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    TORSION-PROOF HOSE CONNECTION
    15.
    发明申请
    TORSION-PROOF HOSE CONNECTION 有权
    防扭软管连接

    公开(公告)号：US20100194100A1

    公开(公告)日：2010-08-05

    申请号：US12663035

    申请日：2008-06-02

    Applicant: Matthias Koch

    Inventor： Matthias Koch

    IPC: F16L33/20

    CPC classification number: F16L33/2076

    Abstract: A connecting device for connecting a hose in a fluid-conveying system including a nipple and a compression sleeve. The nipple has a rotation-symmetrical hose-receiving section and, at a distance therefrom, an anti-twist section that is configured in a non-circular manner, at least after a connection has been established between said hose and the nipple. The compression sleeve is configured to extend over the hose-receiving section and over the anti-twist section. The compression sleeve is further configured for a positive-locking engagement with respect to a relative rotation in the anti-twist section. The anti-twist section is configured as a non-circular deformation of at least part of the nipple. A method for establishing an anti-twist connection between a nipple and a hose using a compression sleeve is also disclosed.

    Abstract translation: 一种用于在包括乳头和压缩套筒的流体输送系统中连接软管的连接装置。 乳头具有旋转对称的软管接收部分，并且在距离其一定距离处，至少在所述软管和乳头之间建立连接之后，以非圆形方式构造的抗扭转部分。 压缩套筒构造成在软管接收部分上方并在防扭转部分上方延伸。 压缩套筒进一步构造成用于相对于防扭转部分中的相对旋转的正向锁定接合。 防扭部被构造成至少部分乳头的非圆形变形。 还公开了一种使用压缩套筒在乳头和软管之间建立防扭转连接的方法。

    Method and arrangement for producing a smart card
    16.
    发明授权
    Method and arrangement for producing a smart card 有权
    生产智能卡的方法和布置

    公开(公告)号：US07707706B2

    公开(公告)日：2010-05-04

    申请号：US11772096

    申请日：2007-06-29

    Applicant: Matthias Koch ,  Bernd Gebhardt

    Inventor： Matthias Koch ,  Bernd Gebhardt

    IPC: H01Q13/00 ,  H01Q1/28

    CPC classification number: H01L23/49855 ,  G06K19/07749 ,  G06K19/0775 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/45147 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2924/14 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49018 ,  Y10T29/49073 ,  Y10T29/49128 ,  Y10T29/4913 ,  H01L2924/00015 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A method is provided for producing a smart card comprising a chip module with at least one contacting area, the chip module arrangeable in a mounting location of a substrate, wherein one contacting loop is formed from a wire connector fed by a wire guiding unit for at least one of the contacting areas, respectively by attaching a first section of the wire conductor to a surface of the substrate outside the mounting location, wherein a second section of the wire conductor proximate to the first section is guided to form the contacting loop along with and protruding from the surface, wherein a subsequent third section of the wire conductor is attached to the surface outside the mounting location, wherein the chip module is inserted into the mounting location and wherein the second section is bent over and electrically contacted to the contacting area.

    Abstract translation: 提供了一种用于产生智能卡的方法，该智能卡包括具有至少一个接触区域的芯片模块，该芯片模块可布置在基板的安装位置，其中一个接触环由导线单元供电， 至少一个所述接触区域分别通过将所述导线导体的第一部分附接到所述基板的安装位置外部的表面，其中所述电线导体的靠近所述第一部分的第二部分被引导以形成所述接触环， 并且从所述表面突出，其中所述导线导体的后续第三部分附接到所述安装位置外部的表面，其中所述芯片模块插入所述安装位置，并且其中所述第二部分弯曲并与所述接触区域电接触 。

    RADIATION-CURABLE, ELECTRICALLY CONDUCTIVE COATIING MIXTURE
    19.
    发明申请
    RADIATION-CURABLE, ELECTRICALLY CONDUCTIVE COATIING MIXTURE 有权
    辐射可固化，导电性混合混合物

    公开(公告)号：US20070128365A1

    公开(公告)日：2007-06-07

    申请号：US11611812

    申请日：2006-12-15

    Applicant: Matthias Koch ,  Kerstin Unger ,  Wolfgang Lorenz ,  Andreas Kunz ,  Eva Wilke

    Inventor： Matthias Koch ,  Kerstin Unger ,  Wolfgang Lorenz ,  Andreas Kunz ,  Eva Wilke

    IPC: B05D3/00 ,  C08F2/46 ,  B32B15/08

    CPC classification number: C09D5/24 ,  C09D5/084 ,  Y10T428/12569

    Abstract: The present invention relates to electrically conductive and electrically weldable anti-corrosion compositions for coating metal surfaces, a process for coating metal surfaces with electrically conductive organic coatings, as well as the correspondingly coated and optionally painted metal strips, sheets or parts, the coatings comprising: an organic binder, an anti-corrosion pigment, at least one conductive pigment with a density of at least 3 g/cm3 and optionally at least one conductive pigment with a density of less than 3 g/cm3.

    Abstract translation: 本发明涉及用于涂覆金属表面的导电和可电焊接的防腐蚀组合物，用导电有机涂层涂覆金属表面的方法，以及相应地涂覆和任选涂漆的金属条，片或部分，所述涂层包括 ：有机粘合剂，防腐蚀颜料，至少一种密度为至少3g / cm 3的导电颜料和任选的至少一种导电颜料，密度小于3g / cm 3。

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