公开(公告)号：US10790707B2

公开(公告)日：2020-09-29

申请号：US16220514

申请日：2018-12-14

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Min-Jer Wang ,  Ching-Nen Peng ,  Chewn-Pu Jou ,  Feng Wei Kuo ,  Hao Chen ,  Hung-Chih Lin ,  Huan-Neng Chen ,  Kuang-Kai Yen ,  Ming-Chieh Liu ,  Tsung-Hsiung Lee

IPC分类号： G06F11/00 ,  G01R31/28 ,  H02J50/40 ,  H01L25/065 ,  H01L23/538 ,  H02J50/10 ,  H02J50/80 ,  G01R31/302 ,  H01L23/544 ,  G06F30/39 ,  H02J5/00 ,  H02J50/20 ,  H01L23/00

摘要： An integrated circuit (IC) includes a first circuit layer that includes a first wireless power transfer (WPT) device, a first chip electrically connected to the first circuit layer, and a first tracking circuit disposed in the first chip. The first WPT device may be configured to extract energy from an electromagnetic signal and provide an output voltage. The first tracking circuit may be powered by the output voltage of the first WPT device and may output tracking data in response to an instruction extracted from the electromagnetic signal.

公开(公告)号：US10473696B2

公开(公告)日：2019-11-12

申请号：US15470420

申请日：2017-03-27

申请人： Fluke Corporation

发明人： Matthew Carl-Robert Bannister ,  David Lawrence Epperson ,  Clark N. Huber

IPC分类号： G01R31/02 ,  G01R15/18 ,  G01R15/12 ,  G01R19/00 ,  G01R31/302

摘要： A Rogowski coil in a sensor unit has voltage induced by a conductor surrounded by the Rogowski coil. The voltage is integrated to represent current which is converted to digital data representing current in the conductor and sent wirelessly to a multimeter. The sensor unit may receive control signals from the multimeter and a remote control apparatus. A plurality of sensor units may be networked and controlled by the remote control apparatus.

公开(公告)号：US20190277776A1

公开(公告)日：2019-09-12

申请号：US16295999

申请日：2019-03-07

申请人： KLA-Tencor Corporation

发明人： Dhiraj Ramesh Gawhane

IPC分类号： G01N21/95 ,  G01R31/3185 ,  G01R31/317 ,  G01R31/302

摘要： Systems and methods for detecting programmed defects on a water during inspection of the wafer are provided. One method includes selecting a mode of an inspection subsystem for detecting programmed defects on a wafer that generates output for the wafer having the lowest non-defect signal and at least a minimum signal for the programmed defects. The method also includes selecting a training care area that is mutually exclusive of care area(s) used for detecting the programmed defects during inspection of the wafer. The training care area generates less of the non-defect signal than the care area(s). The method further includes training a programmed defect detection method using the output generated with the selected mode in the training care area and detecting the programmed defects during the inspection of the wafer by applying the trained programmed defect detection method to the output generated in the care area(s) with the selected mode.

公开(公告)号：US10330706B2

公开(公告)日：2019-06-25

申请号：US15314702

申请日：2014-06-04

申请人： TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)

发明人： Sverker Sander ,  Björn Olsson

IPC分类号： G01R13/04 ,  G08C19/36 ,  G08C23/04 ,  H04Q9/00 ,  G01R31/28 ,  G01R31/302 ,  G01R31/309

摘要： The present invention relates to a system, a measurement probe and a method for measuring an electrical property of an electrical circuit, comprising measuring the electrical property by means of a measurement probe connected to the electrical circuit, converting the measured electrical property of the electrical circuit to an optical signal. The method further comprises sending the optical signal, and receiving the optical signal by means of an image sensor configured to record images comprising the measurement probe that transmits the optical signal. The method further comprises processing the recorded images in order to decode the measurement data from the received optical signal.

公开(公告)号：US20190162774A1

公开(公告)日：2019-05-30

申请号：US15944672

申请日：2018-04-03

申请人： Advanced Semiconductor Engineering, Inc.

发明人： Hung-Jen HUANG ,  Yen-Chun WANG ,  Chen-Kuo CHU ,  I-Chun LIU

IPC分类号： G01R31/28 ,  G01R1/04 ,  G01R31/302

摘要： A testing device includes a testing socket and a reflector. The testing socket defines an accommodating space. The reflector is disposed in the accommodating space and has a plurality of reflection surfaces non-parallel with each other. The reflection surfaces define a transmission space.

公开(公告)号：US20190140488A1

公开(公告)日：2019-05-09

申请号：US16220514

申请日：2018-12-14

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： MIN-JER WANG ,  CHING-NEN PENG ,  CHEWN-PU JOU ,  FENG WEI KUO ,  HAO CHEN ,  HUNG-CHIH LIN ,  HUAN-NENG CHEN ,  KUANG-KAI YEN ,  MING-CHIEH LIU ,  TSUNG-HSIUNG LEE

IPC分类号： H02J50/40 ,  H02J50/80 ,  G01R31/28 ,  H01L25/065 ,  H01L23/538 ,  H02J50/10 ,  G06F17/50 ,  H01L23/544 ,  G01R31/302 ,  H02J5/00 ,  H02J50/20

摘要： An integrated circuit (IC) includes a first circuit layer that includes a first wireless power transfer (WPT) device, a first chip electrically connected to the first circuit layer, and a first tracking circuit disposed in the first chip. The first WPT device may be configured to extract energy from an electromagnetic signal and provide an output voltage. The first tracking circuit may be powered by the output voltage of the first WPT device and may output tracking data in response to an instruction extracted from the electromagnetic signal.

公开(公告)号：US10164480B2

公开(公告)日：2018-12-25

申请号：US15589435

申请日：2017-05-08

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Min-Jer Wang ,  Ching-Nen Peng ,  Chewn-Pu Jou ,  Feng Wei Kuo ,  Hao Chen ,  Hung-Chih Lin ,  Huan-Neng Chen ,  Kuang-Kai Yen ,  Ming-Chieh Liu ,  Tsung-Hsiung Lee

IPC分类号： G06F11/00 ,  G01R31/28 ,  H02J50/40 ,  H01L25/065 ,  H01L23/538 ,  H02J50/10 ,  H02J50/80 ,  G01R31/302 ,  G06F17/50 ,  H01L23/544 ,  H02J5/00 ,  H02J50/20 ,  H01L23/00

摘要： An integrated circuit (IC) includes a first circuit layer that includes a first wireless power transfer (WPT) device, a first chip electrically connected to the first circuit layer, and a first tracking circuit disposed in the first chip. The first WPT device may be configured to extract energy from an electromagnetic signal and provide an output voltage. The first tracking circuit may be powered by the output voltage of the first WPT device and may output tracking data in response to an instruction extracted from the electromagnetic signal.

公开(公告)号：US20180328989A1

公开(公告)日：2018-11-15

申请号：US16043468

申请日：2018-07-24

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Lee D. Whetsel

IPC分类号： G01R31/317 ,  G01R31/3185 ,  G01R31/3177 ,  G01R31/28 ,  G01R31/302

CPC分类号： G01R31/31713 ,  G01R31/2815 ,  G01R31/2851 ,  G01R31/2884 ,  G01R31/3025 ,  G01R31/31703 ,  G01R31/31725 ,  G01R31/31727 ,  G01R31/3177 ,  G01R31/318558

摘要： The disclosure describes a process and apparatus for accessing devices on a substrate. The substrate may include only full pin JTAG devices (504), only reduced pin JTAG devices (506), or a mixture of both full pin and reduced pin JTAG devices. The access is accomplished using a single interface (502) between the substrate (408) and a JTAG controller (404). The access interface may be a wired interface or a wireless interface and may be used for JTAG based device testing, debugging, programming, or other type of JTAG based operation.

公开(公告)号：US10054633B2

公开(公告)日：2018-08-21

申请号：US15467485

申请日：2017-03-23

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： Lee D. Whetsel

IPC分类号： G01R31/317 ,  G01R31/28 ,  G01R31/302 ,  G01R31/3185 ,  G01R31/3177

CPC分类号： G01R31/31713 ,  G01R31/2815 ,  G01R31/2851 ,  G01R31/2884 ,  G01R31/3025 ,  G01R31/31703 ,  G01R31/31725 ,  G01R31/31727 ,  G01R31/3177 ,  G01R31/318558

摘要： The disclosure describes a process and apparatus for accessing devices on a substrate. The substrate may include only full pin JTAG devices (504), only reduced pin JTAG devices (506), or a mixture of both full pin and reduced pin JTAG devices. The access is accomplished using a single interface (502) between the substrate (408) and a JTAG controller (404). The access interface may be a wired interface or a wireless interface and may be used for JTAG based device testing, debugging, programming, or other type of JTAG based operation.

公开(公告)号：US10018670B2

公开(公告)日：2018-07-10

申请号：US14963076

申请日：2015-12-08

申请人： eSilicon Corporation

发明人： Javier DeLaCruz

IPC分类号： G01R31/302 ,  G01R31/303

CPC分类号： G01R31/303 ,  G01R31/3025

摘要： Disclosed is a probe card for testing a wireless module on an integrated circuit die contained on a wafer. The probe card includes a connector and a plurality of probes. The connector connects the probe card to test equipment. The plurality of probes connects the probe card to a wafer containing a plurality of integrated circuit dies. The probe card additionally includes an antenna configured to transmit a wireless test signal to be received by at least one of the integrated circuit dies, and/or to receive a wireless signal transmitted by at least one of the integrated circuit dies.