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公开(公告)号：US11874185B2
公开(公告)日：2024-01-16
申请号：US16764992
申请日：2018-11-16
Applicant: NEXTINPUT, INC.
Inventor： Julius Minglin Tsai , Dan Benjamin
Abstract: Described herein is a force attenuator for a force sensor. The force attenuator can linearly attenuate the force applied on the force sensor and therefore significantly extend the maximum sensing range of the force sensor. The area ratio of the force attenuator to the force sensor determines the maximum load available in a linear fashion.
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公开(公告)号：US11808644B2
公开(公告)日：2023-11-07
申请号：US18081255
申请日：2022-12-14
Applicant: NEXTINPUT, Inc.
Inventor： Julius Minglin Tsai , Ryan Diestelhorst , Dan Benjamin
CPC classification number: G01L1/16 , G01L1/18 , G01L5/0028 , B81B3/0072
Abstract: Described herein is a ruggedized microelectromechanical (“MEMS”) force sensor including both piezoresistive and piezoelectric sensing elements and integrated with complementary metal-oxide-semiconductor (“CMOS”) circuitry on the same chip. The sensor employs piezoresistive strain gauges for static force and piezoelectric strain gauges for dynamic changes in force. Both piezoresistive and piezoelectric sensing elements are electrically connected to integrated circuits provided on the same substrate as the sensing elements. The integrated circuits can be configured to amplify, digitize, calibrate, store, and/or communicate force values electrical terminals to external circuitry.
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13.发明授权公开(公告)号：US11609131B2
公开(公告)日：2023-03-21
申请号：US17591706
申请日：2022-02-03
Applicant: NEXTINPUT, INC.
Inventor： Albert Bergemont , Julius Minglin Tsai
IPC: G01L1/16 , G01L1/18 , H01L41/113
Abstract: Described herein is a ruggedized microelectromechanical (“MEMS”) force sensor. The sensor employs piezoresistive or piezoelectric sensing elements for force sensing where the force is converted to strain and converted to electrical signal. In one aspect, both the piezoresistive and the piezoelectric sensing elements are formed on one substrate and later bonded to another substrate on which the integrated circuitry is formed. In another aspect, the piezoelectric sensing element is formed on one substrate and later bonded to another substrate on which both the piezoresistive sensing element and the integrated circuitry are formed.
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公开(公告)号：US20210285832A1
公开(公告)日：2021-09-16
申请号：US17215186
申请日：2021-03-29
Applicant: NextInput, Inc.
Inventor： Mehrnaz Rouhi Youssefi , Julius Minglin Tsai
Abstract: Described herein is a MEMS force sensor with stress concentration design. The stress concentration can be performed by providing slots, whether through or blind, and/or selective thinning of the substrate. The MEMS force sensor is in chip scale package with solder bumps or metal pillars and there are sensing elements formed on the sensor substrate at the stress concentrate area. The stress concentration can be realized through slots, selective thinning and a combination of both.
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公开(公告)号：US20210172813A1
公开(公告)日：2021-06-10
申请号：US16761373
申请日：2018-11-02
Applicant: NEXTINPUT, INC.
Inventor： Julius Minglin TSAI , Ryan DIESTELHORST , Dan BENJAMIN
Abstract: An example microelectromechanical system (MEMS) force sensor is described herein. The MEMS force sensor can include a sensor die configured to receive an applied force. The sensor die can include a first substrate and a second substrate, where a cavity is formed in the first substrate, and where at least a portion of the second substrate defines a deformable membrane. The MEMS force sensor can also include an etch stop layer arranged between the first substrate and the second substrate, and a sensing element arranged on a surface of the second substrate. The sensing element can be configured to convert a strain on the surface of the membrane substrate to an analog electrical signal that is proportional to the strain.
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Patent Agency Ranking
公开(公告)号：US10962427B2
公开(公告)日：2021-03-30
申请号：US16739687
申请日：2020-01-10
Applicant: NextInput, Inc.
Inventor： Mehrnaz Youssefi , Julius Minglin Tsai
Abstract: Described herein is a MEMS force sensor with stress concentration design. The stress concentration can be performed by providing slots, whether through or blind, and/or selective thinning of the substrate. The MEMS force sensor is in chip scale package with solder bumps or metal pillars and there are sensing elements formed on the sensor substrate at the stress concentrate area. The stress concentration can be realized through slots, selective thinning and a combination of both.
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公开(公告)号：US20200149983A1
公开(公告)日：2020-05-14
申请号：US16632795
申请日：2018-07-19
Applicant: NEXTINPUT, INC.
Inventor： Julius Minglin TSAI , Dan BENJAMIN
Abstract: Described herein is a ruggedized microelectromechanical (“MEMS”) force sensor including a sensor die and a strain transfer layer. The MEMS force sensor employs piezoresistive or piezoelectric strain gauges for strain sensing where the strain is transferred through the strain transfer layer, which is disposed on the top or bottom side of the sensor die. In the case of the top side strain transfer layer, the MEMS force sensor includes mechanical anchors. In the case of the bottom side strain transfer layer, the protection layer is added on the top side of the sensor die for bond wire protection.
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公开(公告)号：US20190383676A1
公开(公告)日：2019-12-19
申请号：US16485016
申请日：2018-02-09
Applicant: NEXTINPUT, INC.
Inventor： Ali Foughi , Ryan Diestelhorst , Dan Benjamin , Julius Minglin Tsai , Michael Dueweke
Abstract: Described herein is a ruggedized wafer level microelectromechanical (“MEMS”) force sensor including a base and a cap. The MEMS force sensor includes a flexible membrane and a sensing element. The sensing element is electrically connected to integrated complementary metal-oxide-semiconductor (“CMOS”) circuitry provided on the same substrate as the sensing element. The CMOS circuitry can be configured to amplify, digitize, calibrate, store, and/or communicate force values through electrical terminals to external circuitry.
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19.发明申请公开(公告)号：US20150138112A1
公开(公告)日：2015-05-21
申请号：US14536734
申请日：2014-11-10
Applicant: NextInput, Inc.
Inventor： Ian Campbell , Ryan Diestelhorst
CPC classification number: G06F3/0414 , G01L1/142 , G06F3/044 , G06F2203/04106 , Y10T29/4913
Abstract: An example force sensor module for a touch-sensitive electronic device can include a force sensor, a bias assembly and an opposing bias assembly that is coupled to the bias assembly. The bias assembly can have a top wall and a plurality of side walls extending from the top wall. The top and side walls can define a chamber. The force sensor can be arranged between the bias assembly and the opposing bias assembly within the chamber. Additionally, the bias and opposing bias assemblies can be configured to apply a preload force to the force sensor, which is approximately equal to a spring force exerted between the bias and opposing bias assemblies.
Abstract translation: 用于触敏电子设备的示例性力传感器模块可以包括力传感器，偏置组件和耦合到偏置组件的相对偏置组件。 偏置组件可以具有从顶壁延伸的顶壁和多个侧壁。 顶壁和侧壁可以限定一个室。 力传感器可以布置在偏压组件和腔室内的对置偏压组件之间。 另外，偏置和相对的偏置组件可以被配置为向力传感器施加预加载力，其大致等于施加在偏置组件和相对的偏置组件之间的弹簧力。
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公开(公告)号：US09032818B2
公开(公告)日：2015-05-19
申请号：US13934900
申请日：2013-07-03
Applicant: NextInput, Inc.
Inventor： Ian Campbell , Ryan Diestelhorst
CPC classification number: G01L1/18 , B81B3/0018 , B81C1/00134 , G01L1/148 , G01L1/26 , G01L5/162
Abstract: A microelectromechanical (“MEMS”) load sensor device for measuring a force applied by a human user is described herein. In one aspect, the load sensor device has a contact surface in communication with a touch surface which communicates forces originating on the touch surface to a deformable membrane, on which load sensor elements are arranged, such that the load sensor device produces a signal proportional to forces imparted by a human user along the touch surface. In another aspect, the load sensor device has an overload protection ring to protect the load sensor device from excessive forces. In another aspect, the load sensor device has embedded logic circuitry to allow a microcontroller to individually address load sensor devices organized into an array. In another aspect, the load sensor device has electrical and mechanical connectors such as solder bumps designed to minimize cost of final component manufacturing.
Abstract translation: 本文描述了用于测量人类用户施加的力的微机电（“MEMS”）负载传感器装置。 在一个方面，负载传感器装置具有与触摸表面连通的接触表面，该接触表面将起始于触摸表面的力连接到可变形膜上，负载传感器元件布置在其上，使得负载传感器装置产生与 由人类使用者沿着触摸表面施加的力。 在另一方面，负载传感器装置具有过载保护环以保护负载传感器装置免受过大的力。 在另一方面，负载传感器装置具有嵌入式逻辑电路，以允许微控制器分别地组织成阵列的负载传感器装置。 在另一方面，负载传感器装置具有电气和机械连接器，例如设计成最小化最终部件制造成本的焊料凸块。
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