请日：2015-12-18
Applicant: GOERTEK INC.
Inventor： Bin Wang , Guixun Wang
IPC: B05C5/02 , B05C11/10 , B05C17/005 , B05C5/00
Abstract: An adhesive coating device includes two adhesive barrels, lower ends of the two adhesive barrels are both connected to an adhesive coating assembly. The adhesive coating assembly includes an upper substrate having two mounting holes, lower ports of the two adhesive barrels passing through the two mounting holes respectively; a lower substrate detachably mounted at a lower side of the upper substrate. An adhesive receiving space is formed between the upper substrate and the lower substrate, and an adhesive coating track is provided on the lower substrate at a position corresponding to the adhesive receiving space, the adhesive coating track is a slit extending through an upper side and a lower side of the lower substrate, and the shape and size of the adhesive coating track match with the shape and size of an adhesive coating track required by a product to be coated with adhesive.
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公开(公告)号：US20190237618A1
公开(公告)日：2019-08-01
申请号：US16339494
申请日：2016-10-08
Applicant: GOERTEK. INC
Inventor： QUANBO ZOU , DENIO WENG , PEIXUAN CHEN , XIANGXU FENG
CPC classification number: H01L33/06 , H01L25/0753 , H01L25/167 , H01L27/1218 , H01L27/156 , H01L27/32 , H01L33/50 , H01L51/502 , H05B33/14 , H05B33/145
Abstract: A display device and an electronics apparatus are provided. The display device comprises: a display substrate; and arrays of light-emitting elements on the display substrate, wherein the light-emitting elements include at least two types of electroluminescent quantum-dot LED, photoluminescent quantum-dot LED and micro-LED, wherein at least one type of the light-emitting elements is an electroluminescent quantum-dot LED, or at least two types of the light-emitting elements are micro-LED.
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公开(公告)号：US20190222106A1
公开(公告)日：2019-07-18
申请号：US15573258
申请日：2016-12-19
Applicant: Goertek, Inc.
Inventor： Baoyu Liu , Yueguang Zhu
IPC: H02K33/06
Abstract: The present invention discloses a linear vibration motor. The linear vibration motor comprises: a stator assembly including a shell, a coil and a central support, wherein the shell is provided with a cavity therein and includes a shell wall in parallel to a direction of vibration, and the coil and the central support are located in the cavity, the coil being configured on the shell wall and the central support being configured in the intermediate portion of the shell wall to connect a resilient element; a vibrator assembly including a permanent magnet and a counterweight portion, the permanent magnet and the counterweight portion being connected together; and resilient elements, through which the vibrator assembly is suspended within the cavity, wherein the resilient elements comprise a first end and a second end arranged opposite to each other in the direction of vibration, the first end being connected to the central support and the second end being connected to the vibrator assembly.
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公开(公告)号：US20190200137A1
公开(公告)日：2019-06-27
申请号：US16329205
申请日：2016-12-20
Applicant: Goertek Inc.
Inventor： Huixian Cao , Shu Jiang , Xinfeng Yang
Abstract: A moving-coil loudspeaker is provided, comprising a vibration system and a magnetic circuit system located below the vibration system; the vibration system including a diaphragm, a spider, and a voice coil, the diaphragm comprising a diaphragm body part and a diaphragm reinforcing part; and the magnetic circuit system including a center washer, a center magnet, and a magnetic yoke; wherein the diaphragm reinforcing part comprises a first conductive material layer, the spider comprises a second conductive material layer, and the diaphragm reinforcing part and the spider are bonded by an insulative adhesive; and wherein the first and second conductive material layers functioning as a movable plate, and the center washer, the center magnet, and the magnetic yoke functioning as a fixed plate constitute a capacitor structure for detecting a vibration displacement of the moving-coil loudspeaker.
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