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    Connector
    11.
    发明授权
    Connector 有权
    连接器

    公开(公告)号：US08025507B2

    公开(公告)日：2011-09-27

    申请号：US12473643

    申请日：2009-05-28

    Applicant: Ju Rae Kim ,  Jong Rak Kim ,  Min Jin Kim

    Inventor： Ju Rae Kim ,  Jong Rak Kim ,  Min Jin Kim

    IPC: H01R12/00 ,  H05K1/00

    CPC classification number: H01R13/2442 ,  H01R9/03 ,  H01R12/7052 ,  H01R12/7064

    Abstract: The present invention provides a connector including: a printed circuit board including a guide hole and a locking hole; a plurality of connection pads provided on a top surface of the printed circuit board; a housing which is mounted on the printed circuit board and including a guide inserted into the guide hole and a locking unit inserted into the locking hole, which are protrudingly formed on a bottom surface of the housing; a plurality of terminals inserted and fixed into the housing so that one ends are positioned inside the housing and the other ends are projected to an outside of the housing; and terminal units in contact with top surfaces of the connection pads by being connected to the one ends of the terminals inside the housing.

    Abstract translation: 本发明提供一种连接器，包括：印刷电路板，包括导向孔和锁定孔; 多个连接焊盘，设置在印刷电路板的顶表面上; 壳体，其安装在印刷电路板上并且包括插入到引导孔中的引导件和插入到锁定孔中的锁定单元，突出地形成在壳体的底表面上; 多个端子插入并固定到壳体中，使得一端位于壳体内部，另一端突出到壳体的外部; 以及端子单元，其通过连接到壳体内的端子的一端而与连接焊盘的顶表面接触。

    CONNECTOR
    12.
    发明申请
    CONNECTOR 有权
    连接器

    公开(公告)号：US20100255694A1

    公开(公告)日：2010-10-07

    申请号：US12473643

    申请日：2009-05-28

    Applicant: Ju Rae KIM ,  Jong Rak Kim ,  Min Jin Kim

    Inventor： Ju Rae KIM ,  Jong Rak Kim ,  Min Jin Kim

    IPC: H01R12/00

    CPC classification number: H01R13/2442 ,  H01R9/03 ,  H01R12/7052 ,  H01R12/7064

    Abstract: The present invention provides a connector including: a printed circuit board including a guide hole and a locking hole; a plurality of connection pads provided on a top surface of the printed circuit board; a housing which is mounted on the printed circuit board and including a guide inserted into the guide hole and a locking unit inserted into the locking hole, which are protrudingly formed on a bottom surface of the housing; a plurality of terminals inserted and fixed into the housing so that one ends are positioned inside the housing and the other ends are projected to an outside of the housing; and terminal units in contact with top surfaces of the connection pads by being connected to the one ends of the terminals inside the housing.

    Abstract translation: 本发明提供一种连接器，包括：印刷电路板，包括导向孔和锁定孔; 多个连接焊盘，设置在印刷电路板的顶表面上; 壳体，其安装在印刷电路板上并且包括插入到引导孔中的引导件和插入到锁定孔中的锁定单元，突出地形成在壳体的底表面上; 多个端子插入并固定到壳体中，使得一端位于壳体内部，另一端突出到壳体的外部; 以及端子单元，其通过连接到壳体内的端子的一端而与连接焊盘的顶表面接触。

    PLASMA DOPING METHODS USING MULTIPLE SOURCE GASES
    15.
    发明申请
    PLASMA DOPING METHODS USING MULTIPLE SOURCE GASES 审中-公开
    使用多种源气体的等离子体掺杂方法

    公开(公告)号：US20080176387A1

    公开(公告)日：2008-07-24

    申请号：US11753791

    申请日：2007-05-25

    Applicant: Jong-hoon Kang ,  Tai-su Park ,  Si-young Choi ,  Min-jin Kim

    Inventor： Jong-hoon Kang ,  Tai-su Park ,  Si-young Choi ,  Min-jin Kim

    IPC: H01L21/265

    CPC classification number: H01L21/2236 ,  H01L21/28035 ,  H01L21/3215 ,  H01L21/32155 ,  H01L29/4916

    Abstract: A plasma doping method includes providing a substrate including a layer to be doped inside a chamber, and supplying first and second source gases to the layer to achieve a desired doping concentration. The first source gas includes a component configured to increase a thickness of the layer, and the second gas includes a component configured to reduce a thickness of the layer.

    Abstract translation: 等离子体掺杂方法包括提供包括在室内掺杂的层的衬底，以及将第一和第二源气体供应到层以实现期望的掺杂浓度。 第一源气体包括构造成增加层的厚度的部件，并且第二气体包括构造成减小层的厚度的部件。

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