Abstract:
A DSX system arranged to receive a plurality of high-density chassis is disclosed. The chassis include back planes having rear access IN/OUT fields and rear access cross-connect fields. The rear access fields are electrically connected to termination panels located in respective IN/OUT regions and cross-connect regions. Each of the regions includes cable management channels within which system cables are routed.
Abstract:
One exemplary device has a plurality of leads with termination impedances, and a standard impedance. Among the termination impedances are master impedances arranged to be calibrated by comparison with the standard impedance and slave impedances arranged to be calibrated in accordance with an associated master impedance.
Abstract:
The present invention relates to a system and method for assessing the impact of an ailment on a health related quality of life domain of a patient using a standardized common metric. The standardized common metric of the present invention enables the impact of various ailments to be compared.
Abstract:
A patching system is disclosed herein. The patching system includes a plurality of front-loaded patching modules positionable within a chassis. Each of the patching modules includes first and second longframe jack assemblies and a switch for changing the circuit configurations of the patching module. The patching modules and the chassis provide increased patching density.
Abstract:
The present disclosure relates to a jack assembly including a jack mount having a front side and a rear side. A jack of the assembly is adapted to be slidably mounted in a jack receiving region of the jack mount. The jack assembly also includes a plurality of cross-connect contacts, and a rear interface assembly. The rear interface assembly includes a dielectric cover piece and a plurality of rear connectors that project outward from the dielectric cover piece.
Abstract:
Methods and apparatus are provided for a system for aligning data. The apparatus comprises a demultiplexing component adapted to bifurcate a DDR data stream into first and second SDR data streams, a sequence detection component coupled to the demultiplexing component and adapted to detect a pattern of sequential bit values in the first SDR data stream, and a data alignment component coupled to the demultiplexing component and to the sequence detection component, the data alignment component adapted to place the second SDR data stream in alignment with the pattern of sequential bit values in the first SDR data stream.
Abstract:
Methods and apparatus are provided for a system for aligning data. The apparatus comprises a data processing component adapted to produce a plurality of processed data streams delayed by a successively increasing number of clock cycles, a plurality of sequence detection components coupled to the data processing component, each of the plurality of sequence detection components adapted to inspect its input data stream for a predetermined sequence of bits, and a data selecting component adapted to receive the plurality of processed data streams, to select one of the plurality of processed data streams in response to receiving an indicator from a corresponding sequence detection component.
Abstract:
A DSX system for receiving removable jack inserts is disclosed. The system includes a plurality of chassis rearward facing cross-connect arrays and rearward facing IN/OUT arrays. A first circuit board section and a second circuit board section are electrically connected to the arrays. The first circuit board section is positioned behind the removable jack inserts. The second circuit board section is positioned behind the first circuit board section and in front of the cross-connect array and the IN/OUT array.
Abstract:
The present disclosure relates to a jack assembly including a jack mount having a front side and a rear side. A jack of the assembly is adapted to be slidably mounted in a jack receiving region of the jack mount. The jack assembly also includes a plurality of cross-connect contacts, and a rear interface assembly. The rear interface assembly includes a dielectric cover piece and a plurality of rear connectors that project outward from the dielectric cover piece.