摘要:
The polishing pad for a chemical mechanical polishing apparatus, and a method of making the same. The polishing pad has a covering layer with a polishing surface and a backing layer which is adjacent to the platen. A first opening in the covering layer with a first cross-sectional area and a second opening in the backing layer with a second, different cross-sectional area form an aperture through the polishing pad. A substantially transparent polyurethane plug is positioned in the aperture, and an adhesive material fixes the plug in the aperture.
摘要:
An optical waveguide is formed on a substrate by first depositing an undercladding layer over the substrate. At least one core is formed over the undercladding layer. An uppercladding layer is then formed over the cores with a high-density plasma process. Deposition of the uppercladding layer may proceed by flowing an oxygen-containing gas, such as O2, a silicon-containing gas, such as SiH4, and a fluorine-containing gas, such as SiF4, into a process chamber to produce a gaseous mixture. A high-density plasma, i.e. having a density of at least 1011 ions/cm3, is generated from the gaseous mixture and then used to deposit a fluorinated silicate glass layer.
摘要翻译:通过首先在衬底上沉积下封层,在衬底上形成光波导。 在下封层上形成至少一个芯。 然后用高密度等离子体工艺在芯上形成上层。 通过使诸如O 2的含氧气体,诸如SiH 4的含硅气体和诸如SiF 4的含氟气体流入处理室以产生气体混合物,可以进行上包层的沉积。 从气体混合物产生高密度等离子体,即具有至少1011个离子/ cm 3的密度,然后用于沉积氟化硅酸盐玻璃层。
摘要:
Embodiments of the present invention provide a highly uniform low cost production worthy solution for manufacturing low propagation loss optical waveguides on a substrate. The method comprises depositing an optical core using a high-density plasma deposition process. The method is particularly advantageous in forming high contrast refractive index optical cores, such as SiOxNy, with drastically reduced propagation loss. In one embodiment the high-density plasma deposition process is an HDP-CVD process. In another embodiment the high-density plasma deposition process is an HDP-ECR process. In one embodiment, a method of forming an optical waveguide comprises forming at least one optical core on an undercladding layer of a substrate using a high-density plasma deposition process.
摘要翻译:本发明的实施例提供了用于在衬底上制造低传播损耗光波导的高度均匀的低成本生产有价值的解决方案。 该方法包括使用高密度等离子体沉积工艺沉积光学芯。 该方法特别有利于形成高对比度折射率光学芯,例如SiO x N y,具有显着降低的传播损耗。 在一个实施例中,高密度等离子体沉积工艺是HDP-CVD工艺。 在另一个实施例中,高密度等离子体沉积工艺是HDP-ECR工艺。 在一个实施例中,形成光波导的方法包括使用高密度等离子体沉积工艺在衬底的底层上形成至少一个光学芯。
摘要:
The thickness of a layer on a substrate is measured in-situ during chemical mechanical polishing. A light beam is divided through a window in a polishing pad, and the motion of the polishing pad relative to the substrate causes the light beam to move in a path across the substrate surface. An interference signal produced by the light beam reflecting off the substrate is monitored, and a plurality of intensity measurements are extracted from the interference signal. Each intensity measurement corresponds to a sampling zone in the path across the substrate surface. A radial position is determined for each sampling zone, and the intensity measurements are divided into a plurality of radial ranges according to the radial positions. The layer thickness is computed for each radial range from the intensity measurements associated with that radial range.
摘要:
A carrier head with a flexible member connected to a base to define a first chamber, a second chamber and a third chamber. A lower surface of the flexible member provides a substrate receiving surface with an inner portion associated with the first chamber, a substantially annular middle portion surrounding the inner portion and associated with the second chamber, and a substantially annular outer portion surrounding the middle portion and associated with the third chamber. The width of the outer portion may be significantly less than the width of the middle portion. The carrier head may also include a flange connected to a drive shaft and a gimbal pivotally connecting the flange to the base.
摘要:
A technique and apparatus is disclosed for the optical monitoring and measurement of a thin film (or small region on a surface) undergoing thickness and other changes while it is rotating. An optical signal is routed from the monitored area through the axis of rotation and decoupled from the monitored rotating area. The signal can then be analyzed to determine an endpoint to the planarization process. The invention utilizes interferometric and spectrophotometric optical measurement techniques for the in situ, real-time endpoint control of chemical-mechanical polishing planarization in the fabrication of semiconductor or various optical devices. The apparatus utilizes a bifurcated fiber optic cable to monitor changes on the surface of the thin film.
摘要:
An apparatus, as well as a method, determines an endpoint of chemical mechanical polishing a metal layer on a substrate. The method of the apparatus includes bringing a surface of a substrate into contact with a polishing pad that has a window; causing relative motion between the substrate and the polishing pad; directing a light beam through the window, the motion of the polishing pad relative to the substrate causing the light beam to move in a path across the substrate; detecting light beam reflections from the substrate and a retaining ring; generating reflection data associated with the light beam reflections; dividing the reflection data into a plurality of radial ranges; and identifying the predetermined pattern from the reflection data in the plurality of radial ranges to establish the endpoint.
摘要:
In chemical mechanical polishing, a substrate is planarized with one or more fixed-abrasive polishing pads. Then the substrate is polished with a standard polishing pad to remove scratch defects created by the fixed-abrasive polishing pads.
摘要:
An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light reflected from the wafer, and a window disposed adjacent to a hole formed through a platen. The window provides a pathway for the laser beam during at least part of the time the wafer overlies the window.
摘要:
A polishing article for chemical mechanical polishing. The polishing article includes a generally elongated polishing sheet with a polishing surface. The polishing article is formed from a material that is substantially opaque, and has a discrete region extending substantially the length of the polishing sheet that is at least semi-transparent.