Abstract:
Provided are methods of fabricating flash memory devices that may prevent a short circuit from occurring between cell gate lines. Methods of fabricating such flash memory devices may include forming gate lines including a series of multiple cell gate lines and multiple selection gate lines. Each gate line may include a stacked structure of a tunnel insulating layer, a floating gate, a gate insulating layer, and/or a polysilicon layer operable to be a control gate, all formed on a semiconductor substrate. Methods may include forming a first insulating layer that selectively fills gaps between the cell gate lines from the bottom up and between adjacent ones of the cell gate lines and the selection gate lines, and does not fill a space located on outer sides of the selection gate lines that are opposite the plurality of cell gate lines. A spacer may be formed on the outer sides of the selection gate lines that are opposite to the cell gate lines, after forming the first insulating layer. A second insulating layer may be formed in a space where the spacer is formed.
Abstract:
An apparatus for forming longitudinal thermal fatigue cracks. A heating unit has an induction coil disposed adjacent to an outer circumference of one side of a tubular test piece, on an inner surface of which a notch is formed. A cooling unit has a cooling water pump and a cooling water hose which forcibly injects cooling water from a cooling water storage source into an inner circumference of the tubular test piece. A control unit controls operation of the heating and cooling units. A cooling block partially encloses the outer circumference of the tubular test piece so as to control a magnitude of y-axial stress, is supplied with a cooling source of fluid or gas from an outside so as to repetitively cool the tubular test piece heated by the heating unit to adjust a temperature gradient, and has a longitudinal slit for controlling crack positions.
Abstract:
An apparatus for forming stress corrosion cracks comprises a heating unit which includes a conductive member and a heating coil disposed adjacent to the conductive member to generate steam pressure in the tube specimen, an end holding unit, and a control unit for controlling the heating unit and the end holding unit. The stress corrosion cracks occurring in the equipment of nuclear power plants or apparatus industries during operation can be directly formed in a tube specimen using steam pressure under conditions similar to those of the actual environment of nuclear power plants, thus increasing accuracy for analysis of properties of stress corrosion cracks which are in actuality generated, thereby improving reliability of nuclear power plants or apparatus industries and effectively assuring nondestructive testing capability, resulting in very useful industrial applicability.
Abstract:
Disclosed is an apparatus and method for forming thermal fatigue cracks in a test piece for performance demonstration of nondestructive testing. The apparatus for forming thermal fatigue cracks includes a heating unit, having a conductive member attached around the outer surface of a pipe test piece and an induction heating coil disposed adjacent to the conductive member; a cooling unit, having a cooling water pump for forcibly supplying cooling water to the inner surface of the pipe test piece from a cooling water storage source and a cooling water hose; and a control unit for controlling operation of the heating unit and the cooling unit. Accordingly, thermal fatigue cracks similar to actual thermal fatigue cracks occurring during the operation of nuclear power plants or processing industry equipment are formed in a test piece, thereby assuring effective performance demonstration of nondestructive testing.
Abstract:
A seal-packaging machine for a food container is proposed. The seal-packaging machine includes: a tray for loading a food-carrying container into the seal-packaging machine configured to move stably forward/backward while engaging with a -shaped guide by a “”-shaped guide rail; a heater unit driving support shafts operating the heater unit upward/downward and a heater unit driving portion support plate connected thereto operating upward/downward by two roller bearings and two eccentric cams contacting the same; a motor fixedly provided on a bottom frame to drive upward/downward the heater unit driving support shafts and the heater unit driving portion support plate of a heater unit driving portion; and a heater unit evenly operating upward/downward while keeping in horizontal along the four heater unit driving support shafts provided on four sides. The seal-packaging machine prevents defects due to imbalance of the heater unit, thereby guaranteeing an accurate sealing operation with a film.
Abstract:
Semiconductor devices, and methods of fabricating the same, include forming a trench between a plurality of patterns on a substrate to be adjacent to each other, forming a first sacrificial layer in the trench, forming a first porous insulation layer having a plurality of pores on the plurality of patterns and on the first sacrificial layer, and removing the first sacrificial layer through the plurality of pores of the first porous insulation layer to form a first air gap between the plurality of patterns and under the first porous insulation layer.
Abstract:
A list display method and apparatus are disclosed. The list display method, for a terminal having a display unit, includes detecting a necessity for displaying a list, classifying list items into viewable items and aggregated items, displaying the viewable items in the list view region and displaying information regarding the aggregated items in the list aggregate region. Responsive to inputs aggregate items may be classified as viewable items and corresponding ones of the viewable items are classified as aggregate items.
Abstract:
In a vertical semiconductor device and a method of manufacturing a vertical semiconductor device, sacrificial layers and insulating interlayers are repeatedly and alternately stacked on a substrate. The sacrificial layers include boron (B) and nitrogen (N) and have an etching selectivity with respect to the insulating interlayers. Semiconductor patterns are formed on the substrate through the sacrificial layers and the insulating interlayers. The sacrificial layers and the insulating interlayers are at least partially removed between the semiconductor patterns to form sacrificial layer patterns and insulating interlayer patterns on sidewalls of the semiconductor patterns. The sacrificial layer patterns are removed to form grooves between the insulating interlayer patterns. The grooves expose portions of the sidewalls of the semiconductor patterns. A gate structure is formed in each of the grooves.