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76 条记录 (耗时 0.011 秒)

    Earphone
    15.
    外观设计
    Earphone 失效
    耳机

    公开(公告)号：USD485548S1

    公开(公告)日：2004-01-20

    申请号：US29174909

    申请日：2003-01-28

    申请人： Shinichi Obata

    设计人： Shinichi Obata

    Method for producing vias in the manufacture of printed circuit boards
    17.
    发明授权
    Method for producing vias in the manufacture of printed circuit boards 有权
    制造印刷电路板的通孔的制造方法

    公开(公告)号：US06240636B1

    公开(公告)日：2001-06-05

    申请号：US09281331

    申请日：1999-03-30

    申请人： Tsutomu Asai ,  Fujio Kuwako ,  Shinichi Obata

    发明人： Tsutomu Asai ,  Fujio Kuwako ,  Shinichi Obata

    IPC分类号： H01K310

    CPC分类号： H05K3/4652 ,  B23K26/389 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/025 ,  H05K3/064 ,  H05K3/108 ,  H05K2203/0353 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： In a process producing a multi-layer printed wiring board, an inner core having at least one wiring pattern on its surface and an outer layer of copper foil are laminated with an organic insulating layer interposed therebetween, a via hole is formed using a laser beam, and the outer copper foil and the inner wiring patterns are electrically connected to each other by depositing copper. The process is characterized in that the outer layer of copper foil has a thickness of no more than one-fifth of the thickness of the inner wiring pattern, but will not exceed 7 &mgr;m, preferably 4 &mgr;m. The hole is formed in both the copper foil and the insulating layer simultaneously by irradiating with a laser beam on the outer layer of copper foil.

    摘要翻译： 在制造多层印刷电路板的工艺中，在其表面上具有至少一个布线图案的内芯和铜箔的外层层叠有介于其间的有机绝缘层，使用激光束形成通孔 ，并且外部铜箔和内部布线图案通过沉积铜彼此电连接。 该方法的特征在于，铜箔的外层的厚度不超过内部布线图案厚度的五分之一，但不超过7μm，优选4μm。 通过在铜箔的外层上照射激光，同时在铜箔和绝缘层中形成孔。

    Manufacturing method of multilayer printed wiring board
    19.
    发明授权
    Manufacturing method of multilayer printed wiring board 有权
    多层印刷线路板的制造方法

    公开(公告)号：US09585261B2

    公开(公告)日：2017-02-28

    申请号：US14008034

    申请日：2012-03-29

    申请人： Ayumu Tateoka ,  Shinichi Obata ,  Toshiyuki Shimizu

    发明人： Ayumu Tateoka ,  Shinichi Obata ,  Toshiyuki Shimizu

    IPC分类号： H05K3/30 ,  H05K3/46 ,  H05K3/02

    CPC分类号： H05K3/4652 ,  H05K3/022 ,  H05K3/4658 ,  H05K3/4682 ,  Y10T29/49155

    摘要： A manufacturing method of a multilayer printed wiring board in which a copper foil with carrier foil consists of at least four layers, a carrier foil/a release layer/a heat-resistant metal layer/a copper foil layer is used; a supporting substrate is manufactured by laminating an insulating layer constituting material on the surface of the copper foil layer constituting the copper foil with carrier foil; a supporting substrate with build-up wiring layer is manufactured by forming a build-up wiring layer on the surface of the carrier foil constituting the copper foil with carrier foil in the supporting substrate; the resulted supporting substrate with build-up wiring layer is separated at the release layer to manufacture a multilayered laminate; the resulted multilayered laminate is processed a necessary procedures to manufacture a multilayer printed wiring board.

    摘要翻译： 具有载体箔的铜箔由至少四层构成的多层印刷电路板的制造方法，使用载体箔/剥离层/耐热金属层/铜箔层; 通过在构成铜箔的铜箔层的表面上与载体箔层叠绝缘层构成材料来制造支撑基板; 通过在支撑基板上通过载体箔在构成铜箔的载体箔的表面上形成积层布线层来制造具有堆积布线层的支撑基板; 所得到的具有积层布线层的支撑基底在剥离层处分离以制造多层层压体; 对所得到的多层层压体进行处理以制造多层印刷线路板的必要程序。

    MANUFACTURING METHOD OF MULTILAYER PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD OBTAINED BY THE MANUFACTURING METHOD
    20.
    发明申请
    MANUFACTURING METHOD OF MULTILAYER PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD OBTAINED BY THE MANUFACTURING METHOD 有权
    制造方法由多层印刷线路板和制造方法获得的多层印刷线路板的制造方法

    公开(公告)号：US20140096381A1

    公开(公告)日：2014-04-10

    申请号：US14008034

    申请日：2012-03-29

    申请人： Ayumu Tateoka ,  Shinichi Obata ,  Toshiyuki Shimizu

    发明人： Ayumu Tateoka ,  Shinichi Obata ,  Toshiyuki Shimizu

    IPC分类号： H05K3/46

    CPC分类号： H05K3/4652 ,  H05K3/022 ,  H05K3/4658 ,  H05K3/4682 ,  Y10T29/49155

    摘要： A manufacturing method of a multilayer printed wiring board in which a copper foil with carrier foil consists of at least four layers, a carrier foil/a release layer/a heat-resistant metal layer/a copper foil layer is used; a supporting substrate is manufactured by laminating an insulating layer constituting material on the surface of the copper foil layer constituting the copper foil with carrier foil; a supporting substrate with build-up wiring layer is manufactured by forming a build-up wiring layer on the surface of the carrier foil constituting the copper foil with carrier foil in the supporting substrate; the resulted supporting substrate with build-up wiring layer is separated at the release layer to manufacture a multilayered laminate; the resulted multilayered laminate is processed a necessary procedures to manufacture a multilayer printed wiring board.

    摘要翻译： 具有载体箔的铜箔由至少四层构成的多层印刷电路板的制造方法，使用载体箔/剥离层/耐热金属层/铜箔层; 通过在构成铜箔的铜箔层的表面上与载体箔层叠绝缘层构成材料来制造支撑基板; 通过在支撑基板上通过载体箔在构成铜箔的载体箔的表面上形成积层布线层来制造具有堆积布线层的支撑基板; 所得到的具有积层布线层的支撑基底在剥离层处分离以制造多层层压体; 对所得到的多层层压体进行处理以制造多层印刷线路板的必要程序。