公开(公告)号：US20080157300A1

公开(公告)日：2008-07-03

申请号：US11672765

申请日：2007-02-08

申请人： Shih-Fang Chuang ,  Howard R. Test

发明人： Shih-Fang Chuang ,  Howard R. Test

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/3121 ,  H01L23/4334 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/92225 ,  H01L2924/18161

摘要： Methods for assembling thermally enhanced semiconductor device packages are disclosed in which a chip assembly has a chip affixed to a leadframe. A thermal pad is affixed to a surface of the chip, and the chip assembly is encapsulated whereby a surface of the thermal pad remains exposed to form at least a portion of a surface of the package favorable for the egress of heat from the chip. Also disclosed are thermally enhanced semiconductor device packages made using the methods of the invention.

摘要翻译： 公开了用于组装热增强型半导体器件封装的方法，其中芯片组件具有固定到引线框的芯片。 散热垫固定到芯片的表面，并且芯片组件被封装，由此热垫的表面保持暴露以形成有利于从芯片排出热量的封装表面的至少一部分。 还公开了使用本发明的方法制造的热增强型半导体器件封装。

公开(公告)号：US20050110168A1

公开(公告)日：2005-05-26

申请号：US10717731

申请日：2003-11-20

申请人： Shih-Fang Chuang

发明人： Shih-Fang Chuang

IPC分类号： H01L23/06 ,  H01L23/29 ,  H01L23/31 ,  H01L21/50

CPC分类号： H01L23/3128 ,  H01L23/06 ,  H01L23/295 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A low-CTE packaging material for assembling a semiconductor die into a package and a method for assembling a semiconductor die into a package, in which the packaging material comprises a negative-CTE material. The low-CTE packaging material in accordance with the embodiments of the invention may be a die attach material, a lid attach material, or an encapsulant, such as a mold compound or glob-top material. Preferably, the negative-CTE material is a tungstate compound, such as zirconium tungstate, halfnium tungstate or a solution of zirconium and halfnium tungstate.

摘要翻译： 用于将半导体管芯组装成封装的低CTE封装材料和将半导体管芯组装成封装的方法，其中包装材料包括负CTE材料。 根据本发明的实施例的低CTE包装材料可以是管芯附着材料，盖子附着材料或密封剂，例如模塑料或球形材料。 优选地，负CTE材料是钨酸盐化合物，例如钨酸锆，钨酸铪或锆和钨酸铯的溶液。