公开(公告)号：US07901539B2

公开(公告)日：2011-03-08

申请号：US11523101

申请日：2006-09-19

Applicant: Terry Bluck ,  Kevin P Fairbairn ,  Michael S. Barnes ,  Christopher T. Lane

Inventor： Terry Bluck ,  Kevin P Fairbairn ,  Michael S. Barnes ,  Christopher T. Lane

IPC: C23F1/00 ,  H01L21/306 ,  C23C16/00 ,  C23C14/00

CPC classification number: H01L21/67184 ,  H01L21/67173 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67745

Abstract: There is described apparatus and methods for transporting and processing substrates including wafers as to efficiently produce at reasonable costs improved throughput as compared to systems in use today. A key element is the use of a transport chamber along the sides of processing chambers for feeding substrates into a controlled atmosphere through a load lock and then along a transport chamber as a way of reaching processing chambers and then out of the controlled atmosphere following processing in the processing chambers.

Abstract translation: 描述了与目前使用的系统相比，用于运输和处理包括晶片的基板以便以合理的成本有效地生产提高的生产量的装置和方法。 关键要素是沿着处理室的侧面使用传送室，用于通过装载锁定将基板输送到受控气氛中，然后沿着传送室作为到达处理室的方式，然后在受控气氛中进行处理 处理室。

公开(公告)号：US20090191030A1

公开(公告)日：2009-07-30

申请号：US12368241

申请日：2009-02-09

Applicant: Terry Bluck ,  Kevin P. Fairbairn ,  Michael S. Barnes ,  Christopher T. Lane

Inventor： Terry Bluck ,  Kevin P. Fairbairn ,  Michael S. Barnes ,  Christopher T. Lane

IPC: H01L21/677

CPC classification number: H01L21/67745 ,  C23C14/568 ,  C23C16/54 ,  C23C16/545 ,  H01L21/67167 ,  H01L21/67173 ,  H01L21/67184 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67709

Abstract: There is described apparatus and methods for transporting and processing substrates including wafers as to efficiently produce at reasonable costs improved throughput as compared to systems in use today. A linear transport chamber includes linear tracks and robot arms riding on the linear tracks to linearly transfer substrates along the sides of processing chambers for feeding substrates into a controlled atmosphere through a load lock and then along a transport chamber as a way of reaching processing chambers.

Abstract translation: 描述了与目前使用的系统相比，用于运输和处理包括晶片的基板以便以合理的成本有效地生产提高的生产量的装置和方法。 线性传送室包括线性轨道和机器人手臂，该线性轨道和机器人臂骑在线性轨道上，以沿着处理室的侧面线性地传送衬底，用于通过负载锁定将衬底馈送到受控气氛中，然后沿着运送室作为到达处理室的方式。

公开(公告)号：US20090078374A1

公开(公告)日：2009-03-26

申请号：US12325993

申请日：2008-12-01

Applicant: Terry Bluck ,  Kevin P. Fairbairn ,  Michael S. Barnes ,  Christopher T. Lane

Inventor： Terry Bluck ,  Kevin P. Fairbairn ,  Michael S. Barnes ,  Christopher T. Lane

IPC: C23F1/08 ,  C23C14/34 ,  C23C16/00 ,  C23C14/48 ,  F16J12/00

CPC classification number: H01L21/67745 ,  H01L21/67173 ,  H01L21/67184 ,  H01L21/67201

Abstract: There is described apparatus and methods for transporting and processing substrates including wafers as to efficiently produce at reasonable costs improved throughput as compared to systems in use today. A key element is the use of a transport chamber along the sides of processing chambers for feeding substrates into a controlled atmosphere through a load lock and then along a transport chamber as a way of reaching processing chambers and then out of the controlled atmosphere following processing in the processing chambers.

Abstract translation: 描述了与目前使用的系统相比，用于运输和处理包括晶片的基板以便以合理的成本有效地生产提高的生产量的装置和方法。 关键要素是沿着处理室的侧面使用传送室，用于通过装载锁定将基板输送到受控气氛中，然后沿着传送室作为到达处理室的方式，然后在受控气氛中进行处理 处理室。

公开(公告)号：US20080286697A1

公开(公告)日：2008-11-20

申请号：US11977913

申请日：2007-10-26

Applicant: Steven Verhaverbeke ,  J Kelly Truman ,  Christopher T. Lane ,  Sasson R. Somekh

Inventor： Steven Verhaverbeke ,  J Kelly Truman ,  Christopher T. Lane ,  Sasson R. Somekh

IPC: G03F7/20

CPC classification number: H01L21/67161 ,  H01L21/67069 ,  H01L21/67167 ,  H01L21/67173 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67225

Abstract: A method of a single wafer wet/dry cleaning apparatus comprising: a transfer chamber having a wafer handler contained therein; a first single wafer wet cleaning chamber directly coupled to the transfer chamber; and a first single wafer ashing chamber directly coupled to the transfer chamber.

公开(公告)号：US20080138917A1

公开(公告)日：2008-06-12

申请号：US11978004

申请日：2007-10-26

Applicant: STEVEN VERHAVERBEKE ,  J KELLY TRUMAN ,  CHRISTOPHER T. LANE ,  SASSON R. SOMEKH

Inventor： STEVEN VERHAVERBEKE ,  J KELLY TRUMAN ,  CHRISTOPHER T. LANE ,  SASSON R. SOMEKH

IPC: H01L21/66

CPC classification number: H01L21/67207 ,  G03F7/16 ,  H01L21/67115 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67184 ,  H01L21/6719 ,  Y10S414/135 ,  Y10S414/141 ,  Y10S438/905

Abstract: A method of a single wafer wet/dry cleaning apparatus comprising: a transfer chamber having a wafer handler contained therein; a first single wafer wet cleaning chamber directly coupled to the transfer chamber; and a first single wafer ashing chamber directly coupled to the transfer chamber.

公开(公告)号：US07159599B2

公开(公告)日：2007-01-09

申请号：US10229446

申请日：2002-08-27

Applicant: Steven Verhaverbeke ,  J Kelly Truman ,  Christopher T Lane ,  Sasson R Somekh

Inventor： Steven Verhaverbeke ,  J Kelly Truman ,  Christopher T Lane ,  Sasson R Somekh

IPC: B08B3/00

CPC classification number: H01L21/67161 ,  H01L21/67069 ,  H01L21/67167 ,  H01L21/67173 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67225

Abstract: A method of a single wafer wet/dry cleaning apparatus comprising: a transfer chamber having a wafer handler contained therein; a first single wafer wet cleaning chamber directly coupled to the transfer chamber; and a first single wafer ashing chamber directly coupled to the transfer chamber.