公开(公告)号：US07758168B2

公开(公告)日：2010-07-20

申请号：US11653371

申请日：2007-01-16

Applicant: Moon-chul Lee ,  Dong-sik Shim ,  Hyung Choi ,  Yong-seop Yoon

Inventor： Moon-chul Lee ,  Dong-sik Shim ,  Hyung Choi ,  Yong-seop Yoon

IPC: B41J2/05

CPC classification number: B41J2/1603 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1632 ,  B41J2/1639

Abstract: An inkjet printhead and a method of manufacturing the inkjet printhead. The inkjet printhead includes a substrate including a trench formed to a predetermined depth in an upper portion of the substrate and an ink feed hole formed through a bottom surface of the trench to supply ink, an etch stop layer formed of a metal and formed on an inner surface of the trench, a plurality of heaters, to create bubbles by heating ink, formed on the substrate, a plurality of electrodes, to apply a current to the plurality of heaters, formed on the substrate, a chamber layer stacked on the substrate and including a plurality of ink chambers formed above respective heaters to receive ink from the ink feed hole via the trench, and a nozzle layer stacked on the chamber layer and including a plurality of nozzles to eject ink from the plurality of ink chambers.

Abstract translation: 喷墨打印头和制造喷墨打印头的方法。 喷墨打印头包括基板，该基板包括在基板的上部形成为预定深度的沟槽，以及通过沟槽的底表面形成供墨的供墨孔，由金属形成的蚀刻停止层， 沟槽的内表面，多个加热器，通过加热形成在基板上的油墨产生气泡，多个电极，以形成在基板上的多个加热器施加电流，堆叠在基板上的室层 并且包括形成在各个加热器上方的多个墨室，以经由所述沟槽从所述供墨孔接收墨;以及喷嘴层，其堆叠在所述腔室层上并且包括多个喷嘴以从所述多个墨室喷射墨。

公开(公告)号：US07741105B2

公开(公告)日：2010-06-22

申请号：US11329240

申请日：2006-01-10

Applicant: Young-il Kim ,  Moon-chul Lee ,  Jung-ho Kang ,  Tae-sik Park

Inventor： Young-il Kim ,  Moon-chul Lee ,  Jung-ho Kang ,  Tae-sik Park

IPC: B81B7/04

CPC classification number: G01N33/544

Abstract: Disclosed is a biomolecule chip and a fabrication method thereof. The biomolecule chip of the invention includes: a substrate; an insulating layer formed on the substrate; an adhesive layer formed on the insulating layer; a seed layer formed on the adhesive layer; an opening patterned at a predetermined location within the adhesive layer, the seed layer and the electroplating layer; and a biomolecule immobilized layer formed on the electroplating layer, the electroplating layer comprising a plasma-treated electroplating layer prior to the formation of the biomolecule immobilized layer. Accordingly, the immobilization of biomolecules onto the surface can be done more effectively by modifying the surface of the substrate in favor of biomolecules.

Abstract translation: 公开了一种生物分子芯片及其制造方法。 本发明的生物分子芯片包括：基材; 形成在所述基板上的绝缘层; 形成在所述绝缘层上的粘合剂层; 形成在粘合剂层上的种子层; 在粘合剂层内的预定位置图案化的开口，种子层和电镀层; 以及形成在所述电镀层上的生物分子固定层，所述电镀层在形成所述生物分子固定化层之前包含等离子体处理的电镀层。 因此，通过改变基质表面有利于生物分子，可以更有效地进行生物分子固定在表面上。

公开(公告)号：US20100051580A1

公开(公告)日：2010-03-04

申请号：US12428808

申请日：2009-04-23

Applicant: Jong-Seok Kim ,  Yong-Seop Yoon ,  Moon-Chul Lee ,  Yong-Won Jeong ,  Dong-Sik Shim ,  Hyung Choi

Inventor： Jong-Seok Kim ,  Yong-Seop Yoon ,  Moon-Chul Lee ,  Yong-Won Jeong ,  Dong-Sik Shim ,  Hyung Choi

IPC: B44C1/22 ,  B41J2/015

CPC classification number: B41J2/1603 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2/1639

Abstract: A method of manufacturing an inkjet printhead includes forming a chamber layer having multiple ink chambers on a substrate. A sacrificial layer is formed and is configured to fill a space associated with the ink chambers on the chamber layer. A nozzle layer is formed on the top surfaces of the chamber layer and the sacrificial layer and having multiple nozzles. An etching mask is prepared on the bottom surface of the substrate. The etching mask has at least one linear etching pattern configured to define a portion of the substrate in which an ink feed hole is to be formed. The substrate is etched through the linear etching pattern until the sacrificial layer is exposed and a through hole is formed. The through hole defines the portion of the substrate in which the ink feed hole is to be formed. The sacrificial layer and the portion of the substrate surrounded by the through hole are removed to form the ink feed hole.

Abstract translation: 制造喷墨打印头的方法包括在基板上形成具有多个墨室的腔层。 牺牲层被形成并被配置成填充与腔室层上的墨水室相关联的空间。 喷嘴层形成在腔室层和牺牲层的顶表面上并且具有多个喷嘴。 在基板的底表面上制备蚀刻掩模。 蚀刻掩模具有至少一个线性蚀刻图案，其被配置为限定要在其中形成供墨孔的基板的一部分。 通过线性蚀刻图案蚀刻衬底，直到牺牲层被暴露并形成通孔。 通孔限定要在其中形成供墨孔的基板部分。 牺牲层和由通孔包围的基板的部分被去除以形成供墨孔。

公开(公告)号：US07510968B2

公开(公告)日：2009-03-31

申请号：US11412900

申请日：2006-04-28

Applicant: Moon-chul Lee ,  Jong-oh Kwon ,  Kae-dong Back ,  Qian Wang ,  Jun-sik Hwang ,  Kyu-dong Jung

Inventor： Moon-chul Lee ,  Jong-oh Kwon ,  Kae-dong Back ,  Qian Wang ,  Jun-sik Hwang ,  Kyu-dong Jung

IPC: H01L21/44

CPC classification number: B81C1/00301 ,  B81B2207/095 ,  H01L23/04 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/00

Abstract: A cap for a semiconductor device package, including a body formed at a predetermined thickness with a cavity. The cap further includes a first seed layer formed on an inner circumference of a first via hole formed at a predetermined depth from the cavity formation surface of the body, a second seed layer formed on an inner circumference of a second via hole formed at a predetermined depth from the opposite surface to the cavity formation surface of the body, and plating materials filled in the first via hole and the second via hole.

Abstract translation: 一种用于半导体器件封装的帽，包括以预定厚度形成有空腔的主体。 所述盖还包括形成在与所述主体的空腔形成表面形成在预定深度的第一通孔的内周上的第一籽晶层，形成在形成为预定的第二通孔的第二通孔的内周上的第二籽晶层 深度从主体的相对表面到空腔形成表面，以及填充在第一通孔和第二通孔中的电镀材料。

公开(公告)号：US20090001048A1

公开(公告)日：2009-01-01

申请号：US11935063

申请日：2007-11-05

Applicant: Yong-seop YOON ,  Hyung Choi ,  Moon-chul Lee ,  Yong-won Jeong ,  Dong-sik Shim

Inventor： Yong-seop YOON ,  Hyung Choi ,  Moon-chul Lee ,  Yong-won Jeong ,  Dong-sik Shim

IPC: G11B5/127

CPC classification number: B41J2/1404 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1639

Abstract: A method of manufacturing an inkjet printhead includes forming a chamber layer, in which a plurality of ink chambers is formed, on a substrate, forming trench to define an island surrounded by the trench on an upper part of the substrate by etching an upper surface of the substrate to a predetermined depth, forming a sacrifice layer on the chamber layer to fill the trenches and the ink chambers, forming a nozzle layer, in which a plurality of nozzles are formed, on the sacrifice layer and the chamber layer, forming an ink feed hole by etching a lower part of the substrate until the sacrifice layer that is filled in the trench is exposed, and removing the sacrifice layer and the island.

Abstract translation: 一种制造喷墨打印头的方法包括在衬底上形成一个腔层，其中形成有多个墨腔，形成沟槽，以在衬底的上部上刻蚀出由沟槽围绕的岛， 将所述基板设置到预定深度，在所述室层上形成牺牲层以填充所述沟槽和所述墨室，在所述牺牲层和所述室层上形成其中形成有多个喷嘴的喷嘴层，形成墨 通过蚀刻衬底的下部直到被填充在沟槽中的牺牲层被暴露并且去除牺牲层和岛，来进给孔。

公开(公告)号：US20080213966A1

公开(公告)日：2008-09-04

申请号：US12028420

申请日：2008-02-08

Applicant: Moon-chul LEE ,  Jong-oh Kwon ,  Woon-bae Kim ,  Jea-shik Shin ,  Jun-sik Hwang ,  Eun-sung Lee

Inventor： Moon-chul LEE ,  Jong-oh Kwon ,  Woon-bae Kim ,  Jea-shik Shin ,  Jun-sik Hwang ,  Eun-sung Lee

IPC: H01L21/62

CPC classification number: H01F17/0006 ,  H01F41/041 ,  H01F2017/0046 ,  H01L27/08 ,  Y10T29/4902 ,  Y10T29/4906 ,  Y10T29/49064 ,  Y10T29/49073 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: An inductor embedded in a substrate, including a substrate, a coil electrode formed by filling a metal in a spiral hole formed on the substrate, an insulation layer formed on the substrate, and an external connection pad formed on the insulation layer to be connected to the coil electrode. The inductor-embedded substrate can be used as a cap for a micro device package by forming a cavity on its bottom surface.

Abstract translation: 嵌入基板的电感器，包括基板，通过在形成在基板上的螺旋孔中填充金属而形成的线圈电极，形成在基板上的绝缘层，以及形成在绝缘层上的外部连接焊盘，以连接到 线圈电极。 电感器嵌入式基板可以通过在其底表面上形成空腔而用作微器件封装的帽。

公开(公告)号：US07417525B2

公开(公告)日：2008-08-26

申请号：US11416311

申请日：2006-05-03

Applicant: Moon Chul Lee ,  Jong Oh Kwon ,  Woon Bae Kim ,  Jun Sik Hwang ,  Chang youl Moon ,  In Sang Song

Inventor： Moon Chul Lee ,  Jong Oh Kwon ,  Woon Bae Kim ,  Jun Sik Hwang ,  Chang youl Moon ,  In Sang Song

IPC: H01F5/00 ,  H01F27/02

CPC classification number: H01F17/0033 ,  H01F41/041 ,  H01F2017/002 ,  H01L27/08 ,  H01L28/10

Abstract: An inductor is provided which includes a plurality of via holes vertically passing through a substrate, the substrate having insulating properties, vertical conductive portions filling the via holes, and horizontal conductive portions connecting each individual vertical conductive portions at the top and the bottom of the substrate to form a single coil structure with the vertical conductive portions.

Abstract translation: 提供一种电感器，其包括垂直通过基板的多个通孔，该基板具有绝缘性能，填充该通孔的垂直导电部分以及连接该基板顶部和底部上的各个垂直导电部分的水平导电部分 以形成具有垂直导电部分的单个线圈结构。

公开(公告)号：US20080128386A1

公开(公告)日：2008-06-05

申请号：US11838347

申请日：2007-08-14

Applicant: Yong-seop YOON ,  Hyung Choi ,  Moon-chul Lee ,  Yong-won Jeong ,  Dong-sik Shim

Inventor： Yong-seop YOON ,  Hyung Choi ,  Moon-chul Lee ,  Yong-won Jeong ,  Dong-sik Shim

IPC: G11B5/127

CPC classification number: B41J2/14129 ,  B41J2/1603 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1634 ,  B41J2/1639

Abstract: A method of manufacturing an inkjet printhead includes forming an insulating layer, heaters, and electrodes sequentially on a substrate, depositing a chamber layer having a plurality of ink chambers on the insulating layer, forming an ink feed hole in the substrate and the insulating layer to supply ink to the ink chambers, preparing a nozzle layer having a plurality of nozzles and an adhesive layer formed on a lower surface of the nozzle layer, and bonding the nozzle layer to the chamber layer.

Abstract translation: 一种喷墨打印头的制造方法，包括在基板上依次形成绝缘层，加热器和电极，在绝缘层上淀积具有多个墨室的腔室层，在基板和绝缘层上形成墨水供给孔 向油墨室供给油墨，制备具有多个喷嘴的喷嘴层和形成在喷嘴层的下表面上的粘合层，并将喷嘴层粘合到室层。

公开(公告)号：US20080106578A1

公开(公告)日：2008-05-08

申请号：US11742816

申请日：2007-05-01

Applicant: Dong-sik SHIM ,  Yong-seop Yoon ,  Moon-chul Lee ,  Yong-won Jeong ,  Hyung Choi

Inventor： Dong-sik SHIM ,  Yong-seop Yoon ,  Moon-chul Lee ,  Yong-won Jeong ,  Hyung Choi

IPC: B41J2/05

CPC classification number: B41J2/14129 ,  B41J2/14072

Abstract: A thermal inkjet printhead includes a plurality of bonding pads to which an external voltage is applied, a plurality of common wires connected to the each of the bonding pads, respectively, a plurality of individual wires connected to each of the common wires, respectively, and heaters connected to each of the individual wires, respectively, to generate ink bubbles by heating ink, wherein each of the common wires includes a first metal layer and a first metal bump which are formed on the first metal layer.

Abstract translation: 热喷墨打印头包括分别施加有外部电压的多个接合焊盘，分别连接到每个接合焊盘的多个公共电线，分别连接到每个公共电线的多个单独电线，以及 加热器分别连接到各个电线，以通过加热墨水来产生墨水气泡，其中每个公共电线包括形成在第一金属层上的第一金属层和第一金属凸块。

公开(公告)号：US20070096227A1

公开(公告)日：2007-05-03

申请号：US11415099

申请日：2006-05-02

Applicant: Ji-hyuk Lim ,  Jun-sik Hwang ,  Woon-bae Kim ,  Suk-jin Ham ,  Jong-oh Kwon ,  Moon-chul Lee ,  Chang-youl Moon

Inventor： Ji-hyuk Lim ,  Jun-sik Hwang ,  Woon-bae Kim ,  Suk-jin Ham ,  Jong-oh Kwon ,  Moon-chul Lee ,  Chang-youl Moon

IPC: H01L29/84

CPC classification number: H03H9/1092

Abstract: A wafer level package for a surface acoustic wave device and a fabrication method thereof include a SAW device formed with a SAW element on an upper surface of a device wafer; a cap wafer joined on an upper part of the SAW element; a cavity part housing the SAW element between the cap wafer and the SAW device; a cap pad formed on an upper surface of the cap wafer; and a metal line formed to penetrate through the cap wafer to electrically connect the cap pad and the SAW element, the device wafer and the cap wafer being made of the same materials.

Abstract translation: 用于声表面波器件的晶片级封装及其制造方法包括在器件晶片的上表面上形成有SAW元件的SAW器件; 接合在所述SAW元件的上部的盖晶片; 在所述盖晶片和所述SAW器件之间容纳所述SAW元件的空腔部; 帽盖，形成在盖晶片的上表面上; 以及金属线，其形成为穿透盖晶片以电连接帽垫和SAW元件，器件晶片和盖晶片由相同的材料制成。