Method of manufacturing printed circuit board
    11.
    发明申请
    Method of manufacturing printed circuit board 审中-公开
    制造印刷电路板的方法

    公开(公告)号:US20090134118A1

    公开(公告)日:2009-05-28

    申请号:US12213699

    申请日:2008-06-23

    IPC分类号: H01B13/00

    摘要: A method of manufacturing a printed circuit board is disclosed. The method may include: stacking a cover layer over a copper foil, for a copper clad laminate that includes the copper foil stacked over one side of an insulation layer; forming an intaglio groove by removing portions of the cover layer and the copper clad laminate; stacking a seed layer over a surface of the intaglio groove and the cover layer; removing a portion of the seed layer stacked over the cover layer, by removing a portion of the cover layer; forming a plating layer, by plating an inside of the intaglio groove; and removing the remaining cover layer and the copper foil.

    摘要翻译: 公开了一种制造印刷电路板的方法。 该方法可以包括:在铜箔上堆叠覆盖层,用于包括在绝缘层的一侧上堆叠的铜箔的覆铜层压板; 通过去除覆盖层和覆铜层压板的部分形成凹版凹槽; 将种子层堆叠在凹版凹槽和覆盖层的表面上; 通过去除覆盖层的一部分来去除层叠在覆盖层上的种子层的一部分; 通过电镀凹版凹槽的内部形成镀层; 并除去剩余的覆盖层和铜箔。