公开(公告)号：US20070178644A1

公开(公告)日：2007-08-02

申请号：US11698070

申请日：2007-01-26

申请人： Ja-eung Koo ,  Il-young Yoon ,  Jae-ouk Choo ,  Yong-kuk Jeong ,  Seo-woo Nam ,  Hong-jae Shin

发明人： Ja-eung Koo ,  Il-young Yoon ,  Jae-ouk Choo ,  Yong-kuk Jeong ,  Seo-woo Nam ,  Hong-jae Shin

IPC分类号： H01L21/336

CPC分类号： H01L21/3212 ,  H01L21/76801 ,  H01L21/7684

摘要： A semiconductor device having a dielectric or an insulating layer with decreased (or minimal) erosion properties when performing metal Chemical Mechanical Polishing (CMP) and a method of fabricating the same are provided. The semiconductor device may include gate electrodes formed on a substrate. A first interlayer oxide layer may be formed on the substrate and between the gate electrodes. A second interlayer oxide layer, which is harder than the first interlayer oxide layer, may be formed on the first interlayer oxide layer. A plug electrode may be formed through the second interlayer oxide layer and the first interlayer oxide layer.

摘要翻译： 提供了当执行金属化学机械抛光（CMP）时具有降低（或最小）腐蚀性能的电介质或绝缘层的半导体器件及其制造方法。 半导体器件可以包括形成在衬底上的栅电极。 第一层间氧化物层可以形成在衬底上和栅电极之间。 可以在第一层间氧化物层上形成比第一层间氧化物层硬的第二层间氧化物层。 可以通过第二层间氧化物层和第一层间氧化物层形成插塞电极。

公开(公告)号：US07166019B2

公开(公告)日：2007-01-23

申请号：US11044373

申请日：2005-01-27

申请人： Moo-Yong Park ,  Ja-Eung Koo ,  Sang-Cheol Han ,  Duk-Ho Hong

发明人： Moo-Yong Park ,  Ja-Eung Koo ,  Sang-Cheol Han ,  Duk-Ho Hong

IPC分类号： B24B49/00

CPC分类号： B24B37/30 ,  Y10T279/11

摘要： A flexible membrane for a polishing head and a chemical mechanical polishing (CMP) apparatus having the same are provided. The flexible membrane for a polishing head includes a compressing plate having a first face and a second face opposite to the first face. The first face of the compressing plate holds a substrate with a vacuum provided thereto and compresses the substrate on a polishing pad. The second face of the compressing plate is combined with a supporter of the polishing head. The second face and the supporter define a space to which the vacuum for holding the substrate and a first pneumatic pressure for compressing the substrate are applied. A dividing member combined with the supporter is formed on the second face. The dividing member divides the space into at least two regions. A pneumatic pressure-introducing portion is formed at the dividing member. A second pneumatic pressure is provided to the compressing plate through the pneumatic pressure-introducing portion.

摘要翻译： 提供了一种用于抛光头的柔性膜和具有该柔性膜的化学机械抛光（CMP）装置。 用于抛光头的柔性膜包括具有第一面和与第一面相对的第二面的压缩板。 压缩板的第一面保持提供真空的基板，并将基板压在抛光垫上。 压缩板的第二面与抛光头的支撑件组合。 第二面和支撑件限定了用于保持基板的真空和用于压缩基板的第一气动压力的空间。 与支撑件组合的分隔构件形成在第二面上。 分隔构件将空间分成至少两个区域。 在分隔构件上形成气压导入部。 通过气动压力引入部分向压缩板提供第二气动压力。

公开(公告)号：US20050176354A1

公开(公告)日：2005-08-11

申请号：US11044373

申请日：2005-01-27

申请人： Moo-Yong Park ,  Ja-Eung Koo ,  Sang-Cheol Han ,  Duk-Ho Hong

发明人： Moo-Yong Park ,  Ja-Eung Koo ,  Sang-Cheol Han ,  Duk-Ho Hong

IPC分类号： B24B37/005 ,  B24B37/30 ,  H01L21/304 ,  B24B1/00

CPC分类号： B24B37/30 ,  Y10T279/11

摘要： A flexible membrane for a polishing head and a chemical mechanical polishing (CMP) apparatus having the same are provided. The flexible membrane for a polishing head includes a compressing plate having a first face and a second face opposite to the first face. The first face of the compressing plate holds a substrate with a vacuum provided thereto and compresses the substrate on a polishing pad. The second face of the compressing plate is combined with a supporter of the polishing head. The second face and the supporter define a space to which the vacuum for holding the substrate and a first pneumatic pressure for compressing the substrate are applied. A dividing member combined with the supporter is formed on the second face. The dividing member divides the space into at least two regions. A pneumatic pressure-introducing portion is formed at the dividing member. A second pneumatic pressure is provided to the compressing plate through the pneumatic pressure-introducing portion.

摘要翻译： 提供了一种用于抛光头的柔性膜和具有该柔性膜的化学机械抛光（CMP）装置。 用于抛光头的柔性膜包括具有第一面和与第一面相对的第二面的压缩板。 压缩板的第一面保持提供真空的基板，并将基板压在抛光垫上。 压缩板的第二面与抛光头的支撑件组合。 第二面和支撑件限定了用于保持基板的真空和用于压缩基板的第一气动压力的空间。 与支撑件组合的分隔构件形成在第二面上。 分隔构件将空间分成至少两个区域。 在分隔构件上形成气压导入部。 通过气动压力引入部分向压缩板提供第二气动压力。

公开(公告)号：US20050048875A1

公开(公告)日：2005-03-03

申请号：US10850688

申请日：2004-05-21

申请人： Ja-Eung Koo ,  Jong-Won Lee ,  Sung-Bae Lee ,  Duk-Ho Hong ,  Sang-Rok Hah ,  Hong-Seong Son

发明人： Ja-Eung Koo ,  Jong-Won Lee ,  Sung-Bae Lee ,  Duk-Ho Hong ,  Sang-Rok Hah ,  Hong-Seong Son

IPC分类号： B24B37/02 ,  B24B37/04 ,  B24B49/10 ,  B24B49/14 ,  B24B49/00 ,  B24B1/00

CPC分类号： B24B37/013 ,  B24B49/10 ,  B24B49/14

摘要： There is provided a chemical mechanical polishing apparatus, which may include a polishing table rotated by a polishing table motor and having a pad thereon, a carrier head located above the polishing table to be rotatable by the driving of a carrier head motor and having a wafer located under the bottom thereof, a slurry supplier for supplying a slurry to the upper portion of the polishing table, a first polishing end point detector for detecting a polishing end point through the temperature change of the temperature sensor, at least one temperature sensor for detecting the temperature of a polishing region (the wafer, the pad, and the slurry), and a second polishing end point detector for detecting a polishing end point from the changes of load current, voltage, and resistance of the carrier head motor. Further, instead of the second polishing end point detector, an optical signal polishing end point detector may be employed, for detecting the polishing end point by the light illuminated on the wafer and reflected from the wafer.

公开(公告)号：US20070128991A1

公开(公告)日：2007-06-07

申请号：US11634195

申请日：2006-12-06

申请人： Il-young Yoon ,  Hong-jae Shin ,  Se-young Lee ,  Jae-ouk Choo ,  Ja-eung Koo

发明人： Il-young Yoon ,  Hong-jae Shin ,  Se-young Lee ,  Jae-ouk Choo ,  Ja-eung Koo

IPC分类号： B24B1/00 ,  B24B29/00

CPC分类号： B24B37/245 ,  B24B37/26

摘要： A fixed abrasive polishing pad includes a base and a plurality of polishing layers on the base, wherein each polishing layer includes abrasive particles and apertures in a polishing surface of the polishing layer.

摘要翻译： 固定的研磨抛光垫包括基底和在基底上的多个抛光层，其中每个抛光层包括抛光层抛光表面中的研磨颗粒和孔。