公开(公告)号：US08294262B2

公开(公告)日：2012-10-23

申请号：US12588125

申请日：2009-10-06

Applicant: Ke-Chin Lee

Inventor： Ke-Chin Lee

IPC: H01L23/34

CPC classification number: H01L33/642 ,  F28D15/0275 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A LED chip package including a two-phase-flow heat transfer device, at least one LED chip, a metal lead frame and a package material. The two-phase-flow heat transfer device has at least one flat surface. The LED chip is directly or indirectly bonded or adhered to the flat surface of the two-phase-flow heat transfer device. Heat generated by the LED chip can be easily conducted away from the LED chip by the two-phase-flow heat transfer device such as a heat pipe, a vapor chamber and the like so as to prevent heat from accumulating in the LED chip thereby extending the service duration of the LED chip and to prevent the LED chip from deterioration of the light emitting performance caused by the accumulation of heat.

Abstract translation: 一种LED芯片封装，包括两相流传热装置，至少一个LED芯片，金属引线框架和封装材料。 两相流传热装置具有至少一个平坦表面。 LED芯片直接或间接地结合或粘合到两相流动传热装置的平坦表面上。 由LED芯片产生的热量可以通过诸如热管，蒸气室等的两相流传热装置容易地从LED芯片导出，以防止热量积聚在LED芯片中从而延伸 LED芯片的使用持续时间，并防止LED芯片由于热量积聚而引起的发光性能的恶化。

公开(公告)号：US20110277955A1

公开(公告)日：2011-11-17

申请号：US13090715

申请日：2011-04-20

Applicant: Ke-chin Lee

Inventor： Ke-chin Lee

IPC: F28F9/013

CPC classification number: F28D15/0233 ,  B23P2700/09 ,  F28D15/0283 ,  F28D15/046 ,  F28F2240/00 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49353 ,  Y10T29/4998 ,  H01L2924/00

Abstract: A vapor chamber comprises a flat metal tube formed of a circular metal tube by pressing, a powder sintering portion disposed on the inner wall of the metal tube, a supporting structure disposed in and surrounded by the metal tube, a working fluid filled in the metal tube; wherein the top and bottom sides of the metal tube are flat, the two opposite sides connecting the top and bottom sides are seamlessly circular arc shaped, and the other two opposite sides are the sealed ends formed of the two open ends by pressing and sealing. The present invention provides a vapor chamber for CPU, GPU, LED solar cell or other high heat producing electronic products to solve the heat dissipation issues.

Abstract translation: 蒸气室包括通过压制由圆形金属管形成的扁平金属管，设置在金属管的内壁上的粉末烧结部分，设置在金属管中并被金属管包围的支撑结构，填充在金属中的工作流体 管; 其中金属管的顶面和底面是平的，连接顶面和底面的两个相对侧是无缝圆弧形的，而另外两个相对的两边是通过压制和密封由两个开口端形成的密封端。 本发明提供一种用于CPU，GPU，LED太阳能电池或其他高发热电子产品的蒸气室，以解决散热问题。

公开(公告)号：US08021025B2

公开(公告)日：2011-09-20

申请号：US12354622

申请日：2009-01-15

Applicant: Ke-Chin Lee

Inventor： Ke-Chin Lee

IPC: F21V29/00

CPC classification number: F21V29/51 ,  F21K9/232 ,  F21V3/02 ,  F21V29/004 ,  F21V29/76 ,  F21V29/763 ,  F21V29/767 ,  F21V29/773 ,  F21Y2115/10

Abstract: An LED lamp has a base, a tubular conductor, a bulb and at least one LED. The base is metallic and has an electrical connector. The tubular conductor is filled with a fluid and mounted on the base and has a distal end and a proximal end. The bulb is pellucid and connected to the base. The at least one LED is mounted on the distal end of the tubular conductor and electrically connected to the connector of the base. The fluid in the tubular conductor may vaporize close to operating temperatures of the LED so transports heat away from the LED quickly and efficiently so allowing high power or multiple LEDs to be implemented, so improving brightness of the LED lamp and commercial applications.

Abstract translation: LED灯具有基座，管状导体，灯泡和至少一个LED。 基座是金属的，并具有电连接器。 管状导体填充有流体并安装在基座上并且具有远端和近端。 灯泡透明并连接到底座。 至少一个LED安装在管状导体的远端上并电连接到基座的连接器。 管状导体中的流体可能会接近LED的工作温度而蒸发，从而快速有效地将热量从LED传输，从而实现高功率或多个LED，从而提高LED灯和商业应用的亮度。

公开(公告)号：US09057491B2

公开(公告)日：2015-06-16

申请号：US13419822

申请日：2012-03-14

Applicant: Ke-chin Lee

Inventor： Ke-chin Lee

IPC: H05B37/02 ,  F21S2/00 ,  F21V14/06 ,  F21V21/15 ,  F21V23/04 ,  H05B33/08 ,  F21Y101/02

CPC classification number: F21S2/00 ,  F21V14/06 ,  F21V21/15 ,  F21V23/0435 ,  F21Y2115/10 ,  H05B33/0854 ,  H05B37/0227 ,  H05B37/0254 ,  H05B37/0272

Abstract: A network controlled indoor lighting system is disclosed, which is constructed based on a device control unit with network connectivity, and a remote controller containing the software for users to control the interior lighting system. The system allows users to control a plurality of LED lamps in terms of brightness, color temperature, beam angle and illumination direction. The system has single/multi-point control, and online error diagnosis.

Abstract translation: 公开了一种基于具有网络连接的设备控制单元构建的网络控制的室内照明系统，以及包含用于控制室内照明系统的软件的遥控器。 该系统允许用户在亮度，色温，光束角度和照明方向方面控制多个LED灯。 系统具有单/多点控制和在线错误诊断。

公开(公告)号：US20120235580A1

公开(公告)日：2012-09-20

申请号：US13419822

申请日：2012-03-14

Applicant: Ke-chin Lee

Inventor： Ke-chin Lee

IPC: H05B37/02

CPC classification number: F21S2/00 ,  F21V14/06 ,  F21V21/15 ,  F21V23/0435 ,  F21Y2115/10 ,  H05B33/0854 ,  H05B37/0227 ,  H05B37/0254 ,  H05B37/0272

Abstract: A network controlled indoor lighting system is disclosed, which is constructed based on a device control unit with network connectivity, and a remote controller containing the software for users to control the interior lighting system. The system allows users to control a plurality of LED lamps in terms of brightness, color temperature, beam angle and illumination direction. The system has single/multi-point control, and online error diagnosis.

Abstract translation: 公开了一种基于具有网络连接的设备控制单元构建的网络控制的室内照明系统，以及包含用于控制室内照明系统的软件的遥控器。 该系统允许用户在亮度，色温，光束角度和照明方向方面控制多个LED灯。 系统具有单/多点控制和在线错误诊断。

公开(公告)号：US20110277311A1

公开(公告)日：2011-11-17

申请号：US13090712

申请日：2011-04-20

Applicant: Ke-chin Lee

Inventor： Ke-chin Lee

IPC: B23P25/00

CPC classification number: F28D15/0233 ,  B23P2700/09 ,  F28D15/0283 ,  F28D15/046 ,  F28F2240/00 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49353 ,  Y10T29/4998 ,  H01L2924/00

Abstract: A vapor chamber manufacturing method, comprises steps of material preparation, powder filling and sintering, pre-punching, supporting structure infilling, the first pressing, the first sealing, fluid injection, and vacuum processing; a sealing structure comprises a semi-finished vapor chamber with a vacuum cavity, a fluid injection port positioned on one side of the vapor chamber, and a supporting structure filled in the vacuum cavity and supporting the shape of the vapor chamber, wherein the fluid injection port is formed of one portion of one side of the vapor chamber by pressing and sealing, no fine metal pipe as fluid injection port is required herein; after the step of fluid injection, an integrated step of vacuum pumping, pressing and sealing is conducted within a vacuum chamber, to provide the product with higher performance and lower rejection rate.

Abstract translation: 蒸气室制造方法，包括材料制备，粉末填充和烧结步骤，预冲压，支撑结构灌注，第一次压制，第一次密封，流体注入和真空处理; 密封结构包括具有真空腔的半成品蒸气室，位于蒸气室一侧的流体注入口和填充在真空腔中并支撑蒸气室形状的支撑结构，其中流体注入 端口由蒸汽室的一侧的一部分通过加压和密封而形成，在此不需要作为流体注入口的细金属管; 在流体注射步骤之后，在真空室内进行真空泵送，压制和密封的一体化步骤，为产品提供更高的性能和更低的排除率。

公开(公告)号：US20100266864A1

公开(公告)日：2010-10-21

申请号：US12588128

申请日：2009-10-06

Applicant: Ke-Chin Lee

Inventor： Ke-Chin Lee

IPC: B32B15/16 ,  B32B15/01

CPC classification number: B32B15/01 ,  B22F7/08 ,  F28D15/0233 ,  F28D15/046 ,  F28F2255/18 ,  Y10T428/12063 ,  Y10T428/1209

Abstract: An ultra-thin heat pipe comprises a flat metal tube and one or more sintered powder portions. The flat metal tube has an upper tube wall, a lower tube wall and two lateral walls connecting with the upper tube wall and the lower tube wall. The sintered powder portions extends axially and are formed on an inner face of at least one of the upper tube wall, the lower tube wall and the lateral walls such that vapor passage space is formed at one or more sides of the sintered powder portions.

Abstract translation: 超薄热管包括扁平金属管和一个或多个烧结粉末部分。 扁平金属管具有上管壁，下管壁和与上管壁和下管壁连接的两个侧壁。 烧结粉末部分轴向延伸并且形成在上管壁，下管壁和侧壁中的至少一个的内表面上，使得在烧结粉末部分的一侧或多侧形成蒸气通道空间。

公开(公告)号：US20100259942A1

公开(公告)日：2010-10-14

申请号：US12802965

申请日：2010-06-17

Applicant: Ke-Chin Lee

Inventor： Ke-Chin Lee

IPC: F21V29/00

CPC classification number: F21V29/51 ,  F21K9/233 ,  F21V15/01 ,  F21V29/004 ,  F21V29/507 ,  F21V29/763 ,  F21V29/773 ,  F21V29/83 ,  F21V29/89 ,  F21Y2115/10

Abstract: An LED lamp has a metal housing, a sintered heat pipe and an LED. The metal housing has an outer surface, an inner surface, a bottom and an opening defined by an inner edge. The sintered heat pipe engages the inner surface and the bottom and the inner edge of the metal housing. The LED is attached to a flattened area of the bottom portion of the sintered heat pipe. The sintered heat pipe rapidly transports heat generated by the LED to the metal housing which then transfers heat to the environment. The sintered heat pipe makes effective heat transportation possible and allows the use of high-power LEDs or multiple LED's within one lamp.

Abstract translation: LED灯具有金属外壳，烧结热管和LED。 金属外壳具有由内边缘限定的外表面，内表面，底部和开口。 烧结的热管接合金属外壳的内表面和底部以及内边缘。 LED连接到烧结热管的底部的平坦区域。 烧结的热管快速地将由LED产生的热量输送到金属壳体，然后将热量传递到环境中。 烧结热管使得有效的热传输成为可能，并允许在一个灯内使用大功率LED或多个LED。

公开(公告)号：US20100177521A1

公开(公告)日：2010-07-15

申请号：US12319995

申请日：2009-01-14

Applicant: Ke-Chin Lee

Inventor： Ke-Chin Lee

IPC: F21V29/00

CPC classification number: F21V29/717 ,  F21K9/233 ,  F21V29/51 ,  F21V29/74 ,  F21V29/76 ,  F21V29/763 ,  F21V29/767 ,  F21V29/773 ,  F21V29/89 ,  F21Y2115/10

Abstract: An LED lamp has a metal housing, a heat pipe and an LED. The metal housing has an outer surface, an inner surface, a bottom and an opening defined by an inner edge. The heat pipe engages the inner surface, the bottom and the inner edge of the metal housing. The LED is attached to the bottom portion of the heat pipe. The heat pipe rapidly transports heat generated by the LED to the metal housing which then transfers heat to the environment. The heat pipe makes effective heat transportation possible and allows the use of high-power LEDs or multiple LED's within one lamp.

Abstract translation: LED灯具有金属外壳，热管和LED。 金属外壳具有由内边缘限定的外表面，内表面，底部和开口。 热管接合金属外壳的内表面，底部和内边缘。 LED连接到热管的底部。 热管将LED产生的热量快速传输到金属外壳，然后将热量传递给环境。 热管可以有效地传热，并允许在一个灯内使用大功率LED或多个LED。

公开(公告)号：US07581878B2

公开(公告)日：2009-09-01

申请号：US11317120

申请日：2005-12-22

Applicant: Ke-Chin Lee ,  Chen-Chuan Lin ,  Chi-Te Chin ,  Li-Kai Wu

Inventor： Ke-Chin Lee ,  Chen-Chuan Lin ,  Chi-Te Chin ,  Li-Kai Wu

IPC: G01N25/18 ,  G01N25/20 ,  G01K17/06

CPC classification number: G01N25/18

Abstract: The measuring system generates a temperature difference between a heating terminal and a terminal conductive device by setting the temperature of a metal heated block at the heating terminal and the temperature of a heat dissipating water jacket at a heat dissipating terminal, and judges the thermal conductive capability of the thermal conductive device by comparing the cooling speed of the metal heating bock to obtain a relative power value according to the variation of heat quantity of the metal heated block in practical temperature reduction process. The maximum thermal conductive quantity (Qmax value) of the thermal conductive device can be rapidly obtained by parameter conversion with respect to the maximum power value. In the case of confirming the cooling curve (cooling speed) of a standard sample, the object of screening the thermal conductive efficiencies of the thermal conductive devices can be achieved by using the cooling curve.

Abstract translation: 测量系统通过将加热端子处的金属加热块的温度和散热端子的散热水套的温度设定为加热端子和端子导电器件之间的温度差，并且判断导热能力 通过比较金属加热块的冷却速度，根据实际的温度降低过程中的金属加热块的热量的变化来获得相对功率值，导热装置。 可以通过相对于最大功率值的参数转换来快速获得导热装置的最大导热量（Qmax值）。 在确认标准样品的冷却曲线（冷却速度）的情况下，可以通过使用冷却曲线来实现对导热装置的导热效率进行筛选的目的。