CMOS image sensor and driving method of the same
    15.
    发明申请
    CMOS image sensor and driving method of the same 审中-公开
    CMOS图像传感器及其驱动方法相同

    公开(公告)号:US20090294816A1

    公开(公告)日:2009-12-03

    申请号:US12453532

    申请日:2009-05-14

    CPC classification number: H01L27/1463 H01L27/14603 H01L27/14641

    Abstract: Provided are a CMOS image sensor and a driving method thereof. The CMOS image sensor may include a photodetector disposed in a semiconductor substrate to accumulate photocharges, a charge transfer element configured to control transfer of the photocharges accumulated in the photodetector, a detecting element configured to detect the photocharges transferred by the charge transfer element, and a well driving contact configured to increase a potential difference between the photodetector and the detecting element while the photocharges are transferred.

    Abstract translation: 提供一种CMOS图像传感器及其驱动方法。 CMOS图像传感器可以包括设置在半导体衬底中以累积光电荷的光电检测器,被配置为控制在光电检测器中累积的光电荷的转移的电荷转移元件,被配置为检测由电荷转移元件传送的光电荷的检测元件,以及 良好的驱动接点被配置为在光电荷转移时增加光电检测器和检测元件之间的电位差。

    CMOS image sensor
    17.
    发明授权
    CMOS image sensor 失效
    CMOS图像传感器

    公开(公告)号:US08309995B2

    公开(公告)日:2012-11-13

    申请号:US12820787

    申请日:2010-06-22

    Abstract: A unit pixel of a CMOS image sensor include a photodiode that transforms light to an electric charge, and accumulates the electric charge, and a plurality of transistors that generate an electric signal based on the accumulated electric charge. The photodiode has a slope shape based on incident angle of the light in a semiconductor substrate.

    Abstract translation: CMOS图像传感器的单位像素包括将光转换成电荷并累积电荷的光电二极管,以及基于累积电荷产生电信号的多个晶体管。 光电二极管具有基于半导体衬底中的光的入射角的斜率形状。

    Image sensors
    19.
    发明申请
    Image sensors 有权
    图像传感器

    公开(公告)号:US20110037883A1

    公开(公告)日:2011-02-17

    申请号:US12801740

    申请日:2010-06-23

    Abstract: Image sensors including a semiconductor substrate, a plurality of photo detecting elements, a dielectric layer, a plurality of color filters, and a plurality of micro lenses. The photo detecting elements may be in the semiconductor substrate and may convert an incident light into an electric signal. The dielectric layer may be on the semiconductor substrate and may include a plurality of photo blocking regions on regions between the photo detecting elements. The color filters may be on the dielectric layer and may be disposed corresponding to the plurality of photo detecting elements, respectively. The micro lenses may be on the plurality of color filters and may be disposed corresponding to the plurality of photo detecting elements, respectively.

    Abstract translation: 图像传感器包括半导体衬底,多个光电检测元件,电介质层,多个滤色器和多个微透镜。 光检测元件可以在半导体衬底中,并且可以将入射光转换成电信号。 电介质层可以在半导体衬底上并且可以包括在光检测元件之间的区域上的多个光阻挡区域。 滤色器可以在电介质层上,并且可以分别对应于多个光检测元件设置。 微透镜可以在多个滤色器上,并且可以分别对应于多个光检测元件设置。

    Back-side illuminated image sensor
    20.
    发明申请
    Back-side illuminated image sensor 审中-公开
    背面照明图像传感器

    公开(公告)号:US20100140733A1

    公开(公告)日:2010-06-10

    申请号:US12591912

    申请日:2009-12-04

    Abstract: In an example embodiment, the backside-illuminated image sensor includes a substrate including a plurality of photoelectric conversion devices being separated by a semiconductor. The backside-illuminated sensor further includes a transparent electrode layer or a metal layer formed on a surface of a substrate. As a positive bias voltage or a negative bias voltage is applied to the transparent electrode layer or the metal layer, generation of dark current in the surface of the silicon substrate may be reduced or suppressed.

    Abstract translation: 在示例性实施例中,背面照明图像传感器包括由半导体分隔开的多个光电转换装置的基板。 背侧照明传感器还包括形成在基板的表面上的透明电极层或金属层。 由于向透明电极层或金属层施加正偏置电压或负偏置电压,因此可以减少或抑制硅衬底的表面中的暗电流的产生。

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