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    Optical method and apparatus for inspecting large area planar objects
    12.
    发明授权
    Optical method and apparatus for inspecting large area planar objects 有权

    公开(公告)号：US06809809B2

    公开(公告)日：2004-10-26

    申请号：US10379016

    申请日：2003-03-04

    Applicant: Patrick D. Kinney ,  Anand Gupta ,  Nagaraja P. Rao

    Inventor： Patrick D. Kinney ,  Anand Gupta ,  Nagaraja P. Rao

    IPC: G01N2100

    CPC classification number: G01N21/9501

    Abstract: An optical inspection module is provided for detecting defects on a substrate having first and second opposite planar surfaces. The module includes a substrate holding position and first and second measurement instruments. The first instrument includes a first illumination path extending to the substrate holding position and having a grazing angle of incidence with the first surface, which illuminates substantially the entire first surface. A first optical element is oriented to collect non-specularly reflected light scattered by the first surface. A first photodetector has a plurality of pixels positioned within a focal plane of the first lens, which together form a field of view that covers substantially the entire first surface. The second instrument includes a sensor oriented for sensing a physical characteristic of the second surface when the substrate is held in the substrate holding position and the first surface is being illuminated.

    Method and apparatus for selectively marking a semiconductor wafer
    13.
    发明授权
    Method and apparatus for selectively marking a semiconductor wafer 失效
    用于选择性地标记半导体晶片的方法和装置

    公开(公告)号：US6122562A

    公开(公告)日：2000-09-19

    申请号：US850954

    申请日：1997-05-05

    Applicant: Patrick D. Kinney ,  Yuri Uritsky ,  Nagaraja Rao

    Inventor： Patrick D. Kinney ,  Yuri Uritsky ,  Nagaraja Rao

    IPC: H01L21/66 ,  G01Q30/02 ,  G01Q30/04 ,  G01Q60/00 ,  G01Q80/00 ,  G01Q90/00 ,  H01L21/00 ,  H01L21/02 ,  G06F19/00

    CPC classification number: H01L21/67282

    Abstract: A method and apparatus that accurately marks a wafer at selected locations such as a defect location on the surface of a wafer such that a wafer analysis system (e.g., SEM or AFM) may rapidly find the defect. The apparatus contains a wafer platen for retaining a wafer in a substantially horizontal orientation and a marking assembly mounted above the wafer platen. The marking assembly further contains an optical microscope and a marking head. In operation, a user locates a defect using the optical microscope and places a pattern of fiducial marks at a predetermined distance from the defect, e.g., four marks in a diamond pattern circumscribing the defect.

    Abstract translation: 精确地将晶片标记在晶片表面上的缺陷位置等选定位置的方法和装置，使得晶片分析系统（例如，SEM或AFM）可以快速找到缺陷。 该装置包括用于将晶片保持在基本水平的方向的晶片台板和安装在晶片台板上方的标记组件。 标记组件还包含光学显微镜和标记头。 在操作中，用户使用光学显微镜来定位缺陷，并将基准标记的图案放置在距离缺陷的预定距离处，例如限定在缺陷处的菱形图案中的四个标记。

    Method for aligning semiconductor wafer surface scans and identifying added and removed particles resulting from wafer handling or processing
    15.
    发明授权
    Method for aligning semiconductor wafer surface scans and identifying added and removed particles resulting from wafer handling or processing 失效
    用于对准半导体晶片表面扫描并识别由晶片处理或加工产生的添加和去除的颗粒的方法

    公开(公告)号：US5870187A

    公开(公告)日：1999-02-09

    申请号：US907589

    申请日：1997-08-08

    Applicant: Yuri Uritsky ,  Patrick D. Kinney ,  Man-Ping Cai

    Inventor： Yuri Uritsky ,  Patrick D. Kinney ,  Man-Ping Cai

    IPC: G01N21/95 ,  G01N21/00

    CPC classification number: G01N21/9501

    Abstract: An automated method for aligning wafer surface scan maps and locating defects such as particle contaminant distributions on a wafer surface. More specifically, the invention is an automated method for locating added and removed contaminants and other defects on a semiconductor wafer surface after the wafer has undergone wafer-handling and/or processing. A second data set of a second scan of a wafer surface is misalignment-corrected to a first coordinate system of a first scan of the wafer surface. Thereafter, a final match is made between a first data set of the first scan and the misalignment-corrected data of the second scan. Non-matching locations in the misalignment-corrected data of the second scan represent added defects on the surface of the wafer. Non-matching locations in the base data of the first scan represent removed defects from the surface of the wafer.

    Abstract translation: 用于对准晶片表面扫描图并定位诸如颗粒污染物分布在晶片表面上的缺陷的自动化方法。 更具体地，本发明是一种自动化方法，用于在晶片经过晶片处理和/或处理之后，在半导体晶片表面上定位添加和去除的污染物和其它缺陷。 晶片表面的第二次扫描的第二数据组对于晶片表面的第一次扫描的第一坐标系进行未对准校正。 此后，在第一扫描的第一数据集和第二扫描的未对准校正数据之间进行最终匹配。 第二扫描的未对准校正数据中的非匹配位置表示晶片表面上的附加缺陷。 第一次扫描的基础数据中的非匹配位置表示从晶片表面去除的缺陷。

    Methods, Software, and Apparatus for Focusing an Optical System Using Computer Image Analysis
    17.
    发明申请
    Methods, Software, and Apparatus for Focusing an Optical System Using Computer Image Analysis 审中-公开
    使用计算机图像分析聚焦光学系统的方法，软件和装置

    公开(公告)号：US20080285879A1

    公开(公告)日：2008-11-20

    申请号：US12166197

    申请日：2008-07-01

    Applicant: Patrick D. Kinney ,  Howard G. King ,  Michael C. Pallas ,  Mark Naley

    Inventor： Patrick D. Kinney ,  Howard G. King ,  Michael C. Pallas ,  Mark Naley

    IPC: G06K9/36

    CPC classification number: G02B21/244 ,  G02B7/38

    Abstract: Methods, software, and apparatus for focusing an image in biological instrument are disclosed. Focusing elements are moved to various focus positions within a focus element travel range, and sample images are captured at the various focus positions. The sample images are resolved into subregions and an optimal focus position is determined based on the image intensity statistical dispersions within the identified subregions.

    Abstract translation: 公开了用于将图像聚焦在生物仪器中的方法，软件和装置。 将聚焦元件移动到聚焦元件行进范围内的各个焦点位置，并且在各个焦点位置捕获采样图像。 样本图像被分解成次区域，并且基于所识别的子区域内的图像强度统计分散来确定最佳焦点位置。

    Optical inspection module and method for detecting particles and defects on substrates in integrated process tools
    18.
    发明授权
    Optical inspection module and method for detecting particles and defects on substrates in integrated process tools 失效
    用于检测集成工艺工具中基板上的颗粒和缺陷的光学检测模块和方法

    公开(公告)号：US5909276A

    公开(公告)日：1999-06-01

    申请号：US50267

    申请日：1998-03-30

    Applicant: Patrick D. Kinney ,  Nagaraja P. Rao

    Inventor： Patrick D. Kinney ,  Nagaraja P. Rao

    IPC: G01N21/956 ,  G01N21/94 ,  G06T1/00 ,  H01L21/66 ,  G01N21/00

    CPC classification number: G01N21/94 ,  G01N21/9501 ,  H01L22/12

    Abstract: An optical inspection module detects defects on an active surface of a substrate in an integrated process tool system. The optical inspection module includes an enclosure, a substrate holder, a light source, a light beam path, a lens and a photodetector array. The light source has a light beam port. The light beam path extends from the light beam port to the substrate holder and has a grazing angle of incidence with respect to the active surface of the substrate. The light beam path illuminates substantially the entire active surface. The lens is oriented to collect non-secularly reflected light scattered from the light beam path by any defects on the active surface. The photodetector array has a plurality of pixels which are positioned within a focal plane of the lens. Each pixel corresponds to an area on the active surface, and the plurality of pixels together form a field of view that covers substantially the entire active surface.

    Abstract translation: 光学检查模块检测集成处理工具系统中的基板的有效表面上的缺陷。 光学检查模块包括外壳，基板保持器，光源，光束路径，透镜和光电检测器阵列。 光源具有光束端口。 光束路径从光束端口延伸到衬底保持器，并且具有相对于衬底的有源表面的入射角。 光束路径基本上照亮整个有源表面。 该透镜被定向以从活性表面上的任何缺陷收集从光束路径散射的非长期反射光。 光电检测器阵列具有位于透镜的焦平面内的多个像素。 每个像素对应于有源表面上的区域，并且多个像素一起形成覆盖基本上整个有源表面的视场。

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