公开(公告)号：US20210152247A1

公开(公告)日：2021-05-20

申请号：US17160999

申请日：2021-01-28

Applicant: INPHI CORPORATION

Inventor： Jamal RIANI ,  Sudeep BHOJA

IPC: H04B10/27 ,  H04L27/34 ,  H04B10/25 ,  H03K9/02 ,  H04B10/61 ,  H04B14/00 ,  H04L27/06 ,  H04L27/02

Abstract: The present invention is directed to data communication system and methods. More specifically, various embodiments of the present invention provide a communication interface that is configured to transfer data at high bandwidth using nDSQ format(s) over optical communication networks. In certain embodiments, the communication interface is used by various devices, such as spine switches and leaf switches, within a spine-leaf network architecture, which allows large amount of data to be shared among servers.

公开(公告)号：US11012265B1

公开(公告)日：2021-05-18

申请号：US16991927

申请日：2020-08-12

Applicant: INPHI CORPORATION

Inventor： Jamal Riani ,  Ilya Lyubomirsky

IPC: H04B10/69 ,  H04L25/03 ,  H04L25/06 ,  H04B10/516 ,  H04B10/58

Abstract: The present invention is directed to communication methods and systems thereof. In a specific embodiment, a noise cancelation system includes a slicer that processes a data stream generates both PAM symbols and error data. An RIN estimator generates RIN data based on the PAM symbols and the error data. A filter removes non-RIN information from the RIN data. The filtered RIN data includes an offset term and a gain term, which are used to remove RIN noise from the data stream. There are other embodiments as well.

公开(公告)号：US20210116726A1

公开(公告)日：2021-04-22

申请号：US17094736

申请日：2020-11-10

Applicant: INPHI CORPORATION

Inventor： Xiaoguang TU ,  Masaki KATO

IPC: G02F1/025 ,  G02F1/225

Abstract: A silicon optical modulator is fabricated to have a multi-slab structure between the contacts and the waveguide, imparting desirable performance attributes. A first slab comprises dopant of a first level. A second slab adjacent to (e.g., on top of) the first slab, comprises a doped region proximate to a contact, and an intrinsic region proximate to the waveguide. The parallel resistance properties and low overlap between the highly doped silicon and optical mode pigtail afforded by the multi-slab configuration, allow the modulator to operate with reduced optical losses and at a high speed. Embodiments may be implemented in a Mach-Zehnder interferometer or in micro-ring resonator modulator configuration.

公开(公告)号：US20210091536A1

公开(公告)日：2021-03-25

申请号：US17115296

申请日：2020-12-08

Applicant: Inphi Corporation ,  Luxnet Corporation

Inventor： Radhakrishnan L. NAGARAJAN ,  Peng-Chih LI ,  Pi-Cheng LAW

IPC: H01S5/06 ,  H04B10/50 ,  H01S5/024 ,  H01S5/00 ,  H01S5/022 ,  G02B6/42 ,  H01S5/068 ,  H01S5/125

Abstract: A packaged transmitter device includes a base member comprising a planar part mounted with a thermoelectric cooler, a transmitter, and a coupling lens assembly, and an assembling part connected to one side of the planar part. The device further includes a circuit board bended to have a first end region and a second end region being raised to a higher level. The first end region disposed on a top surface of the planar part includes multiple electrical connection patches respectively connected to the thermoelectric and the transmitter. The second end region includes an electrical port for external connection. Additionally, the device includes a cover member disposed over the planar part. Furthermore, the device includes a cylindrical member installed to the assembling part for enclosing an isolator aligned to the coupling lens assembly along its axis and connected to a fiber to couple optical signal from the transmitter to the fiber.

公开(公告)号：US20210088739A1

公开(公告)日：2021-03-25

申请号：US17095269

申请日：2020-11-11

Applicant: INPHI CORPORATION

Inventor： Chris TOGAMI ,  Radhakrishnan L. NAGARAJAN ,  Gary SASSER ,  Brian TAYLOR

IPC: G02B6/42 ,  F28F1/14 ,  H05K7/20

Abstract: An apparatus for dissipating heat from a photonic transceiver module. The apparatus includes a top-plate member disposed in a length direction of a package for the photonic transceiver module. The apparatus further includes multiple fins formed on the top-plate member along the length direction from a backend position to a frontend position except at least one fin with a shorter length, forming an elongated void from the backend position to one backend of the at least one fin. Additionally, the apparatus includes a cover member disposed over the multiple fins with a horizontal sheet, two vertical side sheets, and a flange bent vertically from a middle portion of backend of the horizontal sheet. Furthermore, the apparatus includes a spring loaded in the elongated void between the flange and the one backend of the at least one fin to minimize an air gap at the backend of the horizontal sheet.

公开(公告)号：US10951003B1

公开(公告)日：2021-03-16

申请号：US16800974

申请日：2020-02-25

Applicant: Inphi Corporation

Inventor： Xiaoguang He ,  Radhakrishnan L. Nagarajan

IPC: H04B10/00 ,  H01S5/00 ,  H01S5/022 ,  H01S5/02 ,  H01S5/323 ,  H04B10/27 ,  H04B10/07 ,  G01R31/26 ,  G02B6/12 ,  H01S5/12

Abstract: A light source based on integrated silicon photonics includes a die of a silicon substrate having at least one chip site configured with a surface region, a trench region, and a first stopper region located separately between the surface region and the trench region. The trench region is configured to be a depth lower than the surface region. The light source includes a laser diode chip having a p-side facing the chip site and a n-side being distal to the chip site. The p-side includes a gain region bonded to the trench region, an electrode region bonded to the surface region, and an isolation region engaged with the stopper region to isolate the gain region from the electrode region. The light source also includes a conductor layer in the die configured to connect the gain region to an anode electrode and separately connect the electrode region to a cathode electrode.

公开(公告)号：US10942323B1

公开(公告)日：2021-03-09

申请号：US16578090

申请日：2019-09-20

Applicant: INPHI CORPORATION

Inventor： Chris Togami ,  Radhakrishnan L. Nagarajan ,  Gary Sasser ,  Brian Taylor

IPC: G02B6/42 ,  H05K7/20 ,  F28F1/14

Abstract: An apparatus for dissipating heat from a photonic transceiver module. The apparatus includes a top-plate member disposed in a length direction of a package for the photonic transceiver module. The apparatus further includes multiple fins formed on the top-plate member along the length direction from a backend position to a frontend position except at least one fin with a shorter length, forming an elongated void from the backend position to one backend of the at least one fin. Additionally, the apparatus includes a cover member disposed over the multiple fins with a horizontal sheet, two vertical side sheets, and a flange bent vertically from a middle portion of backend of the horizontal sheet. Furthermore, the apparatus includes a spring loaded in the elongated void between the flange and the one backend of the at least one fin to minimize an air gap at the backend of the horizontal sheet.

公开(公告)号：US10862521B1

公开(公告)日：2020-12-08

申请号：US16262387

申请日：2019-01-30

Applicant: INPHI CORPORATION

Inventor： Karthik Raviprakash ,  Halil Cirit

IPC: H04B1/16 ,  H03G3/30 ,  H03H11/28

Abstract: The present invention is directed to communication systems and electrical circuits. More specifically, an embodiment of the present invention provides a termination circuit that includes a programmable gain attenuation section, a T-coil section, and a termination resistor. The characteristic resistance of the programmable gain attenuation section matches the resistance of the termination resistor. There are other embodiments as well.

公开(公告)号：US10826734B2

公开(公告)日：2020-11-03

申请号：US16657274

申请日：2019-10-18

Applicant: INPHI CORPORATION

Inventor： Arun Tiruvur ,  Jamal Riani ,  Sudeep Bhoja

IPC: G06F11/10 ,  H04L1/00 ,  H04L25/14 ,  H04L27/04 ,  H04L27/00

Abstract: Embodiments of the present invention include an apparatus that receives date from multiple lanes, which are then aligned and synchronized for transcoding and encoding.

公开(公告)号：US10826621B2

公开(公告)日：2020-11-03

申请号：US16720472

申请日：2019-12-19

Applicant: INPHI CORPORATION

Inventor： Todd Rope ,  Sung Choi ,  James Stewart ,  Radhakrishnan L. Nagarajan ,  Paul Yu ,  Ilya Lyubomirsky

IPC: H04B10/079 ,  H04B10/61 ,  H04B10/67 ,  H04B10/69 ,  H04L27/18 ,  G02B6/12 ,  G02B6/293 ,  H04B17/20 ,  H04L27/06

Abstract: The present invention is directed to a communication signal tracking system comprising an optical receiver including one or more delay line interferometers (DLIs) configured to demultiplex incoming optical signals and a transimpedance amplifier configured to convert the incoming optical signals to incoming electrical signals. The communication signal tracking system further includes a control module configured to calculate a bit-error-rate (BER) of the incoming electrical signals before forward-error correction decoding, and use the BER as a parameter for optimizing settings of the one or more DLIs in one or more iterations in a control loop and generating a back-channel data.