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11 条记录 (耗时 0.017 秒)

    Method and apparatus of voltage scaling techniques
    1.
    发明授权
    Method and apparatus of voltage scaling techniques 有权
    电压缩放技术的方法和装置

    公开(公告)号：US08629694B1

    公开(公告)日：2014-01-14

    申请号：US13668860

    申请日：2012-11-05

    申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

    发明人： Shi-Hung Wang ,  Tsung-Hsiung Li ,  Kuang-Kai Yen ,  Wei-Li Chen ,  Chewn-Pu Jou ,  Fan-Ming Kuo

    IPC分类号： H03K5/22

    CPC分类号： H03K19/0008 ,  G04F10/005

    摘要： A voltage scaling circuit includes a first critical path and an edge detection unit. The first critical path includes an input and an output. The edge detection unit includes a first input, a second input, a counter and a time-to-digital converter (TDC). The input of the first critical path is electrically connected to the first input of the edge detection unit, and the output of the critical path is electrically connected to the second input of the edge detection unit. The counter is configured to measure a duration between an active edge of a start signal on the first input of the edge detection unit and an active edge of a stop signal on the second input of the edge detection unit in a clock period basis. The TDC is configured to measure a beginning portion and an end portion of the duration.

    摘要翻译： 电压调节电路包括第一关键路径和边缘检测单元。 第一个关键路径包括输入和输出。 边缘检测单元包括第一输入，第二输入，计数器和时间 - 数字转换器（TDC）。 第一关键路径的输入电连接到边缘检测单元的第一输入，并且关键路径的输出电连接到边缘检测单元的第二输入端。 计数器被配置为在时钟周期的基础上测量在边缘检测单元的第一输入端的起始信号的有效边沿与边缘检测单元的第二输入端之间的停止信号的有效边沿之间的持续时间。 TDC被配置为测量持续时间的开始部分和结束部分。

    Method and apparatus for RFID tag testing
    3.
    发明授权
    Method and apparatus for RFID tag testing 有权
    RFID标签测试方法和装置

    公开(公告)号：US09304164B2

    公开(公告)日：2016-04-05

    申请号：US13655047

    申请日：2012-10-18

    申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

    发明人： Tsung-Hsiung Li ,  Kuang-Kai Yen ,  Yi-Hsuan Liu ,  Hsieh-Hung Hsieh ,  Chewn-Pu Jou ,  Fu-Lung Hsueh

    IPC分类号： G01R1/067 ,  G01R31/20 ,  G06K7/10 ,  G01R31/302 ,  G01R31/3185

    CPC分类号： G01R1/06711 ,  G01R31/2607 ,  G01R31/28 ,  G01R31/3025 ,  G01R31/318511

    摘要： A semiconductor wafer includes a plurality of dies and at least one test probe. Each of the plurality of dies includes a radio frequency identification (RFID) tag circuit. The at least one test probe includes a plurality of probe pads. The plurality of probe pads is configured to transmit power signals and data to each of the plurality of dies, and to receive test results from each of the plurality of dies. The data are transmitted to each of the plurality of dies in a serial manner. The test results of each of the plurality of dies are also transmitted to the plurality of probe pads in a serial manner.

    摘要翻译： 半导体晶片包括多个管芯和至少一个测试探针。 多个管芯中的每一个都包括射频识别（RFID）标签电路。 所述至少一个测试探针包括多个探针垫。 多个探针焊盘被配置为将功率信号和数据传送到多个管芯中的每一个，并且从多个管芯中的每一个接收测试结果。 以串行方式将数据发送到多个管芯中的每一个。 多个管芯中的每一个的测试结果也以串行方式传输到多个探针焊盘。

    Method and apparatus of RFID tag contactless testing
    7.
    发明授权
    Method and apparatus of RFID tag contactless testing 有权
    RFID标签无接触测试方法和装置

    公开(公告)号：US09098757B2

    公开(公告)日：2015-08-04

    申请号：US13926596

    申请日：2013-06-25

    申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

    发明人： Tsung-Hsiung Lee ,  Kuang-Kai Yen ,  Shi-Hung Wang ,  Yung-Hsu Chuang ,  Huan-Neng Chen ,  Wei-Li Chen ,  Shih-Hung Lan ,  Yi-Hsuan Liu ,  Fan-Ming Kuo ,  Hsieh-Hung Hsieh ,  Chewn-Pu Jou ,  Fu-Lung Hsueh

    IPC分类号： G01R31/26 ,  G06K7/00 ,  G01R31/265 ,  G01R31/302

    CPC分类号： G06K7/0095 ,  G01R31/2656 ,  G01R31/3025

    摘要： A semiconductor wafer includes a plurality of dies. Each of the plurality of dies includes a radio frequency identification (RFID) tag circuit and a coil. The RFID tag circuit includes a tag core, an RF front-end circuit, an ID decoder, a comparator and conductive line for a unique ID. The RF front-end circuit is configured to receive electromagnetic signals through the coil in each of the plurality of dies and to convert the received electromagnetic signals into commands. The ID decoder is configured to receive the commands and to generate an expect ID. The comparator is configured to compare the unique ID with the expect ID to generate a comparison result. The comparison result is arranged to decide if the tag core is configured to receive commands.

    摘要翻译： 半导体晶片包括多个管芯。 多个管芯中的每一个都包括射频识别（RFID）标签电路和线圈。 RFID标签电路包括标签芯，RF前端电路，ID解码器，用于唯一ID的比较器和导线。 RF前端电路被配置为通过多个管芯中的每一个中的线圈接收电磁信号，并将接收到的电磁信号转换为命令。 ID解码器被配置为接收命令并产生期望ID。 比较器被配置为将唯一ID与期望ID进行比较以产生比较结果。 布置比较结果来确定标签核心是否配置为接收命令。

    Method and Apparatus for RFID Tag Testing
    8.
    发明申请
    Method and Apparatus for RFID Tag Testing 审中-公开
    RFID标签测试方法与设备

    公开(公告)号：US20160187380A1

    公开(公告)日：2016-06-30

    申请号：US15065530

    申请日：2016-03-09

    申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

    发明人： Tsung-Hsiung Lee ,  Kuang-Kai Yen ,  Yi-Hsuan Liu ,  Hsieh-Hung Hsieh ,  Chewn-Pu Jou ,  Fu-Lung Hsueh

    IPC分类号： G01R1/067 ,  G01R31/28 ,  G01R31/26

    CPC分类号： G01R1/06711 ,  G01R31/2607 ,  G01R31/28 ,  G01R31/3025 ,  G01R31/318511

    摘要： A semiconductor wafer includes a plurality of dies and at least one test probe. Each of the plurality of dies includes a radio frequency identification (RFID) tag circuit. The at least one test probe includes a plurality of probe pads. The plurality of probe pads is configured to transmit power signals and data to each of the plurality of dies, and to receive test results from each of the plurality of dies. The data are transmitted to each of the plurality of dies in a serial manner. The test results of each of the plurality of dies are also transmitted to the plurality of probe pads in a serial manner.

    摘要翻译： 半导体晶片包括多个管芯和至少一个测试探针。 多个管芯中的每一个都包括射频识别（RFID）标签电路。 所述至少一个测试探针包括多个探针垫。 多个探针焊盘被配置为将功率信号和数据传送到多个管芯中的每一个，并且从多个管芯中的每一个接收测试结果。 以串行方式将数据发送到多个管芯中的每一个。 多个管芯中的每一个的测试结果也以串行方式传输到多个探针焊盘。

    METHOD AND APPARATUS OF RFID TAG CONTACTLESS TESTING
    9.
    发明申请
    METHOD AND APPARATUS OF RFID TAG CONTACTLESS TESTING 有权
    RFID标签接口测试的方法和设备

    公开(公告)号：US20140145749A1

    公开(公告)日：2014-05-29

    申请号：US13926596

    申请日：2013-06-25

    申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY. LTD.

    发明人： Tsung-Hsiung Lee ,  Kuang-Kai Yen ,  Shi-Hung Wang ,  Yung-Hsu Chuang ,  Huan-Neng Chen ,  Wei-Li Chen ,  Shih-Hung Lan ,  Yi-Hsuan Liu ,  Fan-Ming Kuo ,  Hsieh-Hung Hsieh ,  Chewn-Pu Jou ,  Fu-Lung Hsueh

    IPC分类号： G01R31/265

    CPC分类号： G06K7/0095 ,  G01R31/2656 ,  G01R31/3025

    摘要： A semiconductor wafer includes a plurality of dies. Each of the plurality of dies includes a radio frequency identification (RFID) tag circuit and a coil. The RFID tag circuit includes a tag core, an RF front-end circuit, an ID decoder, a comparator and conductive line for a unique ID. The RF front-end circuit is configured to receive electromagnetic signals through the coil in each of the plurality of dies and to convert the received electromagnetic signals into commands. The ID decoder is configured to receive the commands and to generate an expect ID. The comparator is configured to compare the unique ID with the expect ID to generate a comparison result. The comparison result is arranged to decide if the tag core is configured to receive commands.

    摘要翻译： 半导体晶片包括多个管芯。 多个模具中的每一个都包括射频识别（RFID）标签电路和线圈。 RFID标签电路包括标签芯，RF前端电路，ID解码器，用于唯一ID的比较器和导线。 RF前端电路被配置为通过多个管芯中的每一个中的线圈接收电磁信号，并将接收到的电磁信号转换为命令。 ID解码器被配置为接收命令并产生期望ID。 比较器被配置为将唯一ID与期望ID进行比较以产生比较结果。 布置比较结果来确定标签核心是否配置为接收命令。