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11.发明授权公开(公告)号：US10544040B2
公开(公告)日：2020-01-28
申请号：US15909431
申请日：2018-03-01
Applicant: DunAn Microstaq, Inc.
Inventor： Wayne C. Long , Joe A. Ojeda , Joseph L. Nguyen
Abstract: A method of attaching a MEMS die to a mounting surface includes coating an inside surface of a pressure port of a fluid inlet member with a layer of solder mask, the fluid inlet member having a first axial end, a second axial end, and a port opening of the pressure port formed in the second axial end of the fluid inlet member. A solder preform is disposed on the mounting surface of the fluid inlet member and a MEMS die is disposed on the solder preform. The solder preform is heated in a re-flow operation to attach the MEMS die to the mounting surface, wherein the solder mask within the pressure port prevents molten solder from entering the pressure port during the re-flow operation.
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公开(公告)号：US10443712B2
公开(公告)日：2019-10-15
申请号：US15797847
申请日：2017-10-30
Applicant: DunAn Microstaq, Inc.
Inventor： E. Nelson Fuller , Parthiban Arunasalam , Wayne C. Long , Arvind P. Rao , Kevin Sinkar , Gengxun K. Gurley
Abstract: A system for controlling fluid pressure to a transmission system through a MEMS microvalve includes a transmission controller configured to receive a target command pressure, a current system command pressure input signal, and a transmission system operating temperature. A power determination module determines a temperature-related power factor from the target command pressure, the current system command pressure input signal, the transmission system operating temperature received in the controller, and a look-up table within the controller. A power signal module adjusts the current system command pressure input signal by the temperature-related power factor and applies the adjusted current system command pressure input signal to the MEMS microvalve via the controller.
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公开(公告)号：US10429108B2
公开(公告)日：2019-10-01
申请号：US15792809
申请日：2017-10-25
Applicant: DunAn Microstaq, Inc.
Inventor： Arvind P. Rao , Dhaman Kumar Besarla
Abstract: A method of maintaining a fluid flow rate in a heating, ventilating, air conditioning, and refrigeration (HVAC-R) system while maintaining superheat in the HVAC-R system at a desired level includes: continuously measuring an operating fluid temperature of the HVAC-R system and calculating superheat at a pre-determined rate, determining if the calculated superheat is stable, measuring and recording an operating fluid pressure of the system each time the calculated superheat is stable, recording an average operating fluid pressure each subsequent time the superheat is stable, calculating an output PWM and reducing fluid flow through a metering valve when an actual PWM is greater than the calculated output PWM by adjusting a PWM signal to a microvalve in the metering valve, and increasing fluid flow through the metering valve when the actual PWM is less than the calculated output PWM by adjusting the PWM signal to the microvalve.
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公开(公告)号：US20190092629A1
公开(公告)日：2019-03-28
申请号：US16204130
申请日：2018-11-29
Applicant: DunAn Microstaq, Inc.
Inventor： Wayne C. Long , Joe A. Ojeda , Gengxun K. Gurley , Joseph L. Nguyen
IPC: B81C1/00 , B23K1/00 , B23K35/02 , B81C3/00 , B23K101/36
Abstract: A method of attaching a MEMS die to a surface includes centering and rotationally aligning a solder perform on a solder surface of a body, centering and rotationally aligning a MEMS die on the solder preform, and heating the solder perform in a reflow process until the solder is molten and surface tension of the molten solder moves the MEMS die to a position where the surface tensions balance, and the MEMS die is centered on, and rotationally aligned with, the solder surface of the body.
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公开(公告)号：US10145594B2
公开(公告)日：2018-12-04
申请号：US15399792
申请日：2017-01-06
Applicant: DunAn Microstaq, Inc.
Inventor： E. Nelson Fuller , Parthiban Arunasalam , Joe A. Ojeda , Gengxun K. Gurley , Chen Yang , Jennifer O'Keefe
IPC: F25B41/06
Abstract: A two-stage proportional control valve configured for use in a fluid system includes a valve body having a longitudinally extending valve body bore formed therethrough. A first stage microvalve is mounted within the valve body bore, and a second stage spool assembly is mounted within the valve body bore downstream of the microvalve. The second stage spool assembly includes a sleeve and a spool slidably mounted within the sleeve.
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Patent Agency Ranking
16.发明申请公开(公告)号：US20180334382A1
公开(公告)日：2018-11-22
申请号：US15896796
申请日：2018-02-14
Applicant: DunAn Microstaq, Inc.
Inventor： Wayne C. Long , Joseph L. Nguyen
CPC classification number: B81C3/001 , B81B7/0048 , B81B2201/0264 , B81C2203/035
Abstract: A method of attaching a MEMS die to a base includes selecting an attachment material (x), determining a maximum acceptable change in pressure due to mounting stress (dPtarget) transmitted to a MEMS die, determining a worst-case pressure difference transfer function of the attachment material (x) over a thickness (h) variation of the attachment material (x) using the equation: dPmaxx=h*Bx+Cx, wherein B=pressure variation/thickness (h), and C=pressure variation, substituting dPtarget for dPmaxx in the pressure difference transfer function and solving the equation for h, wherein h=(dPtarget−Cx)/Bx, and attaching the MEMS die to a base using the selected attachment material (x) having at least the calculated thickness (h).
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17.发明申请公开(公告)号：US20180319656A1
公开(公告)日：2018-11-08
申请号：US15909431
申请日：2018-03-01
Applicant: DunAn Microstaq, Inc.
Inventor： Wayne C. Long , Joe A. Ojeda , Joseph L. Nguyen
Abstract: A method of attaching a MEMS die to a mounting surface includes coating an inside surface of a pressure port of a fluid inlet member with a layer of solder mask, the fluid inlet member having a first axial end, a second axial end, and a port opening of the pressure port formed in the second axial end of the fluid inlet member. A solder preform is disposed on the mounting surface of the fluid inlet member and a MEMS die is disposed on the solder preform. The solder preform is heated in a re-flow operation to attach the MEMS die to the mounting surface, wherein the solder mask within the pressure port prevents molten solder from entering the pressure port during the re-flow operation.
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公开(公告)号：US20180319654A1
公开(公告)日：2018-11-08
申请号：US15896749
申请日：2018-02-14
Applicant: DunAn Microstaq, Inc.
Inventor： Wayne C. Long , Joseph L. Nguyen
CPC classification number: B81B7/0029 , B81B7/0048 , B81B2201/0264 , B81C1/00325 , B81C1/00357 , B81C3/001 , B81C2203/035
Abstract: A multi-layer, stress-isolation platform configured for attaching a MEMS die to a base includes a first platform, a first layer of attachment material between the base and the first platform and attaching the first platform to the base, a MEMS die, and a second layer of attachment material between the first platform and the MEMS die and attaching the MEMS die to the first platform.
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公开(公告)号：US09970535B1
公开(公告)日：2018-05-15
申请号：US14874876
申请日：2015-10-05
Applicant: DunAn Microstaq, Inc.
Inventor： E. Nelson Fuller , Parthiban Arunasalam , Joe A. Ojeda, Sr.
CPC classification number: F16H61/0276 , B23P15/001 , F16H2061/0279 , F16K31/0613 , F16K99/0059 , F16K2099/0082
Abstract: A two-stage control microvalve includes a generally cylindrical housing configured for insertion into a bore in a body of a hydro-mechanical valve system, a pilot microvalve mounted within the housing, and a piloted microvalve mounted within the housing and in fluid communication with the pilot microvalve.
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公开(公告)号：US20170097181A1
公开(公告)日：2017-04-06
申请号：US15238834
申请日：2016-08-17
Applicant: DunAn Microstaq, Inc.
Inventor： Buu C. Chung , Wayne C. Long , Arvind Rao , Chen Yang , Joseph Nguyen , Joe A. Ojeda, SR. , Colin B. Bingle
CPC classification number: F25B49/02 , F25B41/062 , F25B2600/21 , F25B2600/2513 , G01L27/002
Abstract: A method of calibrating a plurality of superheat controllers includes attaching a plurality of superheat controllers to a manifold assembly, enclosing the manifold assembly within an environmental chamber, and simultaneously calibrating a pressure sensor within each of the plurality of superheat controllers.
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