Method of manufacturing printed circuit board
    1.
    发明申请
    Method of manufacturing printed circuit board 失效
    制造印刷电路板的方法

    公开(公告)号:US20090133253A1

    公开(公告)日:2009-05-28

    申请号:US12213365

    申请日:2008-06-18

    IPC分类号: H05K3/12 H01B13/00

    摘要: A method of manufacturing a printed circuit board is disclosed. The method may include: sequentially stacking an acid-resistant first cover layer and an alkali-resistant second cover layer over a copper foil, for a copper clad laminate that includes the copper foil stacked over one side of an insulation layer; forming an intaglio groove by removing portions of the second cover layer, the first cover layer, and the copper clad laminate; stacking a seed layer over the intaglio groove and the second cover layer; removing a portion of the seed layer stacked over the second cover layer, by stripping the second cover layer; forming a plating layer, by plating an inside of the intaglio groove; stripping the first cover layer; and removing the copper foil exposed by the stripping of the first cover layer.

    摘要翻译: 公开了一种制造印刷电路板的方法。 该方法可以包括:在铜箔上顺序层叠耐酸性第一覆盖层和耐碱性第二覆盖层,对于包含层叠在绝缘层一侧的铜箔的覆铜层压板, 通过去除第二覆盖层,第一覆盖层和覆铜层压板的部分来形成凹版凹槽; 将种子层堆叠在凹版凹槽和第二覆盖层上; 通过剥离所述第二覆盖层去除层叠在所述第二覆盖层上的所述种子层的一部分; 通过电镀凹版凹槽的内部形成镀层; 剥离第一覆盖层; 以及去除通过剥离第一覆盖层而暴露的铜箔。

    WATER CIRCULATION APPARATUS ASSOCIATED WITH REFRIGERANT SYSTEM
    2.
    发明申请
    WATER CIRCULATION APPARATUS ASSOCIATED WITH REFRIGERANT SYSTEM 审中-公开
    与制冷系统相关的水循环装置

    公开(公告)号:US20110138839A1

    公开(公告)日:2011-06-16

    申请号:US12899882

    申请日:2010-10-07

    IPC分类号: F25B13/00 F25D17/02 F25B1/00

    摘要: A water circulation apparatus performs a variety of heat exchange operations for various refrigerants. The apparatus may be applied for a first refrigerant system having a first compressor and first heat-exchanger and a second refrigerant system having a second compressor. An intermediate heat-exchanger performs heat-exchange operations between first and second refrigerants flowing in respective ones of the systems. A water circulator is then used to circulate water which is heat-exchanged with the second refrigerant while the water is circulated. The apparatus performs these functions for operating modes which include a heating mode and a cooling mode. Defrosting operations are also performed for one or more of the heat exchangers.

    摘要翻译: 水循环装置对各种制冷剂进行各种热交换操作。 该装置可以应用于具有第一压缩机和第一热交换器的第一制冷剂系统和具有第二压缩机的第二制冷剂系统。 中间热交换器在各个系统中流动的第一和第二制冷剂之间进行热交换操作。 然后使用水循环器循环与水循环时与第二制冷剂进行热交换的水。 该装置对包括加热模式和冷却模式的操作模式执行这些功能。 还对一个或多个热交换器进行除霜操作。

    Method of manufacturing printed circuit board
    5.
    发明申请
    Method of manufacturing printed circuit board 审中-公开
    制造印刷电路板的方法

    公开(公告)号:US20090136656A1

    公开(公告)日:2009-05-28

    申请号:US12213700

    申请日:2008-06-23

    IPC分类号: H05K3/02

    摘要: A method of manufacturing a printed circuit board is disclosed. The method may include: stacking an anti-plating layer over a copper foil, for a copper clad laminate that includes the copper foil stacked over one side of an insulation layer; forming an intaglio groove, by removing a portion of the anti-plating layer and a portion of the copper clad laminate; stacking a seed layer over a surface of the intaglio groove; forming a plating layer, by plating an inside of the intaglio groove; and removing the anti-plating layer and the copper foil.

    摘要翻译: 公开了一种制造印刷电路板的方法。 该方法可以包括:在铜箔上堆叠防镀层,对于包括层叠在绝缘层的一侧上的铜箔的覆铜层压板; 通过去除所述防镀层的一部分和所述覆铜层压板的一部分来形成凹版凹槽; 将种子层堆叠在凹版凹槽的表面上; 通过电镀凹版凹槽的内部形成镀层; 并且去除防镀层和铜箔。

    Method of manufacturing printed circuit board
    10.
    发明授权
    Method of manufacturing printed circuit board 失效
    制造印刷电路板的方法

    公开(公告)号:US08074352B2

    公开(公告)日:2011-12-13

    申请号:US12213365

    申请日:2008-06-18

    IPC分类号: H05K3/04 H05K3/06 H05K3/42

    摘要: A method of manufacturing a printed circuit board is disclosed. The method may include: sequentially stacking an acid-resistant first cover layer and an alkali-resistant second cover layer over a copper foil, for a copper clad laminate that includes the copper foil stacked over one side of an insulation layer; forming an intaglio groove by removing portions of the second cover layer, the first cover layer, and the copper clad laminate; stacking a seed layer over the intaglio groove and the second cover layer; removing a portion of the seed layer stacked over the second cover layer, by stripping the second cover layer; forming a plating layer, by plating an inside of the intaglio groove; stripping the first cover layer; and removing the copper foil exposed by the stripping of the first cover layer.

    摘要翻译: 公开了一种制造印刷电路板的方法。 该方法可以包括:在铜箔上顺序层叠耐酸性第一覆盖层和耐碱性第二覆盖层,对于包含层叠在绝缘层一侧的铜箔的覆铜层压板, 通过去除第二覆盖层,第一覆盖层和覆铜层压板的部分来形成凹版凹槽; 将种子层堆叠在凹版凹槽和第二覆盖层上; 通过剥离所述第二覆盖层去除层叠在所述第二覆盖层上的所述种子层的一部分; 通过电镀凹版凹槽的内部形成镀层; 剥离第一覆盖层; 以及去除通过剥离第一覆盖层而暴露的铜箔。