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公开(公告)号:US20090134118A1
公开(公告)日:2009-05-28
申请号:US12213699
申请日:2008-06-23
申请人: Dong-Jin Park , Seung-Hyun Jung , Seung-Chul Kim , Sooh-Jin Cho
发明人: Dong-Jin Park , Seung-Hyun Jung , Seung-Chul Kim , Sooh-Jin Cho
IPC分类号: H01B13/00
CPC分类号: H05K3/107 , H05K3/0035 , H05K3/0038 , H05K3/045 , H05K3/421 , H05K3/427 , H05K2201/0394 , H05K2201/09563 , H05K2203/025 , H05K2203/0723 , H05K2203/1152
摘要: A method of manufacturing a printed circuit board is disclosed. The method may include: stacking a cover layer over a copper foil, for a copper clad laminate that includes the copper foil stacked over one side of an insulation layer; forming an intaglio groove by removing portions of the cover layer and the copper clad laminate; stacking a seed layer over a surface of the intaglio groove and the cover layer; removing a portion of the seed layer stacked over the cover layer, by removing a portion of the cover layer; forming a plating layer, by plating an inside of the intaglio groove; and removing the remaining cover layer and the copper foil.
摘要翻译: 公开了一种制造印刷电路板的方法。 该方法可以包括:在铜箔上堆叠覆盖层,用于包括在绝缘层的一侧上堆叠的铜箔的覆铜层压板; 通过去除覆盖层和覆铜层压板的部分形成凹版凹槽; 将种子层堆叠在凹版凹槽和覆盖层的表面上; 通过去除覆盖层的一部分来去除层叠在覆盖层上的种子层的一部分; 通过电镀凹版凹槽的内部形成镀层; 并除去剩余的覆盖层和铜箔。