公开(公告)号：US12040530B2

公开(公告)日：2024-07-16

申请号：US17878229

申请日：2022-08-01

申请人： DONGWOO FINE-CHEM CO., LTD.

发明人： Na Yeon Kim ,  Young Ju Kim ,  Hee Jun Park ,  Won Hee Lee

IPC分类号： H01Q1/12 ,  H05K1/00 ,  H05K1/02 ,  H05K1/11

CPC分类号： H01Q1/12 ,  H05K1/0243 ,  H05K1/0277 ,  H05K1/112 ,  H05K2201/056 ,  H05K2201/10098

摘要： A package board according to an embodiment includes a first core layer having a first surface and a second surface that face each other, a feeding wiring extending on the first surface of the first core layer, a first via structure penetrating through the first core layer, a first connection pad disposed on the second surface of the first core layer to be electrically connected to the feeding wiring through the first via structure, the first connection pad including a head portion in contact with the first via structure and an extension portion protruding from the head portion, and a first connector mounted on the second surface of the first core layer, the first connector including a first terminal electrically connected to the extension portion of the first connection pad.

公开(公告)号：US11995284B2

公开(公告)日：2024-05-28

申请号：US18018768

申请日：2021-08-17

申请人： DONGWOO FINE-CHEM CO., LTD.

发明人： Dongjin Son ,  Junha Kim

IPC分类号： G06F3/041 ,  G06F3/044

CPC分类号： G06F3/0448 ,  G06F3/0445 ,  G06F2203/04111

摘要： A touch sensor has a base layer and an electrode layer. The electrode layer includes a first transparent oxide layer formed on the base layer, a conductive metal layer formed on the first transparent oxide layer, and a second transparent oxide layer formed on the conductive metal layer and has a plurality of through-holes with the same shape and spacing.

公开(公告)号：US20240134233A1

公开(公告)日：2024-04-25

申请号：US18275795

申请日：2022-02-24

申请人： DONGWOO FINE-CHEM CO., LTD.

发明人： Hun-Sik KIM ,  Tae-Gon KIM ,  Young-Soo KWON ,  Seul-Ki PARK

IPC分类号： G02F1/1339 ,  G02F1/1333 ,  G02F1/1335

CPC分类号： G02F1/13398 ,  G02F1/133377 ,  G02F1/133382 ,  G02F1/133516

摘要： The present disclosure provides a partition wall for an image display device, the partition wall which satisfies 0.8≤A/B

公开(公告)号：US11955709B2

公开(公告)日：2024-04-09

申请号：US17862919

申请日：2022-07-12

申请人： DONGWOO FINE-CHEM CO., LTD.

发明人： Na Yeon Kim ,  Young Ju Kim ,  Yoon Ho Huh

IPC分类号： H01Q1/52 ,  H01Q1/22

CPC分类号： H01Q1/521 ,  H01Q1/2283

摘要： An antenna package according to an embodiment of the present disclosure includes an antenna device including an antenna unit, a first circuit board including a first core layer having a first surface and a second surface opposite to each other, a signal wiring extending on the first surface of the first core layer to be electrically connected to the antenna unit, and a first via structure penetrating through the first core layer, and a first connector mounted on the second surface of the first core layer, the first connector including a first terminal electrically connected to the antenna unit and the first via structure.

公开(公告)号：US11912910B2

公开(公告)日：2024-02-27

申请号：US17211986

申请日：2021-03-25

申请人： DONGWOO FINE-CHEM CO., LTD.

发明人： Hyuk Hwan Kwon ,  Sun Kwon Ahn ,  Chang Yong Lee

IPC分类号： C09J9/02 ,  H01B5/14 ,  C09J7/40 ,  G06F3/044 ,  B32B7/06 ,  B32B7/12 ,  B32B38/00

CPC分类号： C09J9/02 ,  B32B7/06 ,  B32B7/12 ,  B32B38/0004 ,  C09J7/403 ,  H01B5/14 ,  B32B2307/202 ,  C09J2203/326 ,  G06F3/044

摘要： A conductive film laminate according to an embodiment of the present disclosure includes a carrier substrate, a conductive film liner on the carrier substrate, and a conductive adhesive film formed on the conductive film liner. The conductive film liner and the conductive adhesive film may form a cut pattern which does not cover the entire carrier substrate. The conductive adhesive film having a narrow width can be stably supplied on the carrier substrate. The conductive adhesive film may be used as an anisotropic conductive film for a bonding process of a touch sensor.

公开(公告)号：US11870150B2

公开(公告)日：2024-01-09

申请号：US17508055

申请日：2021-10-22

申请人： DONGWOO FINE-CHEM CO., LTD.

发明人： Young Ju Kim ,  Dong Pil Park ,  Byung Jin Choi ,  Han Sub Ryu ,  Ho Dong Yoon

IPC分类号： H01Q21/24 ,  H01Q1/38 ,  H01Q21/08

CPC分类号： H01Q21/24 ,  H01Q1/38 ,  H01Q21/08

摘要： An antenna package according to an exemplary embodiment of the present invention includes a first antenna device which includes a first antenna unit including a first radiator, a second antenna device which includes a second antenna unit including a second radiator whose polarization direction is perpendicular to the first radiator, a first circuit board electrically connected with the first antenna unit, a second circuit board electrically connected with the second antenna unit, and a third circuit board on which at least one antenna driving integrated circuit (IC) chip electrically and independently connected to the first circuit board and the second circuit board is mounted. By supplying power to two antenna devices having different polarization directions, respectively, signal interference and signal loss may be prevented, and dual polarization may be implemented.

公开(公告)号：US11870129B2

公开(公告)日：2024-01-09

申请号：US17667875

申请日：2022-02-09

申请人： DONGWOO FINE-CHEM CO., LTD.

发明人： Byung Jin Choi ,  Han Sub Ryu ,  Won Hee Lee ,  Jae Hyun Lee

IPC分类号： H01Q1/22 ,  H01Q23/00

CPC分类号： H01Q1/22 ,  H01Q23/00

摘要： An antenna element according to an exemplary embodiment includes a radiation body, a first transmission line extending from the radiation body in a first direction, a second transmission line extending from the radiation body in a second direction, a first signal pad extending from an end of the first transmission line in the first direction, and a second signal pad extending from an end of the second transmission line in the second direction.

公开(公告)号：US20230422409A1

公开(公告)日：2023-12-28

申请号：US18209551

申请日：2023-06-14

申请人： DONGWOO FINE-CHEM CO., LTD.

发明人： Dae Kyu KIM ,  Byung Soo BANG ,  Gi Taek OH

IPC分类号： H05K3/46 ,  H05K1/02 ,  H01Q1/22

CPC分类号： H05K3/4605 ,  H05K1/0242 ,  H05K2201/10098 ,  H05K2201/093 ,  H05K2201/10128 ,  H01Q1/2291

摘要： A circuit board for an antenna may include a core layer, a signal wiring disposed on a surface of the core layer, and a co-planar ground disposed around the signal wiring on the surface of the core layer. The co-planar ground may include line patterns adjacent to a front end portion of the signal wiring.

公开(公告)号：US20230420852A1

公开(公告)日：2023-12-28

申请号：US18210135

申请日：2023-06-15

申请人： DONGWOO FINE-CHEM CO., LTD.

发明人： Won Hee LEE ,  Young Ju KIM

IPC分类号： H01Q9/04 ,  H01Q1/24 ,  G01S13/58 ,  H01Q21/24

CPC分类号： H01Q9/0428 ,  H01Q21/24 ,  G01S13/58 ,  H01Q1/243

摘要： An antenna structure includes a first radiator, a second radiator, a third radiator and a fourth radiator. The first radiator and the second radiator are arranged along a first direction, and the second radiator and the third radiator are arranged along a second direction perpendicular to the first direction. The first radiator, the second radiator and the third radiator are circularly polarized radiators in the same rotational direction, and the fourth radiator is a circularly polarized radiator in a rotational direction opposite to that of the first radiator, the second radiator and the third radiator.

公开(公告)号：US20230407508A1

公开(公告)日：2023-12-21

申请号：US18253540

申请日：2021-11-17

申请人： KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY ,  DONGWOO FINE-CHEM CO., LTD.

发明人： Min Hyung LEE ,  Woon Young LEE ,  Sang Hoon JIN ,  Yu Geun JO ,  Dong Ryul LEE

IPC分类号： C25D3/60

CPC分类号： C25D3/60 ,  H01L24/11

摘要： As a tin-silver plating solution that contains a source of tin ions; a source of silver ions (Ag+); and an organic additive including a silver (Ag) complexing agent, a tin carrier, and a crystal grain refiner is provided, in the case of performing high-speed plating using the plating solution, the generation of whiskers is diminished, the composition of silver ions (Ag+) in the tin-silver plating solution is uniformly maintained, and thus a uniform silver composition in the formed tin-silver solder bumps can be achieved.