公开(公告)号：US08573188B2

公开(公告)日：2013-11-05

申请号：US12302634

申请日：2007-04-24

申请人： Mirko Braun ,  Michael Feil ,  Edwin Hartmann ,  Stefan Ruppel

发明人： Mirko Braun ,  Michael Feil ,  Edwin Hartmann ,  Stefan Ruppel

IPC分类号： F01M13/04 ,  B01D45/12

CPC分类号： F01M13/04 ,  B01D45/06 ,  B01D45/12 ,  F01M13/0416 ,  F01M2013/0433

摘要： The invention relates to a cylinder head (1) of an internal combustion engine, comprising at least one hollow camshaft (2) which forms an exhaust for blow-by gases containing oil mist from the crank housing and is also embodied as an oil mist pre fractionator for the preliminary separation of the oil part from these gases. Furthermore, an oil mist post-fractionator (5) is axially arranged on the end of the camshaft (2), in order to carry out an especially effective separation of oil dissolved in the blow-by gases.

摘要翻译： 本发明涉及一种内燃机的气缸盖（1），包括至少一个中空凸轮轴（2），其形成用于来自曲柄壳体的含有油雾的窜气的排气，并且还被实施为油雾预 分馏器用于从这些气体中预先分离油部分。 此外，在凸轮轴（2）的端部上轴向设置油雾后分馏器（5），以便特别有效地分离溶解在窜气中的油。

公开(公告)号：US20110100522A1

公开(公告)日：2011-05-05

申请号：US12925293

申请日：2010-10-18

申请人： Rainer Idler ,  Markus Schaefer ,  Michael Feil

发明人： Rainer Idler ,  Markus Schaefer ,  Michael Feil

IPC分类号： B32B37/10

CPC分类号： B30B11/06 ,  B22F3/004 ,  B22F3/03 ,  B30B15/304 ,  C22C26/00

摘要： A cold press and a method for the production of green compacts for diamond-containing tool segments, comprising a tool matrix and a top ram and a bottom ram assigned to a matrix adapter from opposite directions for the purpose of compressing sinterable metal powder and diamond granules after both of these materials have been fed to the matrix adapter is known.In the present invention, step-by-step build-up of the green compact is carried out in such a manner that after one layer of metal powder and one layer of diamond granulate have been charged, these layers are together compressed.The use thereof for producing diamond-containing cutting segments of saw blades for building machinery.

摘要翻译： 一种冷压机和用于生产含金刚石刀具段的生坯的方法，包括工具基体和顶部压头以及从相反方向分配给矩阵适配器的底部压头，用于压缩可烧结金属粉末和金刚石颗粒 在这两种材料都已经被馈送到矩阵适配器之后是已知的。 在本发明中，生坯的逐步构建以这样的方式进行，即在一层金属粉末和一层金刚石颗粒已经被充电之后，这些层被一起压缩。 其用于制造用于建筑机械的锯片的含金刚石切割段。

公开(公告)号：US20060048889A1

公开(公告)日：2006-03-09

申请号：US11088514

申请日：2005-03-24

申请人： Michael Feil ,  Martin Koenig

发明人： Michael Feil ,  Martin Koenig

IPC分类号： B29C65/00

CPC分类号： H01L24/83 ,  H01L23/49855 ,  H01L24/29 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/05599

摘要： In a method of connecting a chip and a substrate, an adhesive having conductive particles is initially provided. The chip and the substrate each include at least one pad on one appropriate side. The adhesive is applied onto one side of the substrate or onto one side of the chip, and the chip and the substrate are connected, the pads being aligned one below the other. Subsequently, this arrangement is pressurized such that in the region between the pads of the chip and the substrate, local compaction of the adhesive results, and the conductive particles adhere to the pads. Finally, the adhesive is hardened.

摘要翻译： 在连接芯片和基板的方法中，首先提供具有导电颗粒的粘合剂。 芯片和基板各自包括在一个适当侧面上的至少一个焊盘。 将粘合剂施加到基板的一侧或芯片的一侧上，并且将芯片和基板连接，焊盘一个接一个地对准。 随后，这种布置被加压，使得在芯片的衬垫和衬底之间的区域中，导致粘合剂的局部压实，并且导电颗粒粘附到衬垫上。 最后，粘合剂硬化。

公开(公告)号：US06756288B1

公开(公告)日：2004-06-29

申请号：US10019138

申请日：2002-06-03

申请人： Michael Feil ,  Christof Landesberger ,  Armin Klumpp ,  Erwin Hacker

发明人： Michael Feil ,  Christof Landesberger ,  Armin Klumpp ,  Erwin Hacker

IPC分类号： H01L21301

CPC分类号： H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2924/0002 ,  Y10T29/4979 ,  H01L2924/00

摘要： In a method of dicing a wafer, which comprises a plurality of individual circuit structures, a trench is first defined between at least two circuit structures on one face of the wafer. Subsequently, the trench is deepened down to a defined depth. Following this, one face of the wafer has fixed thereto a re-detachable intermediate support composed of a fixed intermediate support substrate and an adhesive medium which is applied to said intermediate support substrate and which can specifically be modified in terms of its adhesive strength, whereupon the wafer is dry-etched from the opposite face so that circuit chips are obtained which are connected to one another only via the intermediate support. Subsequently, the circuit chips are removed from the intermediate support. This method substantially reduces mechanical impairments that may occur during dicing of the circuit chips; on the one hand, this permits the production of circuit chips with a thickness of less than 50 &mgr;m and, on the other hand, it leads to mechanically substantially undamaged circuit chips.

摘要翻译： 在包括多个单独电路结构的晶片切割的方法中，首先在晶片的一个面上的至少两个电路结构之间限定沟槽。 随后，将沟槽加深到限定的深度。 此后，晶片的一个面固定有由固定的中间支撑基板和粘合剂介质组成的可再拆卸的中间支撑件，该中间支撑件施加到所述中间支撑基板上，并且可以根据其粘合强度具体地进行修改， 从相对面干蚀刻晶片，从而获得仅通过中间支撑件相互连接的电路芯片。 随后，将电路芯片从中间支撑件移除。 该方法基本上减少了在电路芯片切割期间可能发生的机械损伤; 一方面，这允许生产厚度小于50um的电路芯片，另一方面它导致机械上基本上未损坏的电路芯片。

公开(公告)号：US06444493B1

公开(公告)日：2002-09-03

申请号：US09857373

申请日：2001-09-21

申请人： Michael Feil ,  Christof Landesberger

发明人： Michael Feil ,  Christof Landesberger

IPC分类号： H01L2144

CPC分类号： H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06593 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/00

摘要： In a method for vertically integrating active circuit planes, a first substrate having at least one integrated circuit in a first main surface thereof and further having connecting areas for the integrated circuit as well as outer connecting areas on the first main surface is provided in a first step. A second substrate having at least one integrated circuit in a first main surface thereof and further having connecting areas for the integrated circuit as well as open or openable areas on the first main surface is provided. The first main surfaces of the first and second substrates are joined in such a way that the connecting areas of the first substrate are connected to those of the second substrate in an electrically conductive manner in such a way that the outer connecting areas of the first substrate are in alignment with the open or openable areas of the second substrate. Subsequently, the second substrate is thinned and the outer connecting areas are exposed through the open or openable areas. The resultant chips can be further processed making use of standard methods.

摘要翻译： 在用于垂直积分有源电路平面的方法中，在其第一主表面中具有至少一个集成电路并且还具有集成电路的连接区域以及第一主表面上的外连接区域的第一基板设置在第一 步。 第二基板在其第一主表面中具有至少一个集成电路，并且还具有用于集成电路的连接区域以及第一主表面上的打开或可打开区域。 第一和第二基板的第一主表面以这样的方式接合，使得第一基板的连接区域以导电方式连接到第二基板的连接区域，使得第一基板的外部连接区域 与第二基板的打开或可打开的区域对齐。 随后，第二基板变薄并且外部连接区域通过打开或可打开的区域露出。 所得到的芯片可以使用标准方法进一步加工。

公开(公告)号：US06365440B1

公开(公告)日：2002-04-02

申请号：US09786132

申请日：2001-07-16

申请人： Michael Feil

发明人： Michael Feil

IPC分类号： H01L2144

CPC分类号： G06K19/07752 ,  G06K19/07749 ,  H01L23/3185 ,  H01L23/485 ,  H01L24/24 ,  H01L24/32 ,  H01L24/82 ,  H01L2224/24051 ,  H01L2224/24225 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82007 ,  H01L2924/0102 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01075 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/19042 ,  H05K1/095 ,  H05K3/32 ,  H01L2924/00 ,  H01L2924/00012

摘要： In a method for contacting a circuit chip containing an integrated circuit of a thickness less than 50 &mgr;m, which has at least two pads on a first main surface, the circuit chip is first of all placed onto a main surface of a support substrate with a second main surface which faces this first main surface, in such a way that the entire thickness of the circuit chip protrudes from the surface of the support substrate. A structured metallic coating is then applied to the first main surface of the circuit chip and the surface of the support substrate by means of screen printing or stamping, in order to connect the pads of the circuit chip to a conductor structure located on the main surface of the support substrate. Alternatively, the screen printing or stamping process is used to apply a structured metallic coating to the first main surface of the circuit chip and the surface of the support substrate, in order to produce a peripheral conductor structure, which is connected to the pads of the circuit chip, on the main surface of the support substrate and on the first main surface of the circuit chip.

摘要翻译： 在包含厚度小于50um的集成电路的电路芯片的接触方法中，该电路芯片在第一主表面上具有至少两个焊盘，首先将电路芯片放置在支撑衬底的主表面上，其中 第二主表面面对该第一主表面，使得电路芯片的整个厚度从支撑基板的表面突出。 然后通过丝网印刷或冲压将结构化金属涂层施加到电路芯片的第一主表面和支撑基板的表面，以便将电路芯片的焊盘连接到位于主表面上的导体结构 的支撑基板。 或者，使用丝网印刷或冲压工艺将结构化金属涂层施加到电路芯片的第一主表面和支撑基板的表面，以便产生外围导体结构，该外围导体结构连接到 电路芯片，在支撑基板的主表面和电路芯片的第一主表面上。