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    Piezo actuators for optical beam steering applications
    171.
    发明授权
    Piezo actuators for optical beam steering applications 有权

    公开(公告)号：US10969576B2

    公开(公告)日：2021-04-06

    申请号：US16072164

    申请日：2016-04-01

    Applicant: Intel Corporation

    Inventor： Aleksandar Aleksov ,  Feras Eid ,  Sasha N. Oster ,  Shawna M. Liff ,  Johanna M. Swan ,  Thomas L. Sounart ,  Baris Bicen ,  Valluri R. Rao

    IPC: G02B26/10 ,  G02B26/08 ,  G02B1/14

    Abstract: Disclosed herein are maskless imaging tools and display systems that include piezoelectrically actuated mirrors and methods of forming such devices. The maskless imaging tool may include a light source. Additionally, the tool may include one or more piezoelectrically actuated mirrors for receiving light from the light source. The piezoelectrically actuated mirrors are actuatable about one or more axes to reflect the light from the light source to a workpiece positioned to receive light from the piezoelectrically actuated mirror. Disclosed herein is a maskless imaging tool that is a laser direct imaging lithography (LDIL) tool. The maskless imaging tool may also be a via-drill tool. Disclosed herein is also a piezoelectrically actuated mirror used in a projection system. For example, the projection system may be integrated into a pair of glasses.

    Piezoelectrically actuated mirrors for optical communications
    175.
    发明授权
    Piezoelectrically actuated mirrors for optical communications 有权

    公开(公告)号：US10816733B2

    公开(公告)日：2020-10-27

    申请号：US16072240

    申请日：2016-04-01

    Applicant: Intel Corporation

    Inventor： Sasha N. Oster ,  Johanna M. Swan ,  Feras Eid ,  Thomas L. Sounart ,  Aleksandar Aleksov ,  Shawna M. Liff ,  Baris Bicen ,  Valluri R. Rao

    IPC: G02B6/35 ,  H04Q11/00 ,  G02B26/08 ,  H04B10/25

    Abstract: Embodiments of the invention include an optical routing device that includes an organic substrate. According to an embodiment, an array of cavities are formed into the organic substrate and an array of piezoelectrically actuated mirrors may be anchored to the organic substrate with each piezoelectrically actuated mirror extending over a cavity. In order to properly rout incoming optical signals, the optical routing device may also include a routing die mounted on the organic substrate. The routing die may be electrically coupled to each of the piezoelectrically actuated mirrors and is able to generated a voltage across the first and second electrodes of each piezoelectrically actuated mirror. Additionally, a photodetector may be electrically coupled to the routing die. According to an embodiment, an array of fiber optic cables may be optically coupled with one of the piezoelectrically actuated mirrors and optically coupled with the photodetector.

    THERMAL MANAGEMENT SOLUTIONS FOR STACKED INTEGRATED CIRCUIT DEVICES
    178.
    发明申请
    THERMAL MANAGEMENT SOLUTIONS FOR STACKED INTEGRATED CIRCUIT DEVICES 审中-公开

    公开(公告)号：US20200043829A1

    公开(公告)日：2020-02-06

    申请号：US16055428

    申请日：2018-08-06

    Applicant: Intel Corporation

    Inventor： Adel Elsherbini ,  Feras Eid ,  Johanna Swan

    IPC: H01L23/473 ,  H01L25/065 ,  H01L23/00 ,  H01L23/522

    Abstract: An integrated circuit structure may be formed having a substrate, a first integrated circuit device electrically attached to the substrate, a second integrated circuit device electrically attached to the first integrated circuit device, at least one first level channel between the substrate and the first integrated circuit device and/or at least one second level channel between the first integrated circuit device and the second integrated circuit device, and a heat dissipation device attached to the substrate which defines a fluid chamber, wherein the at least one of the first level channel and/or the at least one second level channel is opened to the fluid chamber, such that when a heat transfer fluid is introduced into the fluid chamber, the heat transfer fluid may make direct contact with the first integrated circuit device and/or the second integrated circuit device.

    THERMAL MANAGEMENT SOLUTIONS THAT REDUCE INDUCTIVE COUPLING BETWEEN STACKED INTEGRATED CIRCUIT DEVICES
    179.
    发明申请
    THERMAL MANAGEMENT SOLUTIONS THAT REDUCE INDUCTIVE COUPLING BETWEEN STACKED INTEGRATED CIRCUIT DEVICES 审中-公开

    公开(公告)号：US20200027812A1

    公开(公告)日：2020-01-23

    申请号：US16040748

    申请日：2018-07-20

    Applicant: Intel Corporation

    Inventor： Feras Eid ,  Adel Elsherbini ,  Johanna Swan

    IPC: H01L23/367 ,  H01L25/065 ,  H01L23/498

    Abstract: An integrated circuit assembly may be formed having a substrate, a first integrated circuit device electrically attached to the substrate, a second integrated circuit device electrically attached to the first integrated circuit device, and a heat dissipation device comprising at least one first thermally conductive structure proximate at least one of the first integrated circuit device, the second integrated circuit device, and the substrate; and a second thermally conductive structure disposed over the first thermally conductive structure(s), the first integrated circuit device, and the second integrated circuit device, wherein the first thermally conductive structure(s) have a lower electrical conductivity than an electrical conductivity of the second thermally conductive structure. The first thermally conductive structure(s) may be formed by an additive process or may be pre-formed and attached to at least one of the first integrated circuit device, the second integrated circuit device, and the substrate.

    THERMAL MANAGEMENT SOLUTIONS FOR STACKED INTEGRATED CIRCUIT DEVICES USING JUMPING DROPS VAPOR CHAMBERS
    180.
    发明申请
    THERMAL MANAGEMENT SOLUTIONS FOR STACKED INTEGRATED CIRCUIT DEVICES USING JUMPING DROPS VAPOR CHAMBERS 审中-公开

    公开(公告)号：US20190393193A1

    公开(公告)日：2019-12-26

    申请号：US16014319

    申请日：2018-06-21

    Applicant: Intel Corporation

    Inventor： Feras Eid ,  Adel Elsherbini ,  Johanna Swan

    IPC: H01L25/065 ,  H01L23/373 ,  H01L23/427 ,  H01L23/10 ,  H01L23/367 ,  H01L23/498

    Abstract: An integrated circuit structure may be formed having a first integrated circuit device, a second integrated circuit device electrically coupled to the first integrated circuit device with a plurality of device-to-device interconnects, and at least one jumping drops vapor chamber between the first integrated circuit device and the second integrated circuit device wherein at least one device-to-device interconnect of the plurality of device-to-device interconnects extends through the jumping drops vapor chamber. In one embodiment, the integrated circuit structure may include three or more integrated circuit devices with at least two jumping drops vapor chambers disposed between the three or more integrated circuit devices. In a further embodiment, the two jumping drops chambers may be in fluid communication with one another.

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