公开(公告)号：US20080083506A1

公开(公告)日：2008-04-10

申请号：US11797950

申请日：2007-05-09

申请人： Hideaki Awata ,  Katsuji Emura ,  Kentaro Yoshida ,  Nobuyuki Okuda ,  Jun Nakamura

发明人： Hideaki Awata ,  Katsuji Emura ,  Kentaro Yoshida ,  Nobuyuki Okuda ,  Jun Nakamura

IPC分类号： B32B37/00 ,  B32B7/02

CPC分类号： C23C14/562 ,  B65H23/1806 ,  B65H2301/51 ,  B65H2301/51145 ,  B65H2555/24 ,  C25D7/0692 ,  C25D11/04 ,  C25D17/00 ,  Y10T428/2495

摘要： A feeding mechanism, having a base station to which an elongate base material is continuously fed to be physically or chemically processed at a prescribed speed and from which the processed base material is continuously recovered, wherein tensile force T1 in a direction opposite to a feeding direction is applied at a supply side of the base station, frictional force F is applied at the base station and tensile force T2 in the feeding direction is applied at the recovery side of the base station, on said base material, with these forces satisfying the relation of F>T1>T2, is provided. A feeding mechanism for feeding a base material for performing physical or chemical processing with high accuracy while an elongate base material is continuously fed, particularly a feeding mechanism that suppresses thickness variation along the lengthwise direction or surface damage at a portion where a function is added of the processed base material, can be obtained.

摘要翻译： 一种馈送机构，具有基站，连续地将细长的基材连续地供给到其中，以规定的速度进行物理或化学处理，并且经过处理的基材连续回收，其中拉伸力T 1 < 在基站的供给侧施加与进给方向相反的方向，在基站施加摩擦力F，在回收侧施加沿供给方向的拉伸力T 2 2 在所述基材上，提供满足F> T 1 T 2> 2的关系的这些力。 一种供给机构，用于在连续供给细长的基材的同时高精度地进给用于进行物理或化学处理的基材，特别是抑制沿着长度方向的厚度变化或添加功能的部分的表面损伤的进给机构 可以得到经加工的基材。

公开(公告)号：US07307160B1

公开(公告)日：2007-12-11

申请号：US10637551

申请日：2003-08-11

申请人： Hiromi Ohtaki ,  Jun Nakamura ,  Hiroshi Izui ,  Tsuyoshi Nakamatsu

发明人： Hiromi Ohtaki ,  Jun Nakamura ,  Hiroshi Izui ,  Tsuyoshi Nakamatsu

IPC分类号： C07H21/04 ,  A61K38/00 ,  C12N1/20

CPC分类号： C12N9/1051 ,  C12N9/90 ,  C12P13/14 ,  C12R1/13 ,  C12R1/15

摘要： L-Glutamic acid is produced by culturing a coryneform bacterium having L-glutamic acid producing ability, in which trehalose synthesis ability is decreased or deleted by, for example, disrupting the otsA gene derived from a coryneform bacterium source, coding for trehalose-6-phosphate synthase, to produce and accumulate L-glutamic acid in the medium, and collecting the L-glutamic acid from the medium.

摘要翻译： L-谷氨酸是通过培养具有L-谷氨酸生产能力的棒状杆菌型细菌产生的，其中海藻糖合成能力通过例如破坏源于棒杆菌型细菌源的otsA基因而减少或缺失，编码海藻糖-6- 磷酸合成酶，在培养基中产生和积累L-谷氨酸，并从培养基中收集L-谷氨酸。

公开(公告)号：US20060057686A1

公开(公告)日：2006-03-16

申请号：US11222138

申请日：2005-09-09

申请人： Seiko Hirano ,  Mikiko Yamaguchi ,  Jun Nakamura ,  Hisao Ito

发明人： Seiko Hirano ,  Mikiko Yamaguchi ,  Jun Nakamura ,  Hisao Ito

IPC分类号： C12P13/14 ,  C12N9/10 ,  C12N1/21

CPC分类号： C12P13/14 ,  C12N9/0012

摘要： A coryneform bacterium which has an L-glutamic acid-producing ability and grows at least at the same growth rate as a non-mutated strain or a wild-type strain and has intracellular α-ketoglutarate dehydrogenase activity which is less than half that of the non-mutated or wild-type strain, and is obtained by introducing a mutation into a coding region or an expression control region of the chromosomal odhA gene encoding the E1o subunit of the α-ketoglutarate dehydrogenase complex.

摘要翻译： 具有L-谷氨酸生产能力的棒状杆菌型细菌至少以与非突变菌株或野生型菌株相同的生长速率生长，并且具有小于所述野生型菌株的一半的细胞内α-酮戊二酸脱氢酶活性 非突变或野生型菌株，并且通过将突变引入编码α-酮戊二酸脱氢酶复合物的E1o亚基的染色体odhA基因的编码区域或表达控制区而获得。

公开(公告)号：US06679166B2

公开(公告)日：2004-01-20

申请号：US10259401

申请日：2002-09-30

申请人： Jun Nakamura ,  Shoichi Ikejima

发明人： Jun Nakamura ,  Shoichi Ikejima

IPC分类号： B41N124

CPC分类号： B41C1/145 ,  B41C1/144 ,  Y10T428/1259 ,  Y10T428/24273

摘要： In a method and apparatus for perforating a heat sensitive stencil sheet having a heat shrinkable film, the film is selectively heated with a heating device to form independent dot perforations corresponding to an image, and the heating device is controlled to ensure that the perforations satisfy the following formula (1): p≧d+({square root over ( )}2)f  (1) where p denotes a scanning pitch in a main scanning direction or a sub scanning direction; d denotes an inner diameter of a perforation in the same direction as p; and f denotes a width of a rim of said perforation at a portion that is not merged with any rims of its adjacent perforations. Irregularity of perforation configuration is decreased, size of perforations is kept adequate, and the heating device does not have to be heated to a high temperature.

摘要翻译： 在用于对具有热收缩膜的热敏蜡纸进行穿孔的方法和装置中，用加热装置选择性地加热该膜以形成与图像相对应的独立的点穿孔，并且加热装置被控制以确保穿孔满足 以下公式（1）：其中p表示主扫描方向或副扫描方向上的扫描间距; d表示与p相同方向的穿孔的内径; f表示在与其相邻穿孔的任何边缘不会合的部分处的所述穿孔的边缘的宽度。 穿孔结构的不规则性减小，穿孔尺寸保持足够，并且加热装置不必被加热到高温。

公开(公告)号：US06629495B2

公开(公告)日：2003-10-07

申请号：US09858464

申请日：2001-05-17

申请人： Jun Nakamura ,  Kenji Ohshima

发明人： Jun Nakamura ,  Kenji Ohshima

IPC分类号： B41J235

CPC分类号： B32B27/10 ,  B32B3/266 ,  B32B27/00 ,  B32B27/36 ,  B32B2038/047 ,  B32B2305/026 ,  B32B2367/00 ,  B41C1/144 ,  B41N1/241 ,  B41N1/243 ,  B41N1/245 ,  Y10T428/24273 ,  Y10T428/24331

摘要： When thermally perforating a thermoplastic resin film of heat-sensitive stencil material by the use of a thermal head, supply of energy to the thermal head is cut at a time the diameter of the perforations becomes not smaller than 65% and not larger than 95% of a target diameter of the perforations.

公开(公告)号：US06532867B2

公开(公告)日：2003-03-18

申请号：US09858910

申请日：2001-05-17

申请人： Jun Nakamura ,  Shoichi Ikejima

发明人： Jun Nakamura ,  Shoichi Ikejima

IPC分类号： B41C114

CPC分类号： B41C1/144 ,  B41N1/245 ,  Y10T428/24322 ,  Y10T428/24802

摘要： A perforation pattern is provided with a stencil plate, which is decreased in perforation configuration irregularity and has an adequate size of perforations. The stencil plate is produced from a heat sensitive stencil sheet having a heat shrinkable film by selectively heating the film with a heating device to form independent dot perforations corresponding to an image in the film, and each of the perforations has a through hole and a rim surrounding the through hole and bulging on a heated side of the film, and the rim has a height that satisfies the following formulae (1) and (2): h≦4(&mgr;m)  (1) h≦0.05{square root over ( )}(pxpy) (&mgr;m)  (2) where h denotes the height (&mgr;m) in reference to the surface of the film before heated, px and py respectively denote pitches (&mgr;m) in main and sub scanning directions of the heating device.

摘要翻译： 穿孔图案设置有模板，其穿孔构造不规则减小并且具有足够的穿孔尺寸。 通过用加热装置选择性地加热薄膜，由具有热收缩薄膜的热敏蜡纸制造模板，以形成对应于薄膜中的图像的独立点孔，并且每个穿孔具有通孔和边缘 围绕通孔并在膜的加热侧隆起，并且边缘具有满足下列公式（1）和（2）的高度：其中h表示相对于膜前表面的高度（母体） 加热，px和py分别表示加热装置的主扫描和副扫描方向上的间距（母）。

公开(公告)号：US06366305B1

公开(公告)日：2002-04-02

申请号：US09651882

申请日：2000-08-30

申请人： Jun Nakamura

发明人： Jun Nakamura

IPC分类号： B41J232

CPC分类号： B41J2/33515 ,  B41C1/144 ,  B41J2/33545 ,  B41J2/3357 ,  B41J2202/32

摘要： A stencil is made by thermally perforating a stencil material by the use of a thick film thermal head. The thermal head includes an electrical insulating substrate and a glaze layer superposed on a heat radiating plate in this order, a resistance heater formed on the glaze layer to continuously extend in a main scanning direction, a plurality of electrodes of at least two lines which extend in a direction intersecting the main scanning direction in contact with the resistance heater and are alternately arranged in the main scanning direction, and a protective layer which covers exposed part of the resistance heater and the electrodes. The resistance heater is not smaller than lam and not larger than 1 &mgr;m in thickness, and the space between each pair of adjacent electrodes in the main scanning direction is not smaller than 20% and not larger than 60% of the center distance between the adjacent electrodes. The stencil material is conveyed by a conveyor in a sub-scanning direction relative to the thermal head with the stencil material kept in contact with the thermal head. The thermal head and the conveyor are controlled so that the length in the sub-scanning direction of the resistance heater at the portion between each pair of adjacent electrodes is not smaller than 100% and not larger than 250% of the sub-scanning pitch.

摘要翻译： 通过使用厚膜热敏头对模板材料进行热穿孔来制造模板。 热敏头包括依次叠置在散热板上的电绝缘基板和釉层，形成在釉层上的电阻加热器，以在主扫描方向上连续延伸，至少延伸两条线的多个电极， 在与电阻加热器接触的主扫描方向相交的方向上，并且沿主扫描方向交替布置，以及覆盖电阻加热器和电极的暴露部分的保护层。 电阻加热器的厚度不小于lam，不大于1um，主扫描方向上每对相邻电极之间的空间不小于相邻电极的中心距离的20％且不大于60％ 电极。 模板材料通过输送机在副扫描方向上相对于热敏头传送，模板材料与热敏头保持接触。 控制热敏头和输送机，使得每对相邻电极之间的电阻加热器的副扫描方向上的长度不小于副扫描间距的100％且不大于250％。

公开(公告)号：US06362846B1

公开(公告)日：2002-03-26

申请号：US09650820

申请日：2000-08-30

申请人： Jun Nakamura

发明人： Jun Nakamura

IPC分类号： B41J232

CPC分类号： B41N1/24 ,  B41C1/144

摘要： A stencil is made by thermally perforating a stencil material by the use of a thick film thermal head. The thermal head includes an electrical insulating substrate and a glaze layer superposed on a heat radiating plate in this order, a resistance heater formed on the glaze layer to continuously extend in a main scanning direction, a plurality of electrodes of at least two lines which extend in a direction intersecting the main scanning direction in contact with the resistance heater and are alternately arranged in the main scanning direction, and a protective layer which covers exposed part of the resistance heater and the electrodes. The resistance heater is not smaller than 1 &mgr;m and not larger than 10 &mgr;m in thickness, and the space between each pair of adjacent electrodes in the main scanning direction is not smaller than 20% and not larger than 60% of the center distance between the adjacent electrodes. The stencil material is conveyed by a conveyor in a sub-scanning direction relative to the thermal head with the stencil material kept in contact with the thermal head. The thermal head and the conveyor are controlled so that the length in the sub-scanning direction of the resistance heater at the portion between each pair of adjacent electrodes is not smaller than 100% and not larger than 250% of the sub-scanning pitch.

摘要翻译： 通过使用厚膜热敏头对模板材料进行热穿孔来制造模板。 热敏头包括依次叠置在散热板上的电绝缘基板和釉层，形成在釉层上的电阻加热器，以在主扫描方向上连续延伸，至少延伸两条线的多个电极， 在与电阻加热器接触的主扫描方向相交的方向上，并且沿主扫描方向交替布置，以及覆盖电阻加热器和电极的暴露部分的保护层。 电阻加热器的厚度不小于1um且不大于10um，并且在主扫描方向上每对相邻电极之间的空间不小于20nm至60cm之间的中心距离 相邻电极。 模板材料通过输送机在副扫描方向上相对于热敏头传送，模板材料与热敏头保持接触。 控制热敏头和输送机，使得每对相邻电极之间的电阻加热器的副扫描方向上的长度不小于副扫描间距的100％且不大于250％。

公开(公告)号：US06303383B1

公开(公告)日：2001-10-16

申请号：US09521668

申请日：2000-03-08

申请人： Jun Nakamura ,  Sohei Kanno ,  Eiichiro Kimura ,  Kazuhiko Matsui ,  Tsuyoshi Nakamatsu

发明人： Jun Nakamura ,  Sohei Kanno ,  Eiichiro Kimura ,  Kazuhiko Matsui ,  Tsuyoshi Nakamatsu

IPC分类号： C12N1574

CPC分类号： C12N15/77

摘要： A coryneform bacterium in which a DNA fragment is incorporated into its chromosome is prepared by (a) obtaining a recombinant plasmid through ligation of a DNA fragment having a sequence homologous to a gene present on a chromosome of a coryneform bacterium to a plasmid that has a wild-type replication control region segment of a particular nucleotide sequence including a mutation and is autonomously replicable in a coryneform bacterium cell at a culture temperature lower than 31° C. but not autonomously replicable in the cell at a temperature of 31° C. or higher, (b) introducing the recombinant plasmid into the coryneform bacterium cell, (c) culturing the bacterium at a temperature of 31° C. or higher, (d) causing homologous recombination between the DNA fragment and the gene present on the chromosome of the coryneform bacterium and having a sequence homologous to the DNA fragment, and (e) selecting a coryneform bacterium in which the DNA fragment is incorporated into its chromosome. According to the present invention, there is provided a method for efficiently modifying genetic traits of a host in a short period of time by obtaining a temperature sensitive plasmid from a plasmid not exhibiting homology with already reported temperature sensitive plasmids or not exhibiting incompatibility therewith.

摘要翻译： 通过（a）通过将具有与存在于棒状杆菌型细菌的染色体上的基因同源的序列的DNA片段连接到具有下列基因的质粒来获得重组质粒来制备将DNA片段并入其染色体中的棒状细菌： 包含突变的特定核苷酸序列的野生型复制控制区段，并且在棒状细菌细胞中，在低于31℃的培养温度下是可自主复制的，但在31℃的温度下不能在细胞中自主复制，或 （b）将重组质粒引入棒状细菌细胞中，（c）在31℃或更高的温度下培养细菌，（d）使DNA片段与存在于染色体上的基因之间的同源重组 所述棒状细菌具有与所述DNA片段同源的序列，和（e）选择其中所述DNA片段并入其染色体中的棒状细菌 e。 根据本发明，提供了一种通过从未报道的温度敏感性质粒不显示同源性的质粒或不表现出不相容性的质粒获得温度敏感性质粒来在短时间内高效地修饰宿主遗传性状的方法。

公开(公告)号：US6048189A

公开(公告)日：2000-04-11

申请号：US620455

申请日：1996-03-22

申请人： Fumio Kurihara ,  Mitsuyoshi Kumamoto ,  Yasuhito Ito ,  Masanobu Nagano ,  Jun Nakamura

发明人： Fumio Kurihara ,  Mitsuyoshi Kumamoto ,  Yasuhito Ito ,  Masanobu Nagano ,  Jun Nakamura

IPC分类号： B29C35/04 ,  B29C35/08 ,  B29C35/16 ,  B29C49/04 ,  B29C49/20 ,  B29C49/48 ,  B29C49/78 ,  B29C33/04 ,  B29C33/06 ,  B29C49/64

CPC分类号： B29C49/4823 ,  B29C49/20 ,  B29C49/78 ,  B29C49/783 ,  B29C2035/1616 ,  B29C2035/1658 ,  B29C2049/2008 ,  B29C2049/2402 ,  B29C2049/4876 ,  B29C35/041 ,  B29C35/045 ,  B29C35/049 ,  B29C35/08 ,  B29C49/04 ,  B29K2105/04 ,  Y10S264/904

摘要： A process and an apparatus for molding, in which a molten thermoplastic resin is firmly fitted onto a molding surface of a mold under a pressure lower than or equal to 100 kg/cm.sup.2 and is cured to obtain a molded product. The molding apparatus has a mold main body, and a mold body on which the molding surface is defined. The mold body is supported relative to the mold main body with maintaining a space on the back side of the molding surface in a heat insulative manner by a supporting member which includes at least a heat insulative supporting member having a thermal conductivity of 0.001 to 1 Kcal/mh .degree.C. and a longitudinal elastic modulus of 0.01 to 10 kg/cm.sup.2. In the space, a heating fluid for heating the molding surface from the bask side to a temperature higher than or equal to Vicat softening temperate (T) .degree.C. of the thermoplastic resin and a cooling fluid for cooling the molding surface from the back side to a temperature lower than or equal to (Vicat softening temperature (T) of the thermoplastic resin -10) .degree.C. are supplied.

摘要翻译： 一种成型方法和成型装置，其中熔融热塑性树脂在低于或等于100kg / cm 2的压力下牢固地装配在模具的模制表面上并固化以获得模塑产品。 成型装置具有模具主体和限定成型面的模具主体。 模具主体通过支撑构件以热绝缘的方式在模制表面的后侧保持空间来支撑，该支撑构件至少包括导热率为0.001至1Kcal的绝热支撑构件 / mh℃，纵向弹性模量为0.01〜10kg / cm 2。 在该空间中，用于将模塑表面从底部侧加热到高于或等于热塑性树脂的维卡软化温度（T）℃的温度的加热流体和用于从后侧冷却模制表面的冷却流体 达到低于或等于（热塑性树脂的维卡软化温度（T）-10）℃的温度。