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公开(公告)号：US10538626B2
公开(公告)日：2020-01-21
申请号：US15645594
申请日：2017-07-10
发明人： Bo-Hung Lai , Wei-Ming Hou , Tang-Chieh Huang
IPC分类号： C08G73/10 , C08J5/18 , C09D179/08
摘要： A transparent and colorless polyimide resin is provided. The polyimide resin is derived from at least two dianhydride monomers and at least two diamine monomers. At least one monomer in the dianhydride and diamine monomers includes structure of formula (1). The monomer with structure of formula (1) has an amount of moles accounting for 10-50% of total moles of the dianhydride or diamine monomers. In formula (1), X is SO2,C(CH3)2 or C(CF3)2, Y is oxygen.
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公开(公告)号：US20190169434A1
公开(公告)日：2019-06-06
申请号：US16210353
申请日：2018-12-05
发明人： Chiu-Yen CHIU , Jui-Hsiang TANG , Shi-Ing HUANG
IPC分类号： C08L79/08 , C08L27/18 , C08F236/10 , C08F36/08 , C08F36/06 , C08G73/10 , C08K3/36 , C08K5/5419
摘要： A resin composition is provided. The resin composition includes a polyimide resin; a hydrocarbon resin or a fluorinated polymer resin; and a silica that is modified by a surface modifier. The content of the hydrocarbon resin is in a range from 1 to 13 parts by weight based on 100 parts by weight of the polyimide resin. The content of the fluorinated polymer resin is in a range from 1 to 60 parts by weight based on 100 parts by weight of the polyimide resin. The content of the silica is in a range from 1 to 10 parts by weight based on 100 parts by weight of the polyimide resin.
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公开(公告)号：US20190004424A1
公开(公告)日：2019-01-03
申请号：US15933031
申请日：2018-03-22
发明人： Tang-Chieh Huang , Wei-Chung Chuang
摘要： A thermally conductive type photosensitive resin is provided. The resin comprises (a) a photosensitive polyimide, (b) an inorganic filler, and (c) a silica solution. The photosensitive polyimide accounts for 50 to 80% of a total weight of a solid composition of the thermally conductive type photosensitive resin. The inorganic filler is selected from at least one of aluminium oxide, graphene, inorganic clay, mica powder, boron nitride, aluminium nitride, silica, zinc oxide, zirconium oxide, carbon nanotube and carbon nanofiber, accounts for 20-50% of the total weight of the solid composition of the thermally conductive type photosensitive resin, and has a particle size between 40 nm and 5 μm. The silica solution comprises silica particles polymerized by a sol-gel process. The silica particles have a particle size between 10 nm and 15 nm, and account for 5 to 30% of the total weight of the solid composition of the thermally conductive type photosensitive resin. The thermally conductive type photosensitive resin has a thermal conductivity between 0.4 and 2.
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公开(公告)号：US20180230270A1
公开(公告)日：2018-08-16
申请号：US15645594
申请日：2017-07-10
发明人： Bo-Hung Lai , Wei-Ming Hou , Tang-Chieh Huang
摘要： A transparent and colorless polyimide resin is provided. The polyimide resin is derived from at least two dianhydride monomers and at least two diamine monomers. At least one monomer in the dianhydride and diamine monomers includes structure of formula (1). The monomer with structure of formula (1) has an amount of moles accounting for 10-50% of total moles of the dianhydride or diamine monomers. In formula (1), X is SO2, C(CH3)2 or C(CF3)2, Y is oxygen.
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公开(公告)号：US20150163926A1
公开(公告)日：2015-06-11
申请号：US14251295
申请日：2014-04-11
发明人： TANG-CHIEH HUANG
CPC分类号： H05K3/0091 , H05K3/282 , H05K2203/1518 , H05K2203/1545 , H05K2203/1572
摘要： The disclosure provides a coating device and a coating method. The coating device is used for coating viscous ink on a substrate to form a film. The substrate includes two opposite mounting surfaces. The coating device comprising: an accommodating mechanism, a coating mechanism and a forming mechanism. The coating mechanism includes two coating units. Each coating unit includes a rotatable filling roller for filling with pressure the viscous ink in the hole on the corresponding mounting surface to form an initial layer. The forming mechanism is used for scraping the initial layer covering on the mounting surfaces to form the film. The method of coating and then adjusting the thickness of the film may improve the quality of the products. By using the above disclosure, the production line can be simplified to lower the device costs, and the manufacturing time can be reduced to improve the manufacturing efficiency.
摘要翻译： 本公开提供一种涂布装置和涂布方法。 涂布装置用于在基材上涂布粘性油墨以形成膜。 基板包括两个相对的安装表面。 所述涂覆装置包括：容纳机构，涂覆机构和形成机构。 涂布机构包括两个涂布单元。 每个涂覆单元包括可旋转的填充辊，用于在相应的安装表面上的孔中填充粘稠的油墨以形成初始层。 成形机构用于刮擦安装表面上的初始层以形成膜。 涂膜的方法然后调整膜的厚度可以提高产品的质量。 通过使用上述公开，可以简化生产线以降低设备成本，并且可以减少制造时间以提高制造效率。
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公开(公告)号：US20230091093A1
公开(公告)日：2023-03-23
申请号：US17798314
申请日：2020-10-20
发明人： Bo-Hung Lai , Yu-Chiao Shih , Tang-Chieh Huang
IPC分类号： C09D11/101 , C09D11/38 , H05K1/03 , C09D11/52 , H05K1/09
摘要： The invention provides a curable composition for inkjet, a cured product, and a flexible printed circuit board. The curable composition for inkjet includes a soluble polyimide resin, a photocurable acrylate compound, a photopolymerization initiator, and a thermosetting resin. The curable composition for inkjet has excellent flexibility, and has a withstand voltage of greater than 2 kV even when the thickness is less than 20 μm.
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公开(公告)号：US20220372227A1
公开(公告)日：2022-11-24
申请号：US17623397
申请日：2020-05-14
发明人： Bo Hung Lai , Wei Che Tang , Tang Chieh Huang
摘要： The present invention provides a polyimide film, which comprises a polyimide having a structure represented by formula (I): in which A is a residue group of an aromatic diamine containing a sulfonyl group in its main chain moiety, R1 is a residue group of an aromatic dianhydride, R2 is a residue group of an aliphatic dianhydride, m and n are each independently a positive integer, a diamine monomer constituting the polyimide is only composed of the aromatic diamine containing the sulfonyl group in its main chain moiety, and the polyimide is surface-dried at 75° C. to 155° C. in the process of forming the polyimide film. The polyimide film of the present invention has transparency and UV absorption properties.
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公开(公告)号：US20220204698A1
公开(公告)日：2022-06-30
申请号：US17404531
申请日：2021-08-17
摘要： The present invention provides a polyimide comprising a structural unit, which comprises a first structural unit represented by formula (1) and a second structural unit represented by formula (2), wherein A, D and E are defined herein. A polyimide film formed by the polyimide has a low linear thermal expansion coefficient.
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公开(公告)号：US10953641B2
公开(公告)日：2021-03-23
申请号：US15928994
申请日：2018-03-22
发明人： Tang-Chieh Huang , Po-Cheng Chen
摘要： A thermally conductive type polyimide substrate is provided. The substrate comprises at least one insulating layer having a metal layer on a single side or both sides thereof. The material of the insulating layer is a thermally conductive type photosensitive resin having a thermal conductivity of 0.4 to 2, and the thermally conductive type photosensitive resin includes the following components: (a) a photosensitive polyimide, (b) an inorganic filler, and (c) a silica solution. The photosensitive polyimide accounts for 50 to 70% of a total weight of a solid composition of the thermally conductive type photosensitive resin. The inorganic filler accounts for 20-30% of the total weight of the solid composition of the thermally conductive type photosensitive resin, and has a particle size between 40 nm and 5 μm. The silica solution comprises silica particles polymerized by a sol-gel process, and the silica particles have a particle size between 10 nm and 15 nm and account for 5 to 30% of the total weight of the solid composition of the thermally conductive type photosensitive resin.
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公开(公告)号：US10412836B2
公开(公告)日：2019-09-10
申请号：US16200425
申请日：2018-11-26
发明人： Tang-Chieh Huang
IPC分类号： H05K1/02 , H05K1/09 , H05K1/11 , H05K1/16 , H05K3/00 , H05K3/30 , H05K3/36 , H05K3/46 , H05K3/02 , H05K3/38 , H05K1/03 , H05K3/24 , H05K3/06
摘要： The present invention provides a thinned flexible polyimide substrate and a method for manufacturing the same. The thinned flexible polyimide substrate comprises a polyimide resin, a conductor layer, and a polyimide insulating layer. The polyimide resin has a linear thermal expansion coefficient of less than 40 ppm/K. The conductor layer is formed of a plurality of stacked metal nanoparticles having pores therebetween, and each of the pores has a size between 0.1 μm and 1 μm. A portion of the polyimide resin fills into the pores. The polyimide insulating layer is formed of the polyimide resin coated on the conductor layer.
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