公开(公告)号：US20110070460A1

公开(公告)日：2011-03-24

申请号：US11454091

申请日：2006-06-15

Applicant: Timothy P. Weihs ,  Etienne Besnoin ,  Ramzi Vincent ,  Somasundaram Valliappan ,  Ellen Heian ,  David Van Heerden ,  Timothy Ryan Rude ,  Omar Knio ,  Ronald Spraker ,  Yuping Lin

Inventor： Timothy P. Weihs ,  Etienne Besnoin ,  Ramzi Vincent ,  Somasundaram Valliappan ,  Ellen Heian ,  David Van Heerden ,  Timothy Ryan Rude ,  Omar Knio ,  Ronald Spraker ,  Yuping Lin

IPC: B32B15/01

CPC classification number: C22C30/00 ,  C06B21/00 ,  C06B45/12 ,  C22C5/04 ,  C22C19/00 ,  F42B3/18 ,  F42B39/14 ,  Y10T29/30 ,  Y10T29/302 ,  Y10T29/49002 ,  Y10T29/49227 ,  Y10T428/12493 ,  Y10T428/12632

Abstract: Applicants have discovered that electrostatic discharge (ESD) may, in some circumstances, result in current densities sufficient to ignite unprotected reactive composite materials. They have further discovered that a reactive composite material (RCM) can be protected from ESD ignition without adversely affecting the desirable properties of the RCM by the application of conducting and/or insulating materials at appropriate locations on the RCM. Thus ESD-protected RCM structures can be designed for such sensitive applications as ignition of propellants, generation of light bursts, and structural materials for equipment that may require controlled self-destruction.

Abstract translation: 申请人已经发现，在某些情况下，静电放电（ESD）可以导致足够的电流密度来点燃未受保护的反应性复合材料。 他们进一步发现，通过在RCM的适当位置施加导电和/或绝缘材料，可以保护反应性复合材料（RCM）免于ESD点火，而不会对RCM的期望性能产生不利影响。 因此，ESD保护的RCM结构可以设计用于诸如点燃推进剂，产生光爆炸以及可能需要受控自我破坏的设备的结构材料等敏感应用。

公开(公告)号：US20090178741A1

公开(公告)日：2009-07-16

申请号：US12352313

申请日：2009-01-12

Applicant: Yuwei Xun ,  David Lunking ,  Etienne Besnoin ,  David Van Heerden ,  Timothy P. Weihs ,  Omar M. Knio

Inventor： Yuwei Xun ,  David Lunking ,  Etienne Besnoin ,  David Van Heerden ,  Timothy P. Weihs ,  Omar M. Knio

IPC: C06B45/14 ,  C06B21/00 ,  C06B45/12

CPC classification number: C06B45/14

Abstract: Novel reactive composite materials and associated methods for making the same which are pertinent to numerous new or improved applications. The method for making the reactive composite materials utilizes mechanical deformation to manufacture such materials with controlled, predictable characteristics. In the first deformation step, an assembly of reactive layers and/or particles is plastically deformed to reduce its cross sectional area by one-half or more. Portions of the deformed sheets are stacked or bent into a new assembly, and the new assembly is then deformed. The steps of assembly and deformation are repeated a sufficient number of times that the resulting materials are only locally layered but have relatively uniform reaction velocity and heat generating characteristics predictable by stochastic models derived herein.

Abstract translation: 新型反应性复合材料及其制备方法与许多新的或改进的应用相关。 制备反应性复合材料的方法利用机械变形来制造具有可控，可预测特性的这种材料。 在第一变形步骤中，反应层和/或颗粒的组件塑性变形以将其横截面积减小一半以上。 变形的片材的一部分被堆叠或弯曲成新的组件，并且新的组件然后变形。 组装和变形的步骤重复足够次数，使得所得到的材料仅局部分层，但具有相对均匀的反应速度和通过本文得到的随机模型可预测的发热特性。

公开(公告)号：US20080272181A1

公开(公告)日：2008-11-06

申请号：US12041857

申请日：2008-03-04

Applicant: Jiaping Wang ,  Etienne Besnoin ,  Omar Knio ,  Timothy Weihs

Inventor： Jiaping Wang ,  Etienne Besnoin ,  Omar Knio ,  Timothy Weihs

IPC: B23K1/00

CPC classification number: B23K1/0006 ,  B23K1/0016 ,  B23K20/00 ,  B23K20/06 ,  B23K20/08 ,  B23K20/165 ,  B23K28/00 ,  B23K31/02 ,  B23K31/12 ,  B23K35/0233 ,  B23K35/0238 ,  B23K35/34 ,  B23K2101/40 ,  B23K2103/05 ,  B23K2103/10 ,  B32B15/01 ,  B32B15/017 ,  C06B21/0083 ,  C06B45/14 ,  C23C14/14 ,  F24V30/00 ,  G05B17/02 ,  H05K3/3463 ,  H05K3/3494 ,  H05K2203/0405 ,  H05K2203/1163 ,  Y10T428/12493 ,  Y10T428/12986

Abstract: Self-propagating formation reactions in nanostructured multilayer foils provide rapid bursts of heat at room temperature and therefore can act as local heat sources to melt solder or braze layers and join materials. This reactive joining method provides very localized heating to the components and rapid cooling across the joint. The rapid cooling results in a very fine microstructure of the solder or braze material. The scale of the fine microstructure of the solder or braze material is dependant on cooling rate of the reactive joints which varies with geometries and properties of the foils and components. The microstructure of the solder or braze layer of the joints formed by melting solder in a furnace is much coarser due to the slow cooling rate. Reactive joints with finer solder or braze microstructure show higher shear strength compared with those made by conventional furnace joining with much coarser solder or braze microstructure. It is expected that the reactive joints may also have better fatigue properties compared with conventional furnace joints.

Abstract translation: 纳米结构多层箔片中的自蔓延形成反应在室温下提供快速的热量爆发，因此可作为局部热源熔化焊料或钎焊层并连接材料。 该反应性接合方法为组件提供非常局部的加热并且跨接头快速冷却。 快速冷却导致焊料或钎焊材料的非常精细的微结构。 焊料或钎焊材料的细微微结构的尺度取决于随着箔和组件的几何形状和性质而变化的反应性接头的冷却速率。 由于缓慢的冷却速率，熔化焊料在熔炉中形成的接头的焊料或钎焊层的微观结构更加粗糙。 与具有更粗糙的焊料或钎焊微观结构的常规炉连接制成的反应性接头，具有更好的焊料或钎焊微观结构显示出更高的剪切强度。 预期与传统的炉接头相比，反应接头也可具有更好的疲劳特性。

公开(公告)号：US20080000949A1

公开(公告)日：2008-01-03

申请号：US11835818

申请日：2007-08-08

Applicant: Jiaping Wang ,  Omar Knio ,  Timothy Weihs ,  Etienne Besnoin

Inventor： Jiaping Wang ,  Omar Knio ,  Timothy Weihs ,  Etienne Besnoin

IPC: B23K20/02 ,  B23K20/16

CPC classification number: G05B17/02 ,  B23K1/0006 ,  B23K1/0016 ,  B23K20/00 ,  B23K20/06 ,  B23K20/08 ,  B23K20/165 ,  B23K28/00 ,  B23K31/02 ,  B23K31/12 ,  B23K35/0233 ,  B23K35/0238 ,  B23K35/34 ,  B23K2101/40 ,  B23K2103/05 ,  B23K2103/10 ,  B32B15/01 ,  B32B15/017 ,  C06B21/0083 ,  C06B45/14 ,  C23C14/14 ,  F24V30/00 ,  H05K3/3463 ,  H05K3/3494 ,  H05K2203/0405 ,  H05K2203/1163 ,  Y10T428/12632

Abstract: In accordance with the invention, bodies of materials are joined by disposing between them a reactive multilayer foil and one or more layers of meltable joining material such as braze or solder. The bodies are pressed together against the foil and joining material, and the foil is ignited to melt the joining material. The pressing is near the critical pressure and typically produces a joint having a strength of at least 70-85% the maximum strength producible at practical maximum pressures. Thus for example, reactively formed stainless steel soldered joints that were heretofore made at an applied pressure of about 100 MPa can be made with substantially the same strength at a critical applied pressure of about 10 kPa. Advantages of the process include minimization of braze or solder extrusion and reduced equipment and processing costs, especially in the joining of large bodies.

Abstract translation: 根据本发明，通过在它们之间设置反应性多层箔和一层或多层可熔融连接材料如钎焊或焊料来连接材料体。 主体被压在一起抵靠箔和接合材料，并且箔被点燃以熔化接合材料。 压力接近临界压力，并且通常产生具有至少70-85％的强度的接头，该最大强度在实际最大压力下可产生。 因此，例如，在约100MPa的施加压力下制造的反应形成的不锈钢焊接接头可以在约10kPa的临界施加压力下具有基本上相同的强度。 该方法的优点包括最小化钎焊或焊料挤出，并减少设备和加工成本，特别是在大体积的连接中。

公开(公告)号：US20050142495A1

公开(公告)日：2005-06-30

申请号：US10959502

申请日：2004-10-07

Applicant: David Peter Van Heerden ,  Etienne Besnoin ,  Stephen Spey ,  Timothy Rude ,  Michael Brown ,  Dale Deger ,  Ellen Heian ,  Somasundaram Valliappan ,  Omar Knio ,  Timothy Weihs

Inventor： David Peter Van Heerden ,  Etienne Besnoin ,  Stephen Spey ,  Timothy Rude ,  Michael Brown ,  Dale Deger ,  Ellen Heian ,  Somasundaram Valliappan ,  Omar Knio ,  Timothy Weihs

IPC: B01J19/00 ,  B01J19/08 ,  B01J19/10 ,  B01J19/12 ,  G03C3/00 ,  G06F19/00

CPC classification number: B23K35/0233 ,  B32B15/01 ,  F24V30/00 ,  G16C20/10

Abstract: Embodiments of the invention include a method of simulating an ignition of a reactive multilayer foil. Other embodiments include various methods of igniting a reactive multilayer foil by transferring energy from an energy source to a reactive multilayer foil.

Abstract translation: 本发明的实施例包括模拟反应性多层箔的点燃的方法。 其他实施方案包括通过将能量从能量源转移到反应性多层箔来点燃反应性多层箔的各种方法。