Abstract:
A method for fabricating patterned graphene structures, which adopts a photolithographic etching process to fabricate patterned graphene structures, comprises steps: providing a substrate; forming a catalytic layer on the substrate; forming a carbon layer on the catalytic layer; heating the carbon layer to a synthesis temperature to form a graphene layer. A photolithographic etching process is performed on the catalytic layer before formation of the carbon layer. Alternatively, a photolithographic etching process is performed on the carbon layer before heating. Alternatively, a photolithographic etching process is performed on the graphene layer after heating. Compared with the laser etching process, the photolithographic etching process is suitable to fabricate large-area patterned graphene structures and has advantages of high productivity and low cost.
Abstract:
The present invention discloses a light emitting diode (LED) element and a method for fabricating the same, which can promote light extraction efficiency of LED, wherein a substrate is etched to obtain basins with inclined natural crystal planes, and an LED epitaxial structure is selectively formed inside the basin. Thereby, an LED element having several inclines is obtained. Via the inclines, the probability of total internal reflection is reduced, and the light extraction efficiency of LED is promoted.
Abstract:
The present invention discloses a light emitting diode structure and a method for fabricating the same. In the present invention, a substrate is placed in a solution to form a chemical reaction layer on carved regions; the carved region is selectively etched to form a plurality of concave zones and form a plurality of convex zones; a semiconductor layer structure is epitaxially grown on the element regions and carved regions of the substrate; the semiconductor layer structure on the element regions is fabricated into a LED element with a photolithographic process.
Abstract:
The present invention discloses a light emitting diode structure and a method for fabricating the same. In the present invention, a substrate is placed in a solution to form a chemical reaction layer. Next, the substrate is etched to form a plurality of concave zones and a plurality of convex zones with the chemical reaction layer overhead. Next, the chemical reaction layer is removed to form an irregular geometry of the concave zones and convex zones on the surface of the substrate. Then, a semiconductor light emitting structure is epitaxially formed on the surface of the substrate. Thereby, the present invention can achieve a light emitting diode structure having improved internal and external quantum efficiencies.
Abstract:
A liquid crystal display includes: a first substrate and a second substrate; a liquid crystal layer filling between the first substrate and the second substrate; and a plurality of sealant observation windows arranged on the second substrate, wherein each sealant observation windows is an enclosed pattern formed by smooth curve; and a sealant covering a portion of sealant observation windows and surrounding the liquid crystal layer to bond the first substrate and the second substrate. In the present invention, those sealant observation windows can avoid the condition of unequal cell gap and increase the convenience of monitoring the spreading condition of the sealant.
Abstract:
A diode array is provided. The diode array includes a substrate and a plurality of light emitting diodes disposed on the substrate and arranged in an array, wherein each of the light emitting diodes includes a stack of functional layers comprising a first type semiconductor layer, a second type semiconductor layer, and a light emitting layer located between the first type semiconductor layer and the second type semiconductor layer, wherein at least one of the light emitting diodes includes: a first current limiting region abutting a vertically extending boundary of the second semiconductor layer; wherein, with respect to a top down view, the first current limiting region is formed about an outer edge of the light emitting diode and an outer perimeter of the first current limiting region is equal to or less than 400 micrometers (μm).
Abstract:
A medical drill is disclosed, which is made of amorphous alloy, the amorphous alloy is zirconium amorphous alloy comprising 45 at % or above of zirconium, wherein the tensile strength of the medical drill is 1500-2500 Mpa, and the Vicker's hardness of the medical drill is 400-750. Moreover, a medical drill made of titanium amorphous alloy is also disclosed.
Abstract:
A thermally-conductive paste comprises a carrier, at least one graphene platelet, and a plurality of packing materials. The graphene platelets and the packing materials are dispersed in the carrier. At least a portion of the packing materials contact the surface of the graphene platelet. The graphene platelet has a very high thermal conductivity coefficient and a characteristic 2D structure and thus can provide continuous and long-distance thermal conduction paths for the thermally-conductive paste. Thereby is greatly improved the thermal conduction performance of the thermally-conductive paste.
Abstract:
A liquid crystal display includes: a first substrate and a second substrate; a liquid crystal layer filling between the first substrate and the second substrate; and a plurality of sealant observation windows arranged on the second substrate, wherein each sealant observation windows is an enclosed pattern formed by smooth curve; and a sealant covering a portion of sealant observation windows and surrounding the liquid crystal layer to bond the first substrate and the second substrate. In the present invention, those sealant observation windows can avoid the condition of unequal cell gap and increase the convenience of monitoring the spreading condition of the sealant.
Abstract:
The present invention discloses a light emitting diode structure and a method for fabricating the same. In the present invention, a substrate is placed in a solution to form a chemical reaction layer. Next, the substrate is etched to form a plurality of concave zones and a plurality of convex zones with the chemical reaction layer overhead. Next, the chemical reaction layer is removed to form an irregular geometry of the concave zones and convex zones on the surface of the substrate. Then, a semiconductor light emitting structure is epitaxially formed on the surface of the substrate. Thereby, the present invention can achieve a light emitting diode structure having improved internal and external quantum efficiencies.